公开(公告)号：US06247579B1

公开(公告)日：2001-06-19

申请号：US09483239

申请日：2000-01-14

Applicant: Shigemi Fujiyama ,  Mikio Nishibata ,  Hirohito Sagoh

Inventor： Shigemi Fujiyama ,  Mikio Nishibata ,  Hirohito Sagoh

IPC: B65G2500

CPC classification number: B65G25/04 ,  H01L21/677

Abstract: A substrate transfer apparatus, for minimizing flexion or bending when transferring a large-sized angular substrate or plate, wherein transfer arms are constructed with holding portions extending in a direction perpendicular to a transfer direction and further holding portions extending in a direction parallel to the transfer direction, respectively. As a result of this, it is possible to suspend the glass substrate W at the four peripheral side portions from below by means of the holding portions of the transfer arms and to move or transfer it suspended in this way.

Abstract translation: 一种基板传送装置，用于在传送大尺寸的角度基板或板时使弯曲或弯曲最小化，其中传送臂由沿与传送方向垂直的方向延伸的保持部分构成，并且进一步保持沿平行于传送件的方向延伸的部分 方向。 其结果是，可以通过传送臂的保持部将玻璃基板W从下方悬挂在四个周边部分，并且以这种方式移动或移动它。

公开(公告)号：US6008978A

公开(公告)日：1999-12-28

申请号：US66602

申请日：1998-04-27

Applicant: Kiyohisa Tateyama

Inventor： Kiyohisa Tateyama

IPC: H01L21/677 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H05F3/02 ,  H05F13/00

CPC classification number: H01L21/67173 ,  H01L21/67184 ,  H01L21/67242 ,  H01L21/677

Abstract: A method and system for eliminating electrostatic charge of a processing section in which a processed object is transferred along a predetermined path for receiving treatment. An electrostatic charge eliminating member, arranged independently of the processing section, is transferred along the path of the processed object to eliminate the electrostatic charge of the processing section.

Abstract translation: 一种用于消除处理部件的静电电荷的方法和系统，其中被处理物体沿着用于接收处理的预定路径传送。 沿处理对象的路径传送独立于处理部分的静电电荷消除部件，以消除处理部分的静电电荷。

公开(公告)号：US20240228190A1

公开(公告)日：2024-07-11

申请号：US18289525

申请日：2021-08-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshiaki KODAMA ,  Wataru MATSUMOTO

IPC: B65G47/90 ,  H01L21/677 ,  H01L21/687

CPC classification number: B65G47/905 ,  H01L21/677 ,  H01L21/68707

Abstract: In the present invention, an articulated arm is configured so that a plurality of arms are connected by rotatable joints, and by rotating the joints, the articulated arm can be extended and contracted. A detection unit detects the angle of rotation of the joints of the articulated arm, for different postures the number of which is at least the number of arms of the articulated arm. A calculation unit calculates the expansion amount of each of the plurality of arms on the basis of the angle of rotation of the joints at each of the postures detected by the detection unit.

公开(公告)号：US11981501B2

公开(公告)日：2024-05-14

申请号：US17433342

申请日：2020-03-12

Applicant: ABSOLICS INC.

Inventor： Sungjin Kim ,  Youngho Rho ,  Jincheol Kim ,  Byungkyu Jang

IPC: B65D85/48 ,  H01L21/673 ,  H01L21/677

CPC classification number: B65D85/48 ,  H01L21/6732 ,  H01L21/677

Abstract: An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

公开(公告)号：US20240063032A1

公开(公告)日：2024-02-22

申请号：US18304473

申请日：2023-04-21

Applicant: Samsung Display Co., Ltd.

Inventor： Sehun Choi

IPC: H01L21/67 ,  H10K59/12 ,  H10K71/00 ,  H01L21/677

CPC classification number: H01L21/67092 ,  H10K59/1201 ,  H10K71/851 ,  H01L21/677 ,  H01L21/68707

Abstract: According to an embodiment, an apparatus for manufacturing a display apparatus includes a separation part to separate a half-cut target into a plurality of target portions, wherein the separation part includes a plurality of first moving parts each driven in a driving direction to move the target, and as each of the plurality of first moving parts is driven, a distance between the separated target portions gradually increases.

公开(公告)号：US20190221525A1

公开(公告)日：2019-07-18

申请号：US16237521

申请日：2018-12-31

Applicant: SK hynix Inc.

Inventor： Kun Young LEE ,  Sang Jun LIM ,  Ha Ni KIM ,  Hyun Woo KIM ,  Jae Boem MUN ,  Sang Kil LEE

IPC: H01L23/552 ,  B65D65/38 ,  B65D25/04 ,  G21F1/02 ,  H01L21/677

CPC classification number: H01L23/552 ,  B65D25/04 ,  B65D65/38 ,  G21F1/02 ,  H01L21/677

Abstract: A neutron shielding packing body configured to pack a semiconductor device is disclosed. The neutron shielding packing body reduces Total Ionizing Dose (TID) defects caused in the semiconductor device by collisions with neutrons during air transportation of the semiconductor device. The neutron shielding packing body includes hydrogen and boron.

