公开(公告)号：US07354623B2

公开(公告)日：2008-04-08

申请号：US10852381

申请日：2004-05-24

申请人： Ching-Ya Wang ,  Ping Chuang ,  Sunny Wu ,  Yu-Liang Lin ,  Hung-Jung Tu ,  Mei-Sheng Zhou ,  Henry Lo

发明人： Ching-Ya Wang ,  Ping Chuang ,  Sunny Wu ,  Yu-Liang Lin ,  Hung-Jung Tu ,  Mei-Sheng Zhou ,  Henry Lo

IPC分类号： B05D3/00 ,  B05D5/00

CPC分类号： H01L21/02203 ,  H01L21/02118 ,  H01L21/31058 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/249953 ,  Y10T428/249987

摘要： An organic layer, such as a porous low-K dielectric in an IC, contains pores open at its surface. To close the pores, the organic layer is contacted by a supercritical fluid that is a solvent for the layer. After a small amount of the surface and the wall of the open pores is solvated, a phase transition of the solvated organic material is effected at the surface to cover it with a dense, smooth, non-porous film that seals the open pores.

摘要翻译： 有机层，例如IC中的多孔低K电介质，其表面含有孔。 为了封闭孔，有机层与作为该层的溶剂的超临界流体接触。 在少量表面和开放孔的壁被溶剂化后，在表面进行溶剂化有机材料的相变以用密封，开孔的密实，光滑，无孔的膜覆盖。

公开(公告)号：US20050260402A1

公开(公告)日：2005-11-24

申请号：US10852381

申请日：2004-05-24

申请人： Ching-Ya Wang ,  Ping Chuang ,  Sunny Wu ,  Yu-Liang Lin ,  Hung-Jung Tu ,  Mei-Sheng Zhou ,  Henry Lo

发明人： Ching-Ya Wang ,  Ping Chuang ,  Sunny Wu ,  Yu-Liang Lin ,  Hung-Jung Tu ,  Mei-Sheng Zhou ,  Henry Lo

IPC分类号： B05D3/04 ,  B05D5/12 ,  B32B3/26 ,  C08K3/00 ,  H01L21/3105 ,  H01L21/312 ,  H01L21/316

CPC分类号： H01L21/02203 ,  H01L21/02118 ,  H01L21/31058 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/249953 ,  Y10T428/249987

摘要： An organic layer, such as a porous low-K dielectric in an IC, contains pores open at its surface. To close the pores, the organic layer is contacted by a supercritical fluid that is a solvent for the layer. After a small amount of the surface and the wall of the open pores is solvated, a phase transition of the solvated organic material is effected at the surface to cover it with a dense, smooth, non-porous film that seals the open pores.

摘要翻译： 有机层，例如IC中的多孔低K电介质，其表面含有孔。 为了封闭孔，有机层与作为该层的溶剂的超临界流体接触。 在少量表面和开放孔的壁被溶剂化后，在表面进行溶剂化有机材料的相变以用密封，开孔的密实，光滑，无孔的膜覆盖。

公开(公告)号：US06875285B2

公开(公告)日：2005-04-05

申请号：US10422339

申请日：2003-04-24

申请人： Ching-Ya Wang ,  Ping Chuang ,  Yu-Liang Lin ,  Mei-Sheng Zhou ,  Henry Lo

发明人： Ching-Ya Wang ,  Ping Chuang ,  Yu-Liang Lin ,  Mei-Sheng Zhou ,  Henry Lo

IPC分类号： B08B7/00 ,  H01L21/306 ,  H01L21/311 ,  C23G1/00

CPC分类号： H01L21/31116 ,  B08B7/0021 ,  H01L21/02052

摘要： System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

摘要翻译： 当在高压下使用清洁流体以清洁半导体衬底时，减少对半导体衬底的损伤的系统和方法。 优选实施例包括在第一时间段内施加第一压力的清洁流体，其中第一压力相对较低，然后将清洁流体的压力提高到可以有效地清洁半导体衬底并保持压力的压力水平 水平第二次。 以相对较低的初始压力施加清洁流体作为临时填料并在半导体衬底上产生清洗液的缓冲液，并且有助于抑制随后的高压施加清洁流体对半导体衬底的冲击。

公开(公告)号：US20050158664A1

公开(公告)日：2005-07-21

申请号：US10760927

申请日：2004-01-20

申请人： Joshua Tseng ,  Ping Chuang ,  Hung-Jung Tu ,  Ching-Ya Wang ,  Yu-Liang Lin ,  Henry Lo ,  Mei-Sheng Zhou

发明人： Joshua Tseng ,  Ping Chuang ,  Hung-Jung Tu ,  Ching-Ya Wang ,  Yu-Liang Lin ,  Henry Lo ,  Mei-Sheng Zhou

