公开(公告)号：US20050202763A1

公开(公告)日：2005-09-15

申请号：US10797315

申请日：2004-03-09

Applicant: Ping-Hsu Chen ,  Chao-Jung Chang ,  Jui-Cheng Lo ,  Yu-Liang Lin ,  Shang-Ting Tsai ,  Ping Chuang

Inventor： Ping-Hsu Chen ,  Chao-Jung Chang ,  Jui-Cheng Lo ,  Yu-Liang Lin ,  Shang-Ting Tsai ,  Ping Chuang

IPC: B24B1/00

CPC classification number: B24B57/02 ,  B24B37/044

Abstract: A method and system for delivering a mixed slurry for use chemical mechanical polishing operation. A first slurry may be mixed with a second slurry to provide a mixed slurry thereof. A flow rate and a mixing ratio associated with the mixed slurry can be controlled to provide an accurate flow rate control and adjustable mixing ratio thereof. The first slurry and the second slurry may be mixed in-line utilizing an in-line mixing mechanism to provide a mixed slurry thereof. Alternatively, the first and second slurries may be pre-mixed utilizing a pre-mixing mechanism to provide a mixed slurry there.

Abstract translation: 一种用于输送用于化学机械抛光操作的混合浆料的方法和系统。 可以将第一浆料与第二浆料混合以提供其混合浆料。 可以控制与混合浆料相关的流速和混合比，以提供精确的流速控制和可调混合比。 可以使用在线混合机构将第一浆料和第二浆料在线混合以提供其混合浆料。 或者，第一和第二浆料可以使用预混合机构预混合以在其中提供混合浆料。

公开(公告)号：US20060084288A1

公开(公告)日：2006-04-20

申请号：US10969369

申请日：2004-10-19

Applicant: Ping Chuang ,  Li-Sen Chen ,  Chien-Yu Hsu

Inventor： Ping Chuang ,  Li-Sen Chen ,  Chien-Yu Hsu

IPC: H01R12/00

CPC classification number: H05K3/326 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10378

Abstract: An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.

Abstract translation: LGA连接器用于连接LGA封装和印刷电路板。 LGA连接器包括具有多个通孔的弹性体。 金属膜形成在通孔的内壁上，并在其上部和下部开口的嘴部周围张开。 金属膜通过真空金属化，溅射，化学镀，电镀或PVD形成。 通孔具有漏斗形形状以吸收外部应力并且重定向应力以收缩通孔直径。 此外，金属膜的弹性变形大于常规金属导电填料，从而提高可靠性。

公开(公告)号：US20050106895A1

公开(公告)日：2005-05-19

申请号：US10715326

申请日：2003-11-17

Applicant: Yu-Liang Lin ,  Ping Chuang ,  Mei-Sheng Zhou

Inventor： Yu-Liang Lin ,  Ping Chuang ,  Mei-Sheng Zhou

IPC: G06F17/00 ,  H01L21/31 ,  H01L21/316 ,  H01L21/469 ,  H01L21/76 ,  H01L21/768

CPC classification number: H01L21/02238 ,  H01L21/02255 ,  H01L21/31675 ,  H01L21/76801

Abstract: The present disclosure provides for a method and system for fabricating an insulating layer on a substrate. The method and system provide a fluid to a substrate, wherein the fluid is provided in an aerosol form. The method and system also provides for generating a supercritical process environment proximate to the substrate. The method and system further provides a proximate supercritical process environment having a supercritical process temperature and a supercritical process pressure for altering the fluid, and placing the substrate in contact with the altered fluid, wherein the insulating layer is formed on the substrate by a reaction between the substrate and the fluid.

Abstract translation: 本公开提供了用于在基板上制造绝缘层的方法和系统。 该方法和系统向基材提供流体，其中流体以气溶胶形式提供。 该方法和系统还提供用于生成靠近基底的超临界过程环境。 该方法和系统还提供了一种具有超临界过程温度和超临界过程压力的邻近超临界过程环境，用于改变流体，并使衬底与改变的流体接触，其中绝缘层通过 基材和流体。

公开(公告)号：US07129151B2

公开(公告)日：2006-10-31

申请号：US10701802

申请日：2003-11-04

Applicant: Ping Chuang ,  Henry Lo ,  Mei Shang Zhou

Inventor： Ping Chuang ,  Henry Lo ,  Mei Shang Zhou

IPC: H01L21/20

CPC classification number: H01L21/7684 ,  H01L21/0217 ,  H01L21/02274 ,  H01L21/31053 ,  H01L21/3185 ,  H01L21/76229 ,  H01L21/76829

Abstract: A planarizing method for forming a patterned planarized aperture fill layer within an aperture employs a planarizing stop layer formed of a reductant based material, such as but not limited to a hydrogenated silicon nitride material. The reductant based material provides the planarizing stop layer with enhanced planarizing stop properties. The method is particularly useful within the context of CMP planarizing methods.

