公开(公告)号：US06541115B2

公开(公告)日：2003-04-01

申请号：US09793312

申请日：2001-02-26

申请人： David Charles Pender ,  Charles Dominic Iacovangelo ,  Mark Philip D'Evelyn ,  Steven Alfred Tysoe

发明人： David Charles Pender ,  Charles Dominic Iacovangelo ,  Mark Philip D'Evelyn ,  Steven Alfred Tysoe

IPC分类号： B32B900

CPC分类号： C04B41/009 ,  B22F2998/00 ,  C04B41/4584 ,  C04B41/5133 ,  C04B41/5144 ,  C04B41/52 ,  C04B41/81 ,  C04B41/88 ,  C04B41/89 ,  C22C26/00 ,  Y10T407/27 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/30 ,  Y10T428/31678 ,  C04B41/4523 ,  C04B41/4529 ,  C04B41/4535 ,  C04B41/5012 ,  C04B41/5116 ,  C04B35/52 ,  B22F7/02

摘要： A metal-infiltrated polycrystalline diamond composite tool comprising a plurality of diamond grains forming a continuous polycrystalline diamond matrix, a metallic phase being substantially palladium-free and contiguous to the continuous polycrystalline diamond matrix, wherein the metallic phase interpenetrates the continuous polycrystalline diamond matrix and substantially wets an outer surface of the continuous polycrystalline diamond matrix; and a working surface. The metallic phase is formed from an infiltrant and a wetting-enhancement layer disposed on the outer surfaces of the diamond particles, with both the infiltrant and wetting-enhancement layer being substantially palladium-free and comprising at least one metal from the group consisting of cobalt, iron, and nickel. The invention also includes a preform for a metal-infiltrated polycrystalline diamond composite tool, the perform comprising a container, a metallic infiltrant source, and a plurality of coated diamonds, each coated with a wetting-enhancement layer and, optionally, an activation layer, both of which are substantially palladium-free. Methods of forming the metal-infiltrated polycrystalline diamond composite tool, the preform, and the coated diamond particles used in the tool are also disclosed.

公开(公告)号：US20030049149A1

公开(公告)日：2003-03-13

申请号：US10260121

申请日：2002-09-27

申请人： The Regents of the University of California

发明人： Richard L. Landingham

IPC分类号： C22C032/00 ,  A61F002/28 ,  B22F007/00

CPC分类号： C04B41/009 ,  A61F2/28 ,  A61F2/30 ,  A61F2002/30968 ,  A61F2310/00185 ,  A61F2310/00191 ,  A61F2310/00203 ,  A61F2310/00251 ,  A61F2310/00263 ,  A61F2310/00299 ,  A61F2310/00311 ,  A61L27/427 ,  A61L31/128 ,  C04B41/5133 ,  C04B41/88 ,  C04B2111/00836 ,  C22C1/1036 ,  C22C2001/1021 ,  C04B41/4523 ,  C04B35/10 ,  C04B35/00 ,  C04B38/00

摘要： Cermet comprising ceramic and metal components and a molten metal infiltration method and process for fabrication thereof. The light weight cermets having improved porosity, strength, durability, toughness, elasticity fabricated from presintered ceramic powder infiltrated with a molten metal or metal alloy. Alumina titanium cermets biocompatible with the human body suitable for bone and joint replacements.

摘要翻译： 包括陶瓷和金属组分的金属陶瓷和熔融金属浸渗方法及其制造方法。 轻质金属陶瓷具有改善的孔隙率，强度，耐久性，韧性，由熔融金属或金属合金渗透的预烧结陶瓷粉末制成的弹性。 氧化铝钛金属陶瓷与人体生物相容适合于骨和关节置换。

公开(公告)号：US06506481B2

公开(公告)日：2003-01-14

申请号：US09769751

申请日：2001-01-26

申请人： Yusuke Makino ,  Tsuneaki Takashima

发明人： Yusuke Makino ,  Tsuneaki Takashima

IPC分类号： B32B300

CPC分类号： H01H33/66207 ,  B32B2311/12 ,  B32B2311/22 ,  B32B2311/30 ,  C04B37/006 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5133 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C04B2235/3418 ,  C04B2235/6582 ,  C04B2235/72 ,  C04B2235/76 ,  C04B2235/96 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/404 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  H01H33/66261 ,  H01H2033/66215 ,  H01H2033/66276 ,  Y10T428/24926 ,  C04B41/4539 ,  C04B41/5144 ,  C04B41/515 ,  C04B41/4564 ,  C04B41/5127 ,  C04B35/10

摘要： A ceramic member for bonding comprises: a ceramic base which is a sintered ceramic; and a metallic layer formed on the ceramic base by metallization, wherein the metallic layer comprises 70 to 85% by weight of at least one of tungsten and molybdenum and 0.5 to 8.5% by weight of nickel.

