Radiation Emitting Semiconductor Chip and Radiation Emitting Semiconductor Device

    公开(公告)号:US20220130893A1

    公开(公告)日:2022-04-28

    申请号:US17434511

    申请日:2020-03-04

    Abstract: In an embodiment a radiation emitting semiconductor chip includes a semiconductor layer sequence with a plurality of active regions and a main extension plane, wherein each active region has a main extension direction, wherein each active region is configured to emit electromagnetic radiation from an emitter region extending parallel to the main extension plane, wherein at least two active regions overlap in plan view, wherein the emitter regions are arranged at grid points of a regular grid connected by at least one grid line, and wherein the main extension direction of at least one active region encloses an angle of at least 10° and at most 80° with the grid lines of the regular grid.

    LIGHT EMITTING DEVICE AND INTERIOR CLADDING OR CLADDING ELEMENT WITH A LIGHT EMITTING DEVICE

    公开(公告)号:US20220126749A1

    公开(公告)日:2022-04-28

    申请号:US17430855

    申请日:2020-02-12

    Abstract: A light emitting device includes a radiation source for the emission of electromagnetic radiation and a converter element on which the electromagnetic radiation impinges in a first surface region and which, excited by the impinged electromagnetic radiation, emits visible light into an environment in a second surface region which differs at least partially from the first surface region. The wavelength of the light emitted into the environment differs from the wavelength of the electromagnetic radiation impinged on the converter element. The converter element includes a luminous element including a textile with a converter material. The converter material due to excitation by the electromagnetic radiation with a first wavelength emits visible light with a second wavelength differing from the first wavelength. The radiation source realizes a background illumination for the converter element. The first surface region is formed by a side surface or a back surface of the converter element.

    Radiation-emitting device
    84.
    发明授权

    公开(公告)号:US11316077B2

    公开(公告)日:2022-04-26

    申请号:US16480732

    申请日:2018-01-25

    Abstract: A radiation-emitting device includes a semiconductor layer sequence having an active layer that emits a primary radiation during operation, a decoupling surface on a surface of the semiconductor layer sequence, a wavelength conversion layer on a side of the semiconductor layer sequence facing away from the decoupling surface, containing at least one conversion material that converts the primary radiation into secondary radiation, and a mirror layer on the side of the wavelength conversion layer facing away from the semiconductor layer sequence, wherein the at least one conversion material is electrically conductive and/or embedded in an electrically conductive matrix material.

    Semiconductor body
    85.
    发明授权

    公开(公告)号:US11316067B2

    公开(公告)日:2022-04-26

    申请号:US16342163

    申请日:2017-10-23

    Abstract: A semiconductor body is disclosed. In an embodiment a semiconductor body includes an n-doped region comprising a first layer sequence comprising pairs of alternating layers, wherein a first layer and a second layer of each pair differ in their doping concentration, and wherein the first and second layers of each pair have the same material composition except for their doping and a second layer sequence comprising pairs of alternating layers, wherein a first layer and a second layer of each pair differ in their material composition, an active region, wherein the second layer sequence is disposed between the first layer sequence and the active region and a p-doped region, wherein the active region is disposed between the n-doped region and the p-doped region.

    EDGE EMITTING LASER DIODE AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20220123529A1

    公开(公告)日:2022-04-21

    申请号:US17430658

    申请日:2020-01-16

    Inventor: Jens EBBECKE

    Abstract: The invention relates to an edge emitting laser diode comprising a semiconductor layer stack whose growth direction defines a vertical direction, and wherein the semiconductor layer stack comprises an active layer and a waveguide layer. A thermal stress element is arranged in at least indirect contact with the semiconductor layer stack, the thermal stress element being configured to generate a thermally induced mechanical stress in the waveguide layer that counteracts the formation of a thermal lens.

    METHOD FOR OBTAINING ELECTRONIC DEVICES AND ELECTRONIC DEVICES

    公开(公告)号:US20220109282A1

    公开(公告)日:2022-04-07

    申请号:US17423209

    申请日:2019-01-17

    Abstract: The invention refers to electronic devices (D) and to a method for obtaining electronic devices (D) comprising, electronic elements, in particular optoelectronic elements (7), the method comprising the steps of:—providing (S1) a substrate from which first walls (1) protrude along a Z-axis towards an open end side forming at least one rectangle along a X-Y-plane surrounding a respective at least one space(S);—positioning (S2) a respective electronic element (7a), in particular optoelectronic element (7),within the respective space(S)and connecting it to contact pads (9);—attaching (S3) a respective functional element (11a), in particular optical element (11), in particular a lens, at the open end side of respective first wall (1) to cover the respective space (S);—forming a second wall (2) by surrounding (S4) the respective functional element (11a), in particular optical element (11), with a darn material.

    LIGHT-EMITTING DIODE MODULE AND ASSEMBLY WITH A LIGHT-EMITTING DIODE MODULE

    公开(公告)号:US20220109093A1

    公开(公告)日:2022-04-07

    申请号:US17428036

    申请日:2020-02-05

    Inventor: Karlheinz ARNDT

    Abstract: In one embodiment, the light-emitting diode module comprises a carrier and a plurality of light-emitting diodes. Thereby, several types of light-emitting diodes are present. The light-emitting diodes can be controlled individually or in groups electrically independently of one another. The light-emitting diodes each comprise a first and a second electrical contact. The carrier comprises several electrically conductive main layers, between each of which there is an electrically insulating intermediate layer. The contacts of the light-emitting diodes are attached to a carrier upper side on one of the first main layers. Starting from the first contacts, electrical through-connections are each connected directly to a carrier underside with a last main layer of the main layers. Starting from the second contacts, electrical through-connection each terminate at a penultimate main layer of the main layers, wherein the penultimate main layer is located inside the carrier.

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