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公开(公告)号：US20240294438A1
公开(公告)日：2024-09-05
申请号：US18646513
申请日：2024-04-25
发明人： Tomoki MURATA
IPC分类号： C04B35/495 , H01G4/12 , H01G4/30
CPC分类号： C04B35/495 , H01G4/1209 , H01G4/30 , C04B2235/3255 , C04B2235/3262 , C04B2235/3272 , C04B2235/3281 , C04B2235/3418 , C04B2235/765
摘要： A dielectric ceramic composition that includes an oxide (I) of A, R, and B, in which the oxide (I) has a tetragonal tungsten bronze type structure; the A contains K and Ba; the R is at least one selected from a group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and Sc; the B is at least one selected from a group consisting of Nb and Ta; the B is contained in an amount of 4.75 mol or more and 5.25 mol or less with respect to 2 mol of the A; and the A, R, and B are contained in a total molar fraction of 0.975 or more with respect to all metal elements contained in the dielectric ceramic composition.
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公开(公告)号：US12081187B2
公开(公告)日：2024-09-03
申请号：US17463322
申请日：2021-08-31
发明人： Viktor Plesski , Soumya Yandrapalli , Robert B. Hammond , Bryant Garcia , Patrick Turner , Jesson John , Ventsislav Yantchev
CPC分类号： H03H9/02228 , H03H3/04 , H03H9/02031 , H03H9/132 , H03H9/174 , H03H9/176 , H03H9/562 , H03H9/564 , H03H9/568 , H03H2003/023 , H03H2003/0442
摘要： Acoustic resonator devices and filters, and methods of making the same. An acoustic resonator includes a piezoelectric plate and an interdigital transducer (IDT) including interleaved fingers on the piezoelectric plate. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic resonator further includes a front-side dielectric layer on the piezoelectric plate between the fingers of the IDT, wherein a resonance frequency of the acoustic resonator device has an inverse dependence on a thickness of the front-side dielectric layer.
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公开(公告)号：US12080485B2
公开(公告)日：2024-09-03
申请号：US17833985
申请日：2022-06-07
发明人： Yasuyuki Shimada
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/1218
摘要： A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately stacked on one another, and two external electrodes on two end surfaces of the multilayer body. The internal electrodes include first internal electrodes and second internal electrodes arranged alternately. A distance between the first internal electrodes adjacent to each other includes a distance T11 and a distance T12. The distance T11 is greater than the distance T12. A distance between the second internal electrodes adjacent to each other includes a distance T21 and a distance T22. The distance T21 is greater than the distance T22.
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公开(公告)号：US20240292519A1
公开(公告)日：2024-08-29
申请号：US18656618
申请日：2024-05-07
发明人： Keisuke ARIMA , Hiroyuki KANI , Tomoaki SATO
CPC分类号： H05K1/0243 , H03F3/245 , H03F2200/451 , H05K2201/09036
摘要： A high frequency module includes a mounting board, a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed on a main surface of either the first main surface or the second main surface of the mounting board. The electronic component is disposed on the main surface of the mounting board on which the power amplifier is disposed. The resin layer is disposed at least between the power amplifier and the electronic component in a plan view from a thickness direction of the mounting board. A groove portion is formed in the resin layer. The groove portion includes a bottom portion positioned between a third main surface of the power amplifier and the main surface of the mounting board when the mounting board is viewed from a direction orthogonal to the thickness direction of the mounting board.
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公开(公告)号：US20240291465A1
公开(公告)日：2024-08-29
申请号：US18657882
申请日：2024-05-08
发明人： Takashi YAMANE
CPC分类号： H03H9/0514 , H03H9/02015
摘要： An acoustic wave device includes an acoustic wave element, bumps electrically connected to the acoustic wave element, an under-bump metal layer between the acoustic wave element and the bumps, a wiring substrate on which the acoustic wave element is mounted, and an encapsulating body covering the acoustic wave element on the wiring substrate. The acoustic wave element includes a support substrate, a piezoelectric layer on one main surface of the support substrate, and a functional electrode on at least one main surface of the piezoelectric layer. The wiring substrate is electrically connected to the acoustic wave element via the under-bump metal layer and the bumps. The piezoelectric layer includes a hole passing through the piezoelectric layer on at least a portion of a straight line connecting the functional electrode and the bumps to each other.