摘要翻译： 用于粘合的陶瓷构件包括：作为烧结陶瓷的陶瓷基体; 以及通过金属化形成在所述陶瓷基体上的金属层，其中所述金属层包含70〜85重量％的钨和钼中的至少一种以及0.5〜8.5重量％的镍。

公开(公告)号：US06475924B2

公开(公告)日：2002-11-05

申请号：US09838089

申请日：2001-04-18

申请人： Reo Yamamoto ,  Yoshihiko Numata ,  Yuichiro Minabe ,  Mitsutoshi Hikasa

发明人： Reo Yamamoto ,  Yoshihiko Numata ,  Yuichiro Minabe ,  Mitsutoshi Hikasa

IPC分类号： H01L21469

CPC分类号： C04B41/009 ,  B32B18/00 ,  C04B35/581 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B41/5133 ,  C04B41/88 ,  C04B2111/00465 ,  C04B2111/00844 ,  C04B2235/6567 ,  C04B2235/661 ,  C04B2235/666 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/403 ,  C04B2237/52 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/74 ,  H01L21/4807 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/4061 ,  C04B41/4578 ,  C04B41/5063 ,  H01L2924/00

摘要： The present invention produces the following substrate and the following process for producing the substrate. A substrate obtained by filling through holes in a sintered product of aluminum nitride with an electrically conducting layer, wherein said sintered product of aluminum nitride has a thermal conductivity of not smaller than 190 W/mK, and the adhesion strength between said sintered product of aluminum nitride and said electrically conducting layer is not smaller than 5.0 kg/mm2. A process for producing the substrate comprises: filling the through holes in a molded article of aluminum nitride comprising an aluminum nitride powder, a sintering assistant and an organic binder, with an electrically conducting paste comprising 100 parts by weight of a refractory metal powder and 2 to 10 parts by weight of an aluminum nitride powder; dewaxing the molded article of aluminum nitride so that the content of residual carbon therein is within a range of from 800 to 3000 ppm; and firing the molded article of aluminum nitride at a temperature of from 1200 to 1700° C. and, then, at a temperature of from 1800 to 1950° C.

摘要翻译： 本发明产生以下基板和以下用于制造基板的方法。 通过将氮化铝烧结体中的空穴填充到导电层而获得的基板，其中，所述氮化铝烧结体的热导率为190W / mK以上，所述铝的烧结体 氮化物和所述导电层不小于5.0kg / mm 2。 一种生产该基材的方法，包括：将包含氮化铝粉末，烧结助剂和有机粘合剂的氮化铝成型体中的通孔用包含100重量份的难熔金属粉末和2个 至10重量份的氮化铝粉末;将模制品的氮化铝脱蜡，使其中残留碳的含量在800至3000ppm的范围内; 并在1200至1700℃的温度下，然后在1800至1950℃的温度下烧制氮化铝的模塑制品。

公开(公告)号：US20020158328A1

公开(公告)日：2002-10-31

申请号：US09926800

申请日：2002-03-19

发明人： Yasuji Hiramatsu ,  Yasutaka Ito

IPC分类号： H01L023/053

CPC分类号： C04B41/88 ,  C04B41/009 ,  C04B41/5057 ,  C04B41/51 ,  C04B41/5116 ,  C04B41/87 ,  C04B2111/00844 ,  H01L21/6833 ,  Y10T428/24917 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/4578 ,  C04B35/581

摘要： The objective of the invention is to provide a ceramic substrate: wherein even if rapid temperature rising or rapid temperature falling is conducted, no problem of cracking or warp of the ceramic substrate occurs; wherein, in case that the ceramic substrate is a ceramic substrate constituting an electrostatic chuck, local dispersion of chuck power is eliminated, in case that the ceramic substrate is a ceramic substrate constituting a hot plate, local dispersion of temperature of a wafer treating face is eliminated, in case that the ceramic substrate is a ceramic substrate constituting a wafer prober, dispersion of applied voltage of a guard electrode or a ground electrode is eliminated and a stray capacitor or noise can be eliminated. The ceramic substrate of the present invention is a ceramic substrate provided with a conductor layer on the surface of the ceramic substrate or inside the ceramic substrate, wherein: the ratio (t2/t1) of the average thickness of the conductor layer (t2) to the average thickness of the ceramic substrate (t1) is less than 0.1 and; a dispersion of the thickness of the conductor layer to the average thickness of the conductor layer is in a range of null70 to null150%.

