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    MICROELECTROMECHANICAL SYSTEM PRESSURE SENSOR AND METHOD FOR MAKING AND USING
    71.
    发明申请
    MICROELECTROMECHANICAL SYSTEM PRESSURE SENSOR AND METHOD FOR MAKING AND USING 失效
    微电子系统压力传感器及其制造和使用方法

    公开(公告)号：US20070141808A1

    公开(公告)日：2007-06-21

    申请号：US11677629

    申请日：2007-02-22

    申请人： Jeffrey Fortin ,  Guanghua Wu ,  Kanakasabapathi Subramanian

    发明人： Jeffrey Fortin ,  Guanghua Wu ,  Kanakasabapathi Subramanian

    IPC分类号： H01L21/30 ,  H01L21/46

    CPC分类号： G01L9/0073 ,  G01L1/148

    摘要： According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be formed in the second wafer proximate to the cavity. The side of the conducting layer opposite the first wafer is bonded to the side of the insulating layer opposite the second wafer. At least some of the first wafer is then removed, without removing at least some of the conducting layer, to form a conducting diaphragm that is substantially parallel to the second wafer. In this way, an amount of capacitance between the diaphragm and the conducting area may be measured to determine an amount of pressure being applied to the diaphragm.

    摘要翻译： 根据一些实施例，在第一晶片上形成导电层。 在第二晶片上形成绝缘层。 绝缘层包括空腔，并且导电区域可以形成在靠近空腔的第二晶片中。 与第一晶片相对的导电层的一侧被结合到与第二晶片相对的绝缘层的一侧。 然后去除至少一些第一晶片，而不去除至少一些导电层，以形成基本上平行于第二晶片的导电隔膜。 以这种方式，可以测量隔膜和导电区域之间的电容量，以确定施加到隔膜的压力的量。

    Ignition device for a gas appliance and method of operation
    72.
    发明申请
    Ignition device for a gas appliance and method of operation 审中-公开
    燃气用具点火装置及其操作方法

    公开(公告)号：US20070128563A1

    公开(公告)日：2007-06-07

    申请号：US11296139

    申请日：2005-12-07

    申请人： Kanakasabapathi Subramanian ,  Richard Saia ,  Aaron Knobloch ,  Nicholas Okruch ,  David Najewicz

    发明人： Kanakasabapathi Subramanian ,  Richard Saia ,  Aaron Knobloch ,  Nicholas Okruch ,  David Najewicz

    IPC分类号： F23Q9/00 ,  F23Q9/08

    CPC分类号： H01C7/008 ,  H01C17/08

    摘要： An ignition device for a gas appliance is provided. The ignition device includes a membrane and a plurality of heating elements embedded in the membrane, wherein the heating elements comprise a plurality of patterned resistors and wherein the plurality of heating elements are configured to heat a surface on application of voltage through the heating elements. The ignition device also includes a cavity disposed adjacent to the heating elements and configured to provide thermal isolation of the heating elements.

    摘要翻译： 提供一种用于燃气器具的点火装置。 点火装置包括膜和嵌入在膜中的多个加热元件，其中加热元件包括多个图案化的电阻器，并且其中多个加热元件构造成通过加热元件施加电压来加热表面。 点火装置还包括邻近加热元件设置的空腔，并且构造成提供加热元件的热​​隔离。

    System and method for sensing differential pressure
    73.
    发明申请
    System and method for sensing differential pressure 有权
    用于感应差压的系统和方法

    公开(公告)号：US20070074578A1

    公开(公告)日：2007-04-05

    申请号：US11241049

    申请日：2005-09-30

    申请人： Kanakasabapathi Subramanian ,  Kuna Kishore ,  Parag Thakre ,  Russell Craddock ,  Peter Kinnell ,  John Greenwood

    发明人： Kanakasabapathi Subramanian ,  Kuna Kishore ,  Parag Thakre ,  Russell Craddock ,  Peter Kinnell ,  John Greenwood

    IPC分类号： G01L13/02

    CPC分类号： G01L9/0019

    摘要： A differential pressure sensing system is provided. The sensing system includes a membrane layer having a channel extending diametrically therein, and including one or more cavities provided radially outbound of the channel and at least one resonant beam disposed in the channel and configured to oscillate at a desired frequency. The system further includes sensing circuitry configured to detect oscillation of the at least one resonant beam indicative of deformation in the membrane layer.

    摘要翻译： 提供差压感测系统。 感测系统包括膜层，其具有在其中径向延伸的通道，并且包括设置在通道中径向出入的一个或多个空腔，以及设置在通道中并被配置为以期望频率振荡的至少一个谐振束。 该系统还包括感测电路，其被配置为检测指示膜层变形的至少一个谐振光束的振荡。

    Contact material, device including contact material, and method of making
    74.
    发明申请
    Contact material, device including contact material, and method of making 审中-公开
    接触材料，包括接触材料的装置和制造方法

    公开(公告)号：US20060274470A1

    公开(公告)日：2006-12-07

    申请号：US11480812

    申请日：2006-07-05

    申请人： Duraiswamy Srinivasan ,  Reed Corderman ,  Christopher Keimel ,  Somasundaram Gunasekaran ,  Sudhakar Reddy ,  Arun Gowda ,  Kanakasabapathi Subramanian

    发明人： Duraiswamy Srinivasan ,  Reed Corderman ,  Christopher Keimel ,  Somasundaram Gunasekaran ,  Sudhakar Reddy ,  Arun Gowda ,  Kanakasabapathi Subramanian

    IPC分类号： H02H5/04

    CPC分类号： A61B5/1112 ,  A61B5/0006 ,  A61B5/22 ,  A61B5/6807 ,  A61B5/6823 ,  A61B5/6824

    摘要： A device for controlling the flow of electric current is provided. The device comprises a first conductor; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575K.

    摘要翻译： 提供了一种用于控制电流流动的装置。 该装置包括第一导体; 第二导体，其可切换地耦合到所述第一导体，以在与所述第一导体的电连接状态与与所述第一导体的电断开状态之间交替。 至少一个导体还包括电接触，所述电接触包括包含多个孔的固体基质; 以及设置在所述多个孔的至少一部分中的填充材料。 填充材料的熔点小于约575K。 提供了形成电接触的方法。 该方法包括以下步骤：提供衬底; 在衬底上提供多个孔; 以及在所述多个孔的至少一部分内设置填充材料。 填充材料的熔点小于约575K。

    Microelectromechanical system pressure sensor and method for making and using
    76.
    发明申请
    Microelectromechanical system pressure sensor and method for making and using 失效

    公开(公告)号：US20060063354A1

    公开(公告)日：2006-03-23

    申请号：US10945399

    申请日：2004-09-20

    申请人： Jeffrey Fortin ,  Guanghua Wu ,  Kanakasabapathi Subramanian

    发明人： Jeffrey Fortin ,  Guanghua Wu ,  Kanakasabapathi Subramanian

    IPC分类号： H01L21/30

    CPC分类号： G01L9/0073 ,  G01L1/148

    摘要： According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be formed in the second wafer proximate to the cavity. The side of the conducting layer opposite the first wafer is bonded to the side of the insulating layer opposite the second wafer. At least some of the first wafer is then removed, without removing at least some of the conducting layer, to form a conducting diaphragm that is substantially parallel to the second wafer. In this way, an amount of capacitance between the diaphragm and the conducting area may be measured to determine an amount of pressure being applied to the diaphragm.