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公开(公告)号：US20240291442A1
公开(公告)日：2024-08-29
申请号：US18655725
申请日：2024-05-06
发明人： Shingo YANAGIHARA
CPC分类号： H03F1/52 , H03F1/565 , H03F3/21 , H03F2200/387 , H03F2200/426
摘要： A limiter circuit includes: one or a plurality of first diodes having an anode electrically connected to a signal line through which a high-frequency signal passes, and a cathode electrically connected to a node, the plurality of first diodes being connected in series; a transistor having a source-drain path or an emitter-collector path electrically connected between a reference potential and the node, and a gate or a base to which a control voltage or a control current is input; and a first constant current source that outputs a first constant current to the node.
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公开(公告)号：US20240290546A1
公开(公告)日：2024-08-29
申请号：US18657890
申请日：2024-05-08
发明人： Keita KITAHARA , Yuta SAITO , Noriyuki OOKAWA , Riyousuke AKAZAWA , Takefumi TAKAHASHI , Masahiro WAKASHIMA , Yuta KUROSU , Akito MORI
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/1218
摘要： In a multilayer ceramic capacitor, a positional deviation in a lamination direction between end portions in a width direction intersecting the lamination direction and a length direction, of two of internal electrode layers adjacent to each other in the lamination direction, is about 5 μm or less. A connection ratio N1/N0 at the middle portion thereof, and a connection ratio N2/N0 at the end portion thereof are about 90% or more, respectively, and a difference between N1/N0 and N2/N0 is about 10% or less.
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公开(公告)号：US20240288685A1
公开(公告)日：2024-08-29
申请号：US18655584
申请日：2024-05-06
发明人： Yuuki ISHII , Yuka TANAKA , Katsuhiro TABUCHI , Takahide NAKADOI , Noritaka KISHI , Hitoshi SAKAGUCHI
CPC分类号： G02B27/0006 , B06B1/0651 , G02B7/02
摘要： An optical module includes a translucent body, a vibrator that is tubular and supports the translucent body, a piezoelectric element located at the vibrator to vibrate the vibrator, and an inner-layer optical component at an inner side portion of the vibrator. The inner-layer optical component includes an inner-layer lens that faces the translucent body, a recess that is recessed in a thickness direction of the inner-layer lens and includes a curvature on a surface of the inner-layer lens facing the translucent body, and a gap is located between the translucent body and the recess of the inner-layer lens.
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公开(公告)号：US20240286890A1
公开(公告)日：2024-08-29
申请号：US18585802
申请日：2024-02-23
发明人： Altti TORKKELI , Masakazu FUKUMITSU , Anssi BLOMQVIST , Matti LIUKKU , Ville-Pekka RYTKÖNEN , Tadayuki OKAWA , Petteri KILPINEN
CPC分类号： B81B3/0072 , B81B3/0051 , B81C1/00666 , B81C1/00984 , B81B2201/0228
摘要： A MEMS device is provided that includes a handle layer having a cavity and a suspension structure, a first device layer including a static electrode, a second device layer including a seismic element moveably suspended above the first device layer and a cap layer. The seismic element acts as the moveable electrode or the seismic element is mechanically coupled to move with the moveable electrode. The handle layer, the first device layer, the second device layer and the cap layer, a first electrically insulating layer between the handle layer and the first device layer, and a second electrically insulating layer between the first device layer and the second device layer form an enclosure that accommodates the seismic element, the static electrode and the moveable electrode.
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公开(公告)号：US12074624B2
公开(公告)日：2024-08-27
申请号：US18311426
申请日：2023-05-03
发明人： Hiroyuki Kani , Tomohiro Sano
CPC分类号： H04B1/1615 , H04B1/006 , H04B1/04 , H04B2001/0408
摘要： In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.
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