摘要翻译： 本发明的目的是提供一种陶瓷基板：其中，即使进行快速升温或快速降温，也不会发生陶瓷基板的开裂或翘曲的问题; 其中，在陶瓷基板是构成静电卡盘的陶瓷基板的情况下，消除了卡盘功率的局部分散，在陶瓷基板为构成热板的陶瓷基板的情况下，晶片处理面的温度的局部分散为 在陶瓷基板是构成晶片探测器的陶瓷基板的情况下，消除了保护电极或接地电极的施加电压的分散，并且可以消除杂散电容器或噪声。 本发明的陶瓷基板是在陶瓷基板的表面或陶瓷基板的内部具有导体层的陶瓷基板，其中：导体层（t2）的平均厚度（t2）与 陶瓷基板的平均厚度（t1）小于0.1， 导体层的厚度相对于导体层的平均厚度的分散在-70〜+ 150％的范围内。

公开(公告)号：US20020119303A1

公开(公告)日：2002-08-29

申请号：US09793312

申请日：2001-02-26

申请人： General Electric Company

发明人： David Charles Pender ,  Charles Dominic Iacovangelo ,  Mark Philip D'Evelyn ,  Steven Alfred Tysoe

IPC分类号： B32B015/04

CPC分类号： C04B41/009 ,  B22F2998/00 ,  C04B41/4584 ,  C04B41/5133 ,  C04B41/5144 ,  C04B41/52 ,  C04B41/81 ,  C04B41/88 ,  C04B41/89 ,  C22C26/00 ,  Y10T407/27 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/30 ,  Y10T428/31678 ,  C04B41/4523 ,  C04B41/4529 ,  C04B41/4535 ,  C04B41/5012 ,  C04B41/5116 ,  C04B35/52 ,  B22F7/02

摘要： A metal-infiltrated polycrystalline diamond composite tool comprising a plurality of diamond grains forming a continuous polycrystalline diamond matrix, a metallic phase being substantially palladium-free and contiguous to the continuous polycrystalline diamond matrix, wherein the metallic phase interpenetrates the continuous polycrystalline diamond matrix and substantially wets an outer surface of the continuous polycrystalline diamond matrix; and a working surface. The metallic phase is formed from an infiltrant and a wetting-enhancement layer disposed on the outer surfaces of the diamond particles, with both the infiltrant and wetting-enhancement layer being substantially palladium-free and comprising at least one metal from the group consisting of cobalt, iron, and nickel. The invention also includes a preform for a metal-infiltrated polycrystalline diamond composite tool, the perform comprising a container, a metallic infiltrant source, and a plurality of coated diamonds, each coated with a wetting-enhancement layer and, optionally, an activation layer, both of which are substantially palladium-free. Methods of forming the metal-infiltrated polycrystalline diamond composite tool, the preform, and the coated diamond particles used in the tool are also disclosed.

摘要翻译： 金属渗透的多晶金刚石复合工具，其包括形成连续多晶金刚石基体的多个金刚石晶粒，金属相基本上无钯且与连续多晶金刚石基体相邻，其中金属相互穿连续多晶金刚石基体， 润湿连续多晶金刚石基体的外表面; 和工作面。 金属相由设置在金刚石颗粒的外表面上的浸润剂和润湿增强层形成，浸润剂和润湿增强层基本上不含钯，并且包含至少一种由钴组成的组的金属 ，铁和镍。 本发明还包括用于金属渗透的多晶金刚石复合材料工具的预成型件，其特征包括容器，金属渗透源和多个涂覆的金刚石，每个被涂覆有润湿增强层和任选的活化层， 两者都基本上不含钯。 还公开了形成金属渗透的多晶金刚石复合材料工具的方法，预制件和用于工具中的涂覆的金刚石颗粒。

公开(公告)号：US20020106577A1

公开(公告)日：2002-08-08

申请号：US09998354

申请日：2001-11-30

申请人： Murata Manufacturing Co., Ltd.

发明人： Masahiro Kubota

IPC分类号： G03F007/012 ,  G03F007/022 ,  G03F007/033 ,  G03F007/34 ,  G03F007/40

CPC分类号： H05K3/02 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C04B2111/00844 ,  G03F7/0047 ,  G03F7/40 ,  H05K1/092 ,  H05K3/4629 ,  H05K2203/0514 ,  Y10S430/111 ,  Y10T428/24917 ,  C04B35/00 ,  C04B35/10 ,  C04B41/0045 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5188

摘要： Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 nullm from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.

