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公开(公告)号：US20240128948A1
公开(公告)日：2024-04-18
申请号：US18398422
申请日：2023-12-28
CPC分类号： H03H9/1057 , H03H3/0072 , H03H9/2489
摘要： A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.
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公开(公告)号：US20150084090A1
公开(公告)日：2015-03-26
申请号：US14556404
申请日：2014-12-01
CPC分类号： H01L23/60 , H01L23/12 , H01L23/48 , H01L33/486 , H01L33/62 , H01L2224/131 , H01L2224/16235 , H01L2924/0002 , H05F3/00 , H05K1/0259 , H05K1/0306 , H05K1/113 , H05K3/421 , H05K2201/10106 , H01L2924/00 , H01L2924/014
摘要： External connection conductors are arranged on a back surface of a base material, and wiring conductors are arranged on a front surface. An insulating layer is provided on surfaces of the wiring conductors. Component mounting conductors are provided on a surface of the insulating layer. The component mounting conductor and the wiring conductor are electrically coupled to each other, and the component mounting conductor and the wiring conductor are electrically coupled to each other. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between forming areas of the component mounting conductors. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between the forming areas of the component mounting conductors.
摘要翻译： 外部连接导体布置在基材的后表面上，并且布线导体布置在前表面上。 绝缘层设置在布线导体的表面上。 元件安装导体设置在绝缘层的表面上。 部件安装导体和布线导体彼此电耦合，并且部件安装导体和布线导体彼此电耦合。 布线导体和外部连接导体通过设置在部件安装导体的形成区域之间的孔的内壁表面上的导体膜电耦合。 布线导体和外部连接导体通过设置在部件安装导体的形成区域之间的孔的内壁表面上的导体膜电耦合。
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公开(公告)号：US20230353122A1
公开(公告)日：2023-11-02
申请号：US18350987
申请日：2023-07-12
发明人： Fumiya ENDOU , Masakazu FUKUMITSU
CPC分类号： H03H9/2468 , H03H9/1057 , H03H3/02 , H03H9/17 , H03H9/125
摘要： A method of manufacturing a resonance device includes preparing a resonance device and adjusting a frequency of the resonator. The resonance device includes a lower lid, an upper lid joined to the lower lid, and a resonator with vibration arms that vibrate in bending vibration in an interior space between the lower and upper lids. The adjusting of the frequency of the resonator includes vibrating the vibration arms in bending vibration and thereby causing respective ends of the arms to strike the lower lid at an impact speed of 3.5×103 μm/sec or more. The ends of the vibration arms are made of silicon oxide, and the lower lid is made of silicon.
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公开(公告)号：US20220231663A1
公开(公告)日：2022-07-21
申请号：US17714763
申请日：2022-04-06
摘要： A resonance device is provided that includes a lower cover; an upper cover coupled to the lower cover; and a resonator that has vibration arms that generate bending vibration in an interior space provided between the lower cover and the upper cover. Moreover, the vibration arms have distal ends provided with metal films on a side that faces the upper cover, and a gap is provided between the distal ends of the vibration arms and the upper cover that is larger than a gap between the distal ends of the vibration arms and the lower cover.
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公开(公告)号：US20220153573A1
公开(公告)日：2022-05-19
申请号：US17666746
申请日：2022-02-08
摘要： A package structure that includes a pair of substrates arranged to oppose each other so as to form an internal space; a bonding portion sealing the pair of substrates; an element is sealed in the internal space and surrounded by the pair of substrates; an adsorption layer within the internal space and opposing at least one substrate of the pair of substrates, the adsorption layer constructed to adsorbs at least hydrogen; and a diffusion-inhibiting layer between the at least one substrate and the adsorption layer, and in which hydrogen is more difficult to diffuse compared with in the at least one substrate.
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公开(公告)号：US20230421131A1
公开(公告)日：2023-12-28
申请号：US18462838
申请日：2023-09-07
发明人： Masakazu FUKUMITSU , Naoto YATANI , Ryota KAWAI , Fumiya ENDOU
CPC分类号： H03H9/171 , H03H9/0538 , H03H9/09 , H03H3/02
摘要： A method is provided for manufacturing a resonance device, the method includes forming a recessed portion that forms a vibration space for a resonator in an object that is at least one of an upper lid and a lower lid and includes etching on the object by isotropic etching while the object is covered with a mask having a peripheral portion having a frame shape and a stopper formation that extends from the peripheral portion toward an inside of the peripheral portion. The method further includes etching the object while the object is covered with the mask to form a stopper at a position overlapping with the stopper formation on a bottom surface of the recessed portion in a plan view of the object. In this aspect, the stopper restricts collision of the resonator with the bottom surface of the recessed portion.
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公开(公告)号：US20230208392A1
公开(公告)日：2023-06-29
申请号：US18175954
申请日：2023-02-28
CPC分类号： H03H9/171 , H03H3/02 , H03H3/0072
摘要： A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.
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公开(公告)号：US20190109578A1
公开(公告)日：2019-04-11
申请号：US16210222
申请日：2018-12-05
发明人： Yuichi GOTO , Masakazu FUKUMITSU
IPC分类号： H03H9/10 , B81B3/00 , H03H9/15 , H01L41/113
摘要： A resonator that includes a vibrating portion that has a piezoelectric film, and a lower and upper electrodes that face each other with the piezoelectric film interposed therebetween. Moreover, a holding portion is provided at least around a maximum displacement region of the vibrating portion and has an insulating film. A holding arm connects the vibrating portion and the holding portion, and include a conductive portion that is in contact with the insulating film of the holding portion in at least a region that faces the maximum displacement region of the vibrating portion. In addition, the conductive portion is electrically connected to the lower electrode or the upper electrode or is grounded.
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公开(公告)号：US20240286890A1
公开(公告)日：2024-08-29
申请号：US18585802
申请日：2024-02-23
发明人： Altti TORKKELI , Masakazu FUKUMITSU , Anssi BLOMQVIST , Matti LIUKKU , Ville-Pekka RYTKÖNEN , Tadayuki OKAWA , Petteri KILPINEN
CPC分类号： B81B3/0072 , B81B3/0051 , B81C1/00666 , B81C1/00984 , B81B2201/0228
摘要： A MEMS device is provided that includes a handle layer having a cavity and a suspension structure, a first device layer including a static electrode, a second device layer including a seismic element moveably suspended above the first device layer and a cap layer. The seismic element acts as the moveable electrode or the seismic element is mechanically coupled to move with the moveable electrode. The handle layer, the first device layer, the second device layer and the cap layer, a first electrically insulating layer between the handle layer and the first device layer, and a second electrically insulating layer between the first device layer and the second device layer form an enclosure that accommodates the seismic element, the static electrode and the moveable electrode.
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公开(公告)号：US20240174511A1
公开(公告)日：2024-05-30
申请号：US18430924
申请日：2024-02-02
IPC分类号： B81B3/00 , G01P15/125
CPC分类号： B81B3/0086 , B81B2201/0235 , B81B2203/0323 , B81B2203/04 , B81B2207/095 , G01P15/125
摘要： An inertial sensor includes a MEMS substrate and an upper lid joined to the MEMS substrate. The MEMS substrate includes a capacitance portion including first and second movable electrodes causing a capacitance to change in accordance with a distance between the first and second movable electrodes, a holding portion holding the capacitance portion, and a spring portion connecting the capacitance portion and the holding portion to each other and supporting the first movable electrode and the second movable electrode in a displaceable manner with respect to the holding portion.
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