公开(公告)号：US20070153391A1

公开(公告)日：2007-07-05

申请号：US11472289

申请日：2006-06-22

Applicant: Ping Chuang

Inventor： Ping Chuang

IPC: G02B27/10

CPC classification number: G02B3/0056 ,  G02B3/0031 ,  G02B3/0062 ,  G02B6/0053 ,  G02F1/133615 ,  G02F2001/133507 ,  G02F2001/133607

Abstract: An optical module is provided. The optical module comprises a light source, a first lens array and a second lens array. The first lens array is located on the light source and the second lens array is located on the first lens array. There are a plurality of curved bumps on the surface of the first lens array. There are a plurality of pyramid bumps on the surface of the second lens array.

Abstract translation: 提供光模块。 光学模块包括光源，第一透镜阵列和第二透镜阵列。 第一透镜阵列位于光源上，第二透镜阵列位于第一透镜阵列上。 在第一透镜阵列的表面上存在多个弯曲凸块。 在第二透镜阵列的表面上有多个金字塔凸块。

公开(公告)号：US20060003169A1

公开(公告)日：2006-01-05

申请号：US10883291

申请日：2004-06-30

Applicant: Ping Chuang ,  Lu-Chin Wu

Inventor： Ping Chuang ,  Lu-Chin Wu

IPC: B32B1/00

CPC classification number: C08J7/045 ,  B05D5/067 ,  C08J2383/04 ,  C23C14/024 ,  C23C14/20 ,  C23C18/1646 ,  C25D5/56 ,  Y10T428/31605

Abstract: A method for applying a metal layer to silicon rubber is described. A polyurethane (PU) primer is applied and cured before application of the metal layer. The metal layer can be applied on a PU-coated silicon rubber material or article by vacuum metallization, chemical plating, electrical plating or physical vapor deposition, and preferably by sputtering. The coated metal layer manufactured by the disclosure herein shows high resistance to thermal and oxidative degradations and also has high resistance to water absorption in the work environment.

Abstract translation: 描述了一种将金属层施加到硅橡胶上的方法。 在施加金属层之前涂布并固化聚氨酯（PU）底漆。 金属层可以通过真空金属化，化学镀，电镀或物理气相沉积，优选通过溅射涂覆在PU涂覆的硅橡胶材料或制品上。 由本文公开的制造的涂覆金属层显示出高的耐热性和氧化性降解性，并且在工作环境中也具有高的吸水性。

公开(公告)号：US20050152646A1

公开(公告)日：2005-07-14

申请号：US10756308

申请日：2004-01-14

Applicant: Kai-Ping Chuang ,  Lih-Gen Sheu ,  Meng-Chang Tsai ,  Yinchieh Lai

Inventor： Kai-Ping Chuang ,  Lih-Gen Sheu ,  Meng-Chang Tsai ,  Yinchieh Lai

IPC: C03C25/00 ,  G02B6/02 ,  G02B6/34 ,  G03H1/04

CPC classification number: G02B6/02133 ,  G02B6/02085 ,  G02B6/02152 ,  Y10S359/90

Abstract: The present invention provides a two-beam interference exposure system that can be simply adjusted by rotating only one mirror. By placing a half-wave plate in one of the interference arms and precisely scanning the relative fiber position, the present invention can expose true apodized fiber Bragg gratings in a single scan by simultaneously rotating the angle of the half-wave plate. By rotationally switching the fast and slow axes of the half-wave plate, the present invention can also expose n-phase-shifted fiber grating by the same system.

Abstract translation: 本发明提供一种双光束干涉曝光系统，其可以通过仅旋转一个反射镜简单地进行调节。 通过将半波片放置在干涉臂之一并精确扫描相对光纤位置，本发明可以通过同时旋转半波片的角度，在单次扫描中暴露真实的变迹光纤布拉格光栅。 通过旋转切换半波片的快轴和慢轴，本发明也可以通过相同的系统曝光n相移光纤光栅。

公开(公告)号：US06875285B2

公开(公告)日：2005-04-05

申请号：US10422339

申请日：2003-04-24

Applicant: Ching-Ya Wang ,  Ping Chuang ,  Yu-Liang Lin ,  Mei-Sheng Zhou ,  Henry Lo

Inventor： Ching-Ya Wang ,  Ping Chuang ,  Yu-Liang Lin ,  Mei-Sheng Zhou ,  Henry Lo

IPC: B08B7/00 ,  H01L21/306 ,  H01L21/311 ,  C23G1/00

CPC classification number: H01L21/31116 ,  B08B7/0021 ,  H01L21/02052

Abstract: System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

Abstract translation: 当在高压下使用清洁流体以清洁半导体衬底时，减少对半导体衬底的损伤的系统和方法。 优选实施例包括在第一时间段内施加第一压力的清洁流体，其中第一压力相对较低，然后将清洁流体的压力提高到可以有效地清洁半导体衬底并保持压力的压力水平 水平第二次。 以相对较低的初始压力施加清洁流体作为临时填料并在半导体衬底上产生清洗液的缓冲液，并且有助于抑制随后的高压施加清洁流体对半导体衬底的冲击。

公开(公告)号：US06872127B2

公开(公告)日：2005-03-29

申请号：US10194894

申请日：2002-07-11

Applicant: Yu-Liang Lin ,  Henry Lo ,  Ping Chuang

Inventor： Yu-Liang Lin ,  Henry Lo ,  Ping Chuang

IPC: B24B53/017 ,  B24B53/12 ,  B24B1/00

CPC classification number: B24B53/017 ,  B24B53/12

Abstract: The invention relates to disks for conditioning pads used in the chemical mechanical polishing of semiconductor wafers, and a method of fabricating the pads. In one embodiment, the conditioning pad includes multiple, pyramid-shaped, truncated protrusions which are cut or shaped in the surface of a typically stainless steel substrate. Each of the truncated protrusions includes a plateau in the top thereof. A seed layer, typically titanium nitride (TiN), is provided on the surface of the protrusions, and a contact layer such as diamond-like carbon (DLC) or other suitable film is provided over the seed layer. In another embodiment, each of the protrusions is pyramid-shaped and includes a pointed apex at the top thereof.

Abstract translation: 本发明涉及用于半导体晶片的化学机械抛光中的调节垫的盘及其制造方法。 在一个实施例中，调节垫包括在典型的不锈钢衬底的表面中切割或成形的多个金字塔形的截头突起。 每个截头突起在其顶部包括平台。 在突起的表面上提供种子层，通常为氮化钛（TiN），并且在种子层上提供诸如类金刚石碳（DLC）等接触层或其它合适的膜。 在另一个实施例中，每个突起是金字塔形的，并且在其顶部包括尖顶。

公开(公告)号：US06729935B2

公开(公告)日：2004-05-04

申请号：US10170674

申请日：2002-06-13

Applicant: Shang-Ting Tsai ,  Ping Chuang ,  Henry Lo ,  Chao-Jung Chang ,  Ping-Hsu Chen ,  Yu-Liang Lin ,  Yu-Huei Chen ,  Ai-Sen Liu ,  Syun-Ming Jang

Inventor： Shang-Ting Tsai ,  Ping Chuang ,  Henry Lo ,  Chao-Jung Chang ,  Ping-Hsu Chen ,  Yu-Liang Lin ,  Yu-Huei Chen ,  Ai-Sen Liu ,  Syun-Ming Jang

IPC: B24B4900

CPC classification number: B24B57/02 ,  B24B37/042 ,  B24B49/12

Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.