Spin treatment apparatus
    81.
    发明授权
    Spin treatment apparatus 有权
    旋转治疗仪

    公开(公告)号:US09454080B2

    公开(公告)日:2016-09-27

    申请号:US14491065

    申请日:2014-09-19

    Inventor: Masaaki Furuya

    CPC classification number: G03F7/162 G03F7/3021 G03F7/42 H01L21/68728

    Abstract: A spin treatment apparatus according to an embodiment performs a treatment while rotating a substrate and includes: at least three clamp pins configured to contact an outer peripheral surface of the substrate and clamp the substrate; rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator parallel with a rotation axis of the substrate; magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; rotation magnets provided for the respective magnet gears and positioned to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the rotation magnets along the rotation axes of the pin rotators.

    Abstract translation: 根据实施例的旋转处理装置在旋转基板的同时执行处理,并且包括:至少三个夹持销,其构造成接触基板的外周表面并夹持基板; 为相应的夹紧销提供的可旋转的针式转子,并且每个构造成将相应的夹紧销保持在与转子的旋转轴线偏置的位置,该位置与衬底的旋转轴线平行; 磁轮齿轮围绕其外周表面设置用于相应的销转子,并且每个具有围绕销转子的旋转轴线螺旋形成的磁极部分; 设置在各磁铁上的旋转磁铁,定位成吸引并被相应磁齿轮的磁极部吸引; 以及移动机构,其构造成沿着所述销转子的旋转轴线移动所述旋转磁体。

    SUCTION STAGE, LAMINATION DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE
    82.
    发明申请
    SUCTION STAGE, LAMINATION DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE 审中-公开
    吸收级,层压装置和制造层压基板的方法

    公开(公告)号:US20160225655A1

    公开(公告)日:2016-08-04

    申请号:US15021516

    申请日:2014-09-24

    Abstract: According to the embodiment, a suction stage includes a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a first wall part provided on an outer peripheral side of one end surface of the mounting section and shaped like a ring, and a second wall part provided inside the first wall part and shaped like a ring. The evacuation section includes a first control valve provided between the evacuation section and a first region between the first wall part and the second wall part, a second control valve provided between the evacuation section and a second region inside the second wall part, and a control section configured to control the first control valve and the second control valve. The control section is configured to control the first control valve and the second control valve so that suction of the first substrate and deactivation of the suction of the first substrate are alternately performed in at least one of the first region and the second region. While the suction of the first substrate is deactivated in one of the first region and the second region, the suction of the first substrate is performed in the other region.

    Abstract translation: 根据本实施方式,吸入台具备:搭载第一基板的安装部和构成为在第一基板与安装部之间抽空的排气部。 安装部包括:第一壁部,其设置在安装部的一个端面的外周侧,成形为环状;第二壁部,设置在第一壁部的内部,形状为环状。 排气部包括设置在排气部与第一壁部与第二壁部之间的第一区域之间的第一控制阀,设置在排气部与第二壁部内部的第二区域之间的第二控制阀, 该部分被配置为控制第一控制阀和第二控制阀。 控制部被配置为控制第一控制阀和第二控制阀,使得在第一区域和第二区域中的至少一个中交替地执行第一基板的吸入和第一基板的抽吸的停用。 当在第一区域和第二区域中的一个区域中第一基板的抽吸被停用时,第一基板的吸力在另一区域中执行。

    Ultrasonic bonding apparatus
    83.
    发明授权
    Ultrasonic bonding apparatus 有权
    超声波接合装置

    公开(公告)号:US08997815B2

    公开(公告)日:2015-04-07

    申请号:US14206562

    申请日:2014-03-12

    CPC classification number: B23K20/10 B06B1/0253 B06B3/00 B29C65/08

    Abstract: According to one embodiment, an ultrasonic bonding apparatus includes an ultrasonic transducer, a distal-end tool, an ultrasonic horn and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and a control device. The ultrasonic oscillator applies the voltage oscillated by the oscillation circuit to the ultrasonic transducer. The control device is configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.

    Abstract translation: 根据一个实施例,超声波接合装置包括超声波换能器,远端工具,超声波喇叭和超声波振荡器。 超声波振荡器包括振荡电路和控制装置。 超声波振荡器将由振荡电路振荡的电压施加到超声波换能器。 控制装置被配置为根据从振荡电路提供的电压和电流来检测电压反射比,并且控制由振荡电路产生的电压的频率,从而使电压反射率最小化。

    ULTRASONIC BONDING APPARATUS
    84.
    发明申请
    ULTRASONIC BONDING APPARATUS 有权
    超声波接合装置

    公开(公告)号:US20140283996A1

    公开(公告)日:2014-09-25

    申请号:US14206562

    申请日:2014-03-12

    CPC classification number: B23K20/10 B06B1/0253 B06B3/00 B29C65/08

    Abstract: According to one embodiment, an ultrasonic bonding apparatus includes an ultrasonic transducer, a distal-end tool, an ultrasonic horn and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and a control device. The ultrasonic oscillator applies the voltage oscillated by the oscillation circuit to the ultrasonic transducer. The control device is configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.

    Abstract translation: 根据一个实施例,超声波接合装置包括超声波换能器,远端工具,超声波喇叭和超声波振荡器。 超声波振荡器包括振荡电路和控制装置。 超声波振荡器将由振荡电路振荡的电压施加到超声波换能器。 控制装置被配置为根据从振荡电路提供的电压和电流来检测电压反射比,并且控制由振荡电路产生的电压的频率,从而使电压反射率最小化。

    BONDING APPARATUS AND BONDING PROCESS METHOD
    86.
    发明申请
    BONDING APPARATUS AND BONDING PROCESS METHOD 有权
    连接装置和接合工艺方法

    公开(公告)号:US20140182761A1

    公开(公告)日:2014-07-03

    申请号:US14138196

    申请日:2013-12-23

    Abstract: According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.

    Abstract translation: 根据一个实施例,用于处理保留基板的接合装置包括主体单元,喷嘴,气体供应单元和基板支撑单元。 喷嘴在保持第一基板的一侧在主体单元的表面上开口。 气体供给单元构造成向喷嘴供给气体,以向第一基板施加吸力并将基板与主体单元的表面分离。 衬底支撑单元构造成以预定的间隙支撑设置成与第一衬底相对的第二衬底的外围边缘部分。

    ILLUMINATION SYSTEM, ILLUMINATION METHOD, AND INSPECTION SYSTEM
    87.
    发明申请
    ILLUMINATION SYSTEM, ILLUMINATION METHOD, AND INSPECTION SYSTEM 审中-公开
    照明系统,照明方法和检查系统

    公开(公告)号:US20130169795A1

    公开(公告)日:2013-07-04

    申请号:US13729434

    申请日:2012-12-28

    CPC classification number: H05B37/02 H05B41/3928 Y02B20/202

    Abstract: An illumination system includes a first illumination unit which uses an amount of illumination light in accordance with a set amount of light to illuminate an illuminated object, a second illumination unit which has