IPC分类号： G03F7/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/311 ,  H01L21/768 ,  H01L23/52

CPC分类号： H01L21/76802 ,  G03F7/422 ,  G03F7/423 ,  G03F7/425 ,  G03F7/426 ,  H01L21/31116 ,  H01L21/31133 ,  H01L21/31144 ,  H01L21/76877

摘要： A method of integrating a post-etching cleaning process with deposition for a semiconductor device. A substrate having a damascene structure formed by etching a dielectric layer formed thereon using an overlying photoresist mask as an etching mask is provided. A cleaning process is performed by a supercritical fluid to remove the photoresist mask and post-etching by-products. An interconnect layer is formed in-situ in the damascene structure using the supercritical fluid as a reaction medium, wherein the cleaning process and the subsequent interconnect layer formation are performed in one process chamber or in different process chambers of a processing tool.

摘要翻译： 将后蚀刻清洗工艺与用于半导体器件的沉积集成的方法。 提供具有通过使用覆盖光致抗蚀剂掩模蚀刻形成在其上的介电层作为蚀刻掩模形成的镶嵌结构的基板。 通过超临界流体进行清洁处理以除去光致抗蚀剂掩模和后蚀刻副产物。 使用超临界流体作为反应介质，在镶嵌结构中原位形成互连层，其中清洁工艺和随后的互连层形成在一个处理室中或在处理工具的不同处理室中进行。

公开(公告)号：US07387973B2

公开(公告)日：2008-06-17

申请号：US10956640

申请日：2004-09-30

申请人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo

发明人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/76826 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76877

摘要： A method for treating an inter-metal dielectric (IMD) layer to improve a mechanical strength and/or repair plasma etching damage including providing a low-K silicon oxide containing dielectric insulating layer; and carrying out a super critical fluid treatment of the low-K dielectric insulating layer including supercritical CO2 and a solvent including a silicon bond forming substituent having a bonding energy greater than a Si—H to replace at least a portion of the Si—H bonds with the silicon bond forming substituent.

摘要翻译： 一种用于处理金属间电介质（IMD）层以改善机械强度和/或修复等离子体蚀刻损伤的方法，包括提供含有低K氧化硅的介电绝缘层; 并对包括超临界CO 2的低K电介质绝缘层进行超临界流体处理，并且包括具有大于Si-H的键合能力的形成硅键的取代基的溶剂至少替代 一部分Si-H与形成硅键的取代基键合。

公开(公告)号：US20080108223A1

公开(公告)日：2008-05-08

申请号：US11552364

申请日：2006-10-24

申请人： Ching-Ya Wang ,  Weng-Jin Wu ,  Henry Lo ,  Jean Wang

发明人： Ching-Ya Wang ,  Weng-Jin Wu ,  Henry Lo ,  Jean Wang

IPC分类号： H01L21/311

CPC分类号： H01L21/31133 ,  G03F7/422 ,  G03F7/423

摘要： A method and apparatus involve providing a substrate having a dielectric layer formed thereon, forming a photoresist mask over the dielectric layer, the photoresist mask defining an opening, etching the dielectric layer through the at least one opening in the photoresist mask, treating a portion of the photoresist mask with an etching species, and removing the treated photoresist mask with a supercritical fluid. The etching, treating, and removing can be performed in one chamber.

摘要翻译： 一种方法和装置，包括提供其上形成有电介质层的衬底，在电介质层上形成光致抗蚀剂掩模，光刻胶掩模限定开口，通过光致抗蚀剂掩模中的至少一个开口蚀刻电介质层， 具有蚀刻物质的光致抗蚀剂掩模，并用超临界流体去除经处理的光致抗蚀剂掩模。 蚀刻，处理和去除可以在一个室中进行。

公开(公告)号：US07332449B2

公开(公告)日：2008-02-19

申请号：US11240965

申请日：2005-09-30

申请人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo ,  Jean Wang

发明人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo ,  Jean Wang

IPC分类号： H01L21/302 ,  H01L21/461 ,  H01L21/44

CPC分类号： H01L23/53238 ,  H01L21/02063 ,  H01L21/02101 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/76808 ,  H01L21/76814 ,  H01L21/76831 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10S438/963 ,  H01L2924/00

摘要： A method for forming a damascene structure by providing a single process solution for resist ashing while avoiding and repairing plasma etching damage as well as removing absorbed moisture in the dielectric layer, the method including providing a substrate comprising an uppermost photoresist layer and an opening extending through a thickness of an inter-metal dielectric (IMD) layer to expose an underlying metal region; and, carrying out at least one supercritical fluid treatment comprising supercritical CO2, a first co-solvent, and an additive selected from the group consisting of a metal corrosion inhibitor and a metal anti-oxidation agent to remove the uppermost photoresist layer, as well as including an optional dielectric insulating layer bond forming agent.