摘要翻译： 本发明提供一种能够形成对基板具有高粘附性的细铜铜图案的光敏铜浆料，并且具有优异的保存稳定性而不引起凝胶化，以及使用以下方法形成铜图案，电路板和陶瓷多层基板的方法： 感光铜浆。 感光性铜糊包括具有酸官能团的有机粘合剂，铜粉末和感光性有机成分的混合物。 铜粉末具有从作为主要成分的CuO的表面至少0.1μm的厚度的表面层。 铜粉还具有约0.8重量％至5重量％的氧含量。

公开(公告)号：US06310755B1

公开(公告)日：2001-10-30

申请号：US09307215

申请日：1999-05-07

申请人： Arnold Kholodenko ,  Shamouil Shamouilian ,  You Wang ,  Wing L. Cheng ,  Alexander M. Veytser ,  Surinder S. Bedi ,  Kadthala R. Narendrnath ,  Semyon L. Kats ,  Dennis S. Grimard ,  Ananda H. Kumar

发明人： Arnold Kholodenko ,  Shamouil Shamouilian ,  You Wang ,  Wing L. Cheng ,  Alexander M. Veytser ,  Surinder S. Bedi ,  Kadthala R. Narendrnath ,  Semyon L. Kats ,  Dennis S. Grimard ,  Ananda H. Kumar

IPC分类号： H01G2300

CPC分类号： C04B35/565 ,  C04B35/185 ,  C04B35/806 ,  C04B37/006 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2235/402 ,  C04B2235/5248 ,  C04B2235/616 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/121 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/405 ,  C04B2237/60 ,  C22C29/00 ,  C22C2204/00 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  C04B38/00 ,  C04B41/4523

摘要： An electrostatic chuck 55 has an electrostatic member 100 including a dielectric 115 having a surface 120 adapted to receive the substrate 30. The dielectric 115 covers an electrode 105 that is chargeable to electrostatically hold the substrate 30. A support 190 below the electrostatic member 100 has a cavity 300 adapted to hold a gas to serve as a thermal insulator to regulate the flow of heat from the electrostatic chuck 55 to a surface 120 of the chamber 25. The cavity 300 has a cross-sectional profile that is shaped to provide a predetermined temperature profile across the substrate 30.

摘要翻译： 静电吸盘55具有静电构件100，静电构件100包括具有适于接纳衬底30的表面120的电介质115.电介质115覆盖电极105，电极105可充电以静电保持衬底30.静电构件100下方的支撑件190具有 空腔300适于保持气体以用作热绝缘体，以调节从静电卡盘55到腔室25的表面120的热量流动。空腔300具有截面轮廓，其形状设置成提供预定的 跨越衬底30的温度分布。

公开(公告)号：US06306528B1

公开(公告)日：2001-10-23

申请号：US09311812

申请日：1999-05-13

申请人： Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

发明人： Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

IPC分类号： B32B1800

CPC分类号： C04B41/009 ,  C04B41/5133 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  Y10T428/265 ,  C04B41/4539 ,  C04B41/4556 ,  C04B41/4578 ,  C04B41/5032 ,  C04B41/526 ,  C04B35/581 ,  H01L2924/00

摘要： Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

摘要翻译： 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。 在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。

公开(公告)号：US20010026838A1

公开(公告)日：2001-10-04

申请号：US09873979

申请日：2001-06-01

申请人： ENGELHARD CORPORATION

发明人： Joseph C. Dettling ,  Victor Rosynsky ,  Chung-Zong Wan

IPC分类号： B05D007/22

CPC分类号： B01J23/63 ,  B01J35/0006 ,  B01J35/04 ,  B01J37/0215 ,  B05D3/0493 ,  B05D7/22 ,  C04B41/009 ,  C04B41/4535 ,  C04B41/5105 ,  C04B41/81 ,  C04B41/88 ,  C04B2111/0081 ,  C23C2/006 ,  C23C2/28 ,  C23C10/04 ,  C23C10/18 ,  C23C10/26 ,  C23C26/00 ,  Y02T50/67 ,  Y02T50/6765 ,  C04B41/457 ,  C04B35/00 ,  C04B38/0006

摘要： The present invention is directed to a substrate, such as a honeycomb having a plurality of parallel channels defined by the honeycomb walls. The honeycomb has different zones along the length of the channels. The zones are defined by their coating (or lack of coating) and extend for a length of the channel in which there is the same coating and architecture. Soluble components in coating compositions are fixed in their respective zones.

摘要翻译： 本发明涉及一种基底，例如具有由蜂窝壁限定的多个平行通道的蜂窝体。 蜂窝具有沿通道长度的不同区域。 这些区域由它们的涂层（或不含涂层）限定，并延伸一段具有相同涂层和结构的通道的长度。 涂料组合物中的可溶组分固定在它们各自的区域中。