摘要:
A feedback control system for performing and controlling the laser alloying of a workpiece. The apparatus includes a laser beam delivery system, a movement system capable of causing relative movement between a laser beam and a workpiece being irradiated by the laser beam, a precursor application system capable of applying a precursor at a desired rate to the surface of a moving workpiece, and a control system capable of receiving input signals indicative of one or more measured process parameters, processing those signals, and transmitting a control signal capable of controlling the laser beam delivery system, movement system, and/or precursor application system. Other embodiments of the invention utilize a variety of process parameter measuring devices in conjunction with the control system. These devices include, but are not limited to, temperature transducers, infrared detectors, and emission spectra measuring devices.
摘要:
The laser apparatus according to the present invention comprises an output mirror for reflecting a portion of a laser beam and transmitting therethrough a remaining thereof; a full reflection mirror located at a position opposite to this output mirror for completely reflecting a laser beam and changing the curvature; a laser medium provided between the output mirror and the full reflection mirror for causing induced emission; an aperture means for deciding a beam mode of a laser beam generated between the output mirror and the full reflection mirror and changing the aperture diameter; and a converging means for converging an outgoing laser beam from the output mirror and changing a distance from the output mirror according to a machining path; and the laser apparatus changes a curvature of the full reflection mirror and also changes a diameter of the aperture means.
摘要:
A laser processing method establishes initial coupling between the laser beam and workpiece by irradiating an intermediate tool positioned adjacent the workpiece. The tool is more absorptive at the laser wavelength than the workpiece so that the efficiency of energy transfer is increased. Subsequent processing is performed by relative movement between the workpiece and beam, either independently of the tool or in conjunction with the tool. During further processing, the beam diameter is increased to be greater than the thickness of the workpiece to enhance the further processing.
摘要:
A laser processing arrangement includes a laser oscillator which outputs a laser beam. The laser beam path is established such that the beam reflects from a flat surfaced mirror to a concave mirror and then to a second concave mirror before irradiating a work piece under processing. The arrangement further includes a temperature sensor associated with a temperature detecting means. The temperature detecting means is connected to a control unit which controls moving means connected to movable axes of a processing surface in order to move the work piece relative the laser beam. The control unit is further effective to control the laser oscillator according to a desired temperature range for processing. The temperature sensor is preferably positioned within 45.degree. of the laser beam and the angle of incidence of the laser beam is selected so as to be smaller than a brewster angle of the material of the work piece.
摘要:
A laser materials processing system for computing a real time cooling rate experienced on a workpiece and responsively controlling the operation of a materials processing laser. An image of a point of laser beam-material interaction is transmitted via imaging optical fibers to ratio pyrometer apparatus which provides temperature proportional signals. The temperature signals are used to compute cooling rate.
摘要:
A beam monitor comprises a mirror for reflecting an incident beam of radiation to a target and for receiving a reflected beam from the target and has a surface on which the beams impinge. Incident and reflected beam channels are orthogonally disposed within the mirror. Each of the channels has an opening disposed in the surface for admitting the associated beam thereto. First and second detectors are operably associated with the mirror and each generates a signal indicative of a selected characteristic of the beam illuminating the associated channel. A controller compares the generated signals and thereby monitors at least one selected characteristic of the target or of the beam.
摘要:
A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow soldering utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.
摘要:
A process of and related apparatus for achieving laser annealing of film-like surface layers of chemical vapor deposited silicon nitride and silicon carbide to relieve their inherent residual stresses. A laser beam is used to anneal the layers, in conjunction with a photoacoustic gas cell and related beam modulating means for utilizing a photoacoustic effect principal for monitoring, detecting and effectuating beam control as needed during the laser annealing process.
摘要:
A processing machine includes a laser irradiation device that emits an annular laser beam, and a wire feeding device that feeds a wire from an inside of the annular laser beam. When a workpiece irradiation proportion parameter (WIP) represented by an equation WIP=Pwp/P (Pwp: laser beam power introduced onto a workpiece surface when the wire exists in an irradiation region of the laser beam, P: the laser beam power introduced onto the workpiece surface when the wire does not exist in the irradiation region) is defined, a control device controls the wire feeding device so that a wire end abuts on the workpiece surface at a beginning of additive manufacturing. The control device determines initial power P0 based on the WIP at the beginning of the additive manufacturing, and controls the laser irradiation device so that the workpiece is irradiated with the laser beam at the initial power P0.