Abstract:
In one embodiment, a surface inspection system comprises a radiation directing assembly to target radiation onto a surface of an object, the radiation directing assembly comprising a radiation source that emits a broadband radiation beam, a polarization control assembly comprising at least one of a linear polarizer and an apochromatic retarder, an aperture control mechanism, and a beam splitter, a radiation collection assembly to collect radiation reflected from the surface of the object, the radiation collection assembly comprising, a polarization control assembly comprising at least one of a linear polarizer and an apochromatic retarder, an aperture control mechanism, and at least one radiation sensing device.
Abstract:
A pattern inspection method and apparatus in which a deep ultraviolet light or an ultraviolet light is irradiated onto a specimen on which a pattern is formed, an image of the specimen which is irradiated with the deep ultraviolet light or the ultraviolet light is formed and the formed image is detected with a rear-surface irradiation type image sensor, which is sensitive to wavelengths of no greater than 400 nmm. A signal outputted from the image sensor is processed so as to detect a defect of the specimen by converting an analog image signal outputted from the image sensor to a digital image signal with an A/D converter, and a display displays information of the defect detected.
Abstract:
Computer-implemented methods for detecting defects in reticle design data are provided. One method includes generating a first simulated image illustrating how the reticle design data will be printed on a reticle using a reticle manufacturing process. The method also includes generating second simulated images using the first simulated image. The second simulated images illustrate how the reticle will be printed on a wafer at different values of one or more parameters of a wafer printing process. The method further includes detecting defects in the reticle design data using the second simulated images. Another method includes the generating steps described above in addition to determining a rate of change in a characteristic of the second simulated images as a function of the different values. This method also includes detecting defects in the reticle design data based on the rate of change.
Abstract:
The invention provides a height detecting apparatus for a lithographic apparatus. The height mapping apparatus includes a height mapping unit for providing at least one height map of a top surface of an object to be placed in a radiation beam of the lithographic apparatus, the object to be clamped by a clamping force applied thereto on a support constructed to support the object. The height mapping apparatus also includes a control unit for controlling the mapping unit to provide the at least one height map of the object relative to at least two different clamping pressure levels.
Abstract:
An image correction device for use in pattern inspection apparatus is disclosed. This device includes a pattern extraction unit for extracting a pattern, as a cut-and-paste pattern, from a pattern existence region of an inspection reference pattern image and a pattern image of a workpiece being tested. The device also includes a pattern pasting unit for pasting the cut-and-paste pattern in blank regions of the reference and under-test pattern images to thereby create a pasted reference pattern image and a pasted test pattern image. The device further includes an equation generator for generating by linear predictive modeling a set of simultaneous equations relative to the pasted reference and test pattern images, a parameter generator for solving these equations to obtain a model parameter(s), and a unit for creating a corrected pattern image by the linear predictive modeling using the model parameter(s).
Abstract:
The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated.
Abstract:
Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.
Abstract:
A method for patterning a substrate is provided, which comprises (a) providing a substrate; (b) applying a first layer comprising a first photo resist to the substrate; (c) applying a second layer comprising a second photo resist over the first layer; (d) patterning the second layer; and (e) inspecting the patterned second layer with an inspection tool; wherein at least one of the first and second layers comprises a contrasting agent which increases the contrast between the first and second layers to the inspection tool.
Abstract:
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
Abstract:
A design for inspecting specimens, such as photomasks, for unwanted particles and features such as pattern defects is provided. The system provides no central obscuration, an external pupil for aperturing and Fourier filtering, and relatively relaxed manufacturing tolerances, and is suited for both broad-band bright-field and laser dark field imaging and inspection at wavelengths below 365 nm. In many instances, the lenses used may be fashioned or fabricated using a single material. Multiple embodiments of the objective lensing arrangement are disclosed, all including at least one small fold mirror and a Mangin mirror. The system is implemented off axis such that the returning second image is displaced laterally from the first image so that the lateral separation permits optical receipt and manipulation of each image separately. The objective designs presented have the optical axis of the Mangin mirror image relay at ninety degrees to the optical axis defined by the focusing lenses, or an in-line or straight objective having one ninety degree bend of light rays.