摘要翻译： 一种通过提供用于抗蚀剂灰化的单一工艺溶液来形成镶嵌结构的方法，同时避免和修复等离子体蚀刻损伤以及去除介电层中的吸收的水分，所述方法包括提供包括最上面的光致抗蚀剂层和延伸穿过的开口 金属间电介质（IMD）层的厚度以暴露下面的金属区域; 并且进行至少一种超临界流体处理，其包括超临界CO 2，第一共溶剂和选自金属缓蚀剂和金属抗氧化剂的添加剂以除去最上面的光致抗蚀剂层，以及 包括可选的介电绝缘层结合剂。

公开(公告)号：US07951723B2

公开(公告)日：2011-05-31

申请号：US11552364

申请日：2006-10-24

申请人： Ching-Ya Wang ,  Weng-Jin Wu ,  Henry Lo ,  Jean Wang

发明人： Ching-Ya Wang ,  Weng-Jin Wu ,  Henry Lo ,  Jean Wang

IPC分类号： H01L21/461

CPC分类号： H01L21/31133 ,  G03F7/422 ,  G03F7/423

摘要： A method and apparatus involve providing a substrate having a dielectric layer formed thereon, forming a photoresist mask over the dielectric layer, the photoresist mask defining an opening, etching the dielectric layer through the at least one opening in the photoresist mask, treating a portion of the photoresist mask with an etching species, and removing the treated photoresist mask with a supercritical fluid. The etching, treating, and removing can be performed in one chamber.

摘要翻译： 一种方法和装置，包括提供其上形成有电介质层的衬底，在电介质层上形成光致抗蚀剂掩模，光刻胶掩模限定开口，通过光致抗蚀剂掩模中的至少一个开口蚀刻电介质层， 具有蚀刻物质的光致抗蚀剂掩模，并用超临界流体去除经处理的光致抗蚀剂掩模。 蚀刻，处理和去除可以在一个室中进行。

公开(公告)号：US20070241455A1

公开(公告)日：2007-10-18

申请号：US11240965

申请日：2005-09-30

申请人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo ,  Jean Wang

发明人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo ,  Jean Wang

IPC分类号： H01L23/48

CPC分类号： H01L23/53238 ,  H01L21/02063 ,  H01L21/02101 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/76808 ,  H01L21/76814 ,  H01L21/76831 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10S438/963 ,  H01L2924/00

摘要： A method for forming a damascene structure by providing a single process solution for resist ashing while avoiding and repairing plasma etching damage as well as removing absorbed moisture in the dielectric layer, the method including providing a substrate comprising an uppermost photoresist layer and an opening extending through a thickness of an inter-metal dielectric (IMD) layer to expose an underlying metal region; and, carrying out at least one supercritical fluid treatment comprising supercritical CO2, a first co-solvent, and an additive selected from the group consisting of a metal corrosion inhibitor and a metal anti-oxidation agent to remove the uppermost photoresist layer, as well as including an optional dielectric insulating layer bond forming agent.

摘要翻译： 一种通过提供用于抗蚀剂灰化的单一工艺溶液来形成镶嵌结构的方法，同时避免和修复等离子体蚀刻损伤以及去除介电层中的吸收的水分，所述方法包括提供包括最上面的光致抗蚀剂层和延伸穿过的开口 金属间电介质（IMD）层的厚度以暴露下面的金属区域; 并且进行至少一种超临界流体处理，其包括超临界CO 2，第一共溶剂和选自金属缓蚀剂和金属抗氧化剂的添加剂以除去最上面的光致抗蚀剂层，以及 包括可选的介电绝缘层结合剂。

公开(公告)号：US20060073697A1

公开(公告)日：2006-04-06

申请号：US10956640

申请日：2004-09-30

申请人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo

发明人： Ching-Ya Wang ,  Joshua Tseng ,  Henry Lo

IPC分类号： H01L21/4763

CPC分类号： H01L21/76826 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76877

摘要： A method for treating an inter-metal dielectric (IMD) layer to improve a mechanical strength and/or repair plasma etching damage including providing a low-K silicon oxide containing dielectric insulating layer; and carrying out a super critical fluid treatment of the low-K dielectric insulating layer including supercritical CO2 and a solvent including a silicon bond forming substituent having a bonding energy greater than a Si—H to replace at least a portion of the Si—H bonds with the silicon bond forming substituent.

摘要翻译： 一种用于处理金属间电介质（IMD）层以改善机械强度和/或修复等离子体蚀刻损伤的方法，包括提供含有低K氧化硅的介电绝缘层; 并对包括超临界CO 2的低K电介质绝缘层进行超临界流体处理，并且包括具有大于Si-H的键合能力的形成硅键的取代基的溶剂至少替代 一部分Si-H与形成硅键的取代基键合。