Abstract translation: 用于在孔内形成图案化的平坦化孔填充层的平面化方法采用由还原剂基材料形成的平坦化阻挡层，例如但不限于氢化氮化硅材料。 基于还原剂的材料提供具有增强的平坦化停止性质的平坦化停止层。 该方法在CMP平面化方法的上下文中是特别有用的。

公开(公告)号：US20050158664A1

公开(公告)日：2005-07-21

申请号：US10760927

申请日：2004-01-20

Applicant: Joshua Tseng ,  Ping Chuang ,  Hung-Jung Tu ,  Ching-Ya Wang ,  Yu-Liang Lin ,  Henry Lo ,  Mei-Sheng Zhou

Inventor： Joshua Tseng ,  Ping Chuang ,  Hung-Jung Tu ,  Ching-Ya Wang ,  Yu-Liang Lin ,  Henry Lo ,  Mei-Sheng Zhou

IPC: G03F7/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/311 ,  H01L21/768 ,  H01L23/52

CPC classification number: H01L21/76802 ,  G03F7/422 ,  G03F7/423 ,  G03F7/425 ,  G03F7/426 ,  H01L21/31116 ,  H01L21/31133 ,  H01L21/31144 ,  H01L21/76877

Abstract: A method of integrating a post-etching cleaning process with deposition for a semiconductor device. A substrate having a damascene structure formed by etching a dielectric layer formed thereon using an overlying photoresist mask as an etching mask is provided. A cleaning process is performed by a supercritical fluid to remove the photoresist mask and post-etching by-products. An interconnect layer is formed in-situ in the damascene structure using the supercritical fluid as a reaction medium, wherein the cleaning process and the subsequent interconnect layer formation are performed in one process chamber or in different process chambers of a processing tool.

Abstract translation: 将后蚀刻清洗工艺与用于半导体器件的沉积集成的方法。 提供具有通过使用覆盖光致抗蚀剂掩模蚀刻形成在其上的介电层作为蚀刻掩模形成的镶嵌结构的基板。 通过超临界流体进行清洁处理以除去光致抗蚀剂掩模和后蚀刻副产物。 使用超临界流体作为反应介质，在镶嵌结构中原位形成互连层，其中清洁工艺和随后的互连层形成在一个处理室中或在处理工具的不同处理室中进行。

公开(公告)号：US20050130449A1

公开(公告)日：2005-06-16

申请号：US10797318

申请日：2004-03-10

Applicant: Ping Chuang ,  Yu-Liang Lin ,  Mei-Sheng Zhou

Inventor： Ping Chuang ,  Yu-Liang Lin ,  Mei-Sheng Zhou

IPC: B01J3/00 ,  H01L21/02 ,  H01L21/28 ,  H01L21/314 ,  H01L21/316 ,  H01L29/51 ,  H01L21/31 ,  H01L21/469

CPC classification number: H01L21/28202 ,  B01J3/008 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/3144 ,  H01L21/31675 ,  H01L21/31679 ,  H01L28/40 ,  H01L29/513 ,  H01L29/518 ,  Y02P20/544

Abstract: A method of forming an oxide layer. A fluid, such as water, is heated and pressurized to supercritical or near-supercritical conditions and mixed with at least one oxidizing agent. The supercritical state mixture of the fluid and at least one oxidizing agent is then applied on the workpiece, forming an oxide layer on the workpiece. The at least one oxidizing agent may comprise nitrogen, and the oxide layer formed on the workpiece may comprise a nitrogen doped oxide.

Abstract translation: 一种形成氧化物层的方法。 将诸如水的流体加热并加压至超临界或近临界条件并与至少一种氧化剂混合。 然后将流体和至少一种氧化剂的超临界状态混合物施加到工件上，在工件上形成氧化物层。 至少一种氧化剂可以包含氮，并且在工件上形成的氧化物层可以包括氮掺杂的氧化物。

公开(公告)号：US20050095864A1

公开(公告)日：2005-05-05

申请号：US10701802

申请日：2003-11-04

Applicant: Ping Chuang ,  Henry Lo ,  Mei Shang Zhou

Inventor： Ping Chuang ,  Henry Lo ,  Mei Shang Zhou

IPC: H01L21/3105 ,  H01L21/318 ,  H01L21/762 ,  H01L21/768 ,  C23F1/00 ,  H01L21/306 ,  H01L21/461

CPC classification number: H01L21/7684 ,  H01L21/0217 ,  H01L21/02274 ,  H01L21/31053 ,  H01L21/3185 ,  H01L21/76229 ,  H01L21/76829

Abstract: A planarizing method for forming a patterned planarized aperture fill layer within an aperture employs a planarizing stop layer formed of a reductant based material, such as but not limited to a hydrogenated silicon nitride material. The reductant based material provides the planarizing stop layer with enhanced planarizing stop properties. The method is particularly useful within the context of CMP planarizing methods.