公开(公告)号：US20190218426A1

公开(公告)日：2019-07-18

申请号：US16324655

申请日：2017-08-02

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshiharu HATAKEYAMA ,  Shotaro MASUDA ,  Tomoaki ICHIKAWA ,  Yohei MAENO

IPC: C09J7/38

CPC classification number: C09J7/38 ,  B25J15/00 ,  B25J15/008 ,  B32B9/00 ,  B65G49/07 ,  B82Y30/00 ,  C09J2203/326 ,  C09J2400/12 ,  H01L21/677 ,  H01L21/68707

Abstract: Provided is a pressure-sensitive adhesive structure including a carbon nanotube aggregate formed on a base material in which carbon nanotubes forming the carbon nanotube aggregate are hardly detached. The pressure-sensitive adhesive structure of the present invention includes: a base material; an intermediate layer; and a carbon nanotube aggregate layer, wherein the carbon nanotube aggregate layer includes a plurality of carbon nanotube aggregates, wherein the intermediate layer includes a layer containing the carbon nanotubes and a fixing agent, and wherein the intermediate layer has a thickness of 100 nm or more.

公开(公告)号：US20190206704A1

公开(公告)日：2019-07-04

申请号：US16322365

申请日：2017-08-03

Applicant: KONDOH INDUSTRIES, LTD.

Inventor： Toshiro KISAKIBARU ,  Kouta UENO ,  Isao HONBORI ,  Satoki SUGIYAMA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B06B1/06 ,  B65G47/90

CPC classification number: H01L21/67092 ,  B06B1/0607 ,  B65G47/90 ,  H01L21/02 ,  H01L21/67115 ,  H01L21/677 ,  H01L21/6773 ,  H01L21/68707

Abstract: An apparatus for manufacturing semiconductors is provided by which adhesion of moisture to a wafer in an EFEM is easily prevented. The apparatus 1 for manufacturing the semiconductors comprises processing equipment 30 that processes a wafer 90, a FOUP 40 that supplies the wafer 90 and that houses the wafer 90 that has been processed, an EFEM 10 that transfers the wafer 90 between the FOUP 40 and the processing equipment 30, a fan and filter unit 20 that sends an airflow 72 from above to the EFEM 10, an ultrasonic oscillator 52 that generates high-frequency power, and a vibrator 54 that generates ultrasonic waves 80 by using the high-frequency power that is generated by the ultrasonic oscillator 52 and that applies the ultrasonic waves 80 to the wafer 90 that is transported in the EFEM 10 and that has been processed.

公开(公告)号：US20190189449A1

公开(公告)日：2019-06-20

申请号：US16330759

申请日：2017-06-02

Applicant: THE JAPAN STEEL WORKS, LTD.

Inventor： Ryo SHIMIZU ,  Ryosuke SATO ,  Teruaki SHIMOJI

IPC: H01L21/268 ,  H01L21/677 ,  B23K26/073 ,  G01J1/42 ,  H01L21/02

CPC classification number: H01L21/268 ,  B23K26/0732 ,  G01J1/4257 ,  G09F9/00 ,  H01L21/02678 ,  H01L21/20 ,  H01L21/677 ,  H01L29/786

Abstract: A laser annealing apparatus (1) according to an embodiment includes a laser oscillator (4) configured to generate a laser beam (L), a floating-type conveying stage (3) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler (7) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage (3) includes a conveying surface (3a) opposed to the workpiece (W), and a bottom surface (3b) on the side opposite to the conveying surface (3a). The beam profiler (7) is positioned below the bottom surface (3b) of the floating-type conveying stage (3). The floating-type conveying stage (3) includes a detachable part (12) in a part of it. An opening (S) is formed by detaching the detachable part (12) from the floating-type conveying stage (3), the opening (3) extending from the conveying surface (3a) to the bottom surface (3b). The beam profiler (7) is configured to measure the beam profile of the laser beam (L) through the opening (S).

公开(公告)号：US20190035672A1

公开(公告)日：2019-01-31

申请号：US16069923

申请日：2017-01-10

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro MASUDA ,  Tomoaki ICHIKAWA ,  Yohei MAENO

IPC: H01L21/687 ,  C01B32/16

CPC classification number: H01L21/68785 ,  B82Y30/00 ,  C01B32/152 ,  C01B32/158 ,  C01B32/16 ,  C01B2202/08 ,  H01L21/677 ,  H01L21/67778 ,  H01L21/683

Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.