Abstract translation: 用于在孔内形成图案化的平坦化孔填充层的平面化方法采用由还原剂基材料形成的平坦化阻挡层，例如但不限于氢化氮化硅材料。 基于还原剂的材料提供具有增强的平坦化停止性质的平坦化停止层。 该方法在CMP平面化方法的上下文中是特别有用的。

公开(公告)号：US06884149B2

公开(公告)日：2005-04-26

申请号：US10833720

申请日：2004-04-27

Applicant: Shang-Ting Tsai ,  Ping Chuang ,  Henry Lo ,  Chao-Jung Chang ,  Ping-Hsu Chen ,  Yu-Liang Lin ,  Yu-Huei Chen ,  Ai-Sen Liu ,  Syun-Ming Jang

Inventor： Shang-Ting Tsai ,  Ping Chuang ,  Henry Lo ,  Chao-Jung Chang ,  Ping-Hsu Chen ,  Yu-Liang Lin ,  Yu-Huei Chen ,  Ai-Sen Liu ,  Syun-Ming Jang

IPC: B24B37/04 ,  B24B49/12 ,  B24B1/00

CPC classification number: B24B57/02 ,  B24B37/042 ,  B24B49/12

Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

Abstract translation: 一种用于监测在化学机械抛光操作中使用的浆料的质量的方法和系统。 在化学机械抛光操作期间，浆料通常通过管状路径输送。 激光通常从激光源传输，使得激光在化学机械抛光操作期间与浆料接触。 然后可以在激光与浆料接触之后检测激光，从而监测在化学机械抛光操作期间所利用的浆料的质量。 与浆料接触的激光也可用于监测与浆料相关的混合比例。

公开(公告)号：US20070153669A1

公开(公告)日：2007-07-05

申请号：US11472287

申请日：2006-06-22

Applicant: Ping Chuang

Inventor： Ping Chuang

IPC: G11B7/24

CPC classification number: G02B5/045

Abstract: The present invention provides a method of adjusting light diffusing and light focusing capability of an optical element. First, an optical substrate having a first surface area is provided. Then, pluralities of pervious convexes are formed on an optical substrate, wherein the pervious convexes occupy a second surface area on the optical substrate. Diffusing effect of the optical element can be lowered/improved by increasing/decreasing an arrangement regularity of the pervious convexes. Diffusing effect enlarging/reducing the size of the optical element can also be lowered/increased by enlarging/reducing the size of pervious convexes. The focusing effects of the optical element can be improved/lowered by increasing/decreasing the ratio of the second surface area and the first surface area.

Abstract translation: 本发明提供一种调整光学元件的光散射和聚焦能力的方法。 首先，提供具有第一表面积的光学基片。 然后，在光学基板上形成多个可透过凸部，其中透光凸部占据光学基板上的第二表面区域。 可以通过增加/减少透光性凸起的布置规律来降低/改善光学元件的扩散效果。 扩大/减小光学元件尺寸的扩散效应也可以通过扩大/减小透光凸块的尺寸来降低/增加。 可以通过增加/减少第二表面积和第一表面积的比例来改善/降低光学元件的聚焦效果。

公开(公告)号：US20070153391A1

公开(公告)日：2007-07-05

申请号：US11472289

申请日：2006-06-22

Applicant: Ping Chuang

Inventor： Ping Chuang

IPC: G02B27/10

CPC classification number: G02B3/0056 ,  G02B3/0031 ,  G02B3/0062 ,  G02B6/0053 ,  G02F1/133615 ,  G02F2001/133507 ,  G02F2001/133607

Abstract: An optical module is provided. The optical module comprises a light source, a first lens array and a second lens array. The first lens array is located on the light source and the second lens array is located on the first lens array. There are a plurality of curved bumps on the surface of the first lens array. There are a plurality of pyramid bumps on the surface of the second lens array.

Abstract translation: 提供光模块。 光学模块包括光源，第一透镜阵列和第二透镜阵列。 第一透镜阵列位于光源上，第二透镜阵列位于第一透镜阵列上。 在第一透镜阵列的表面上存在多个弯曲凸块。 在第二透镜阵列的表面上有多个金字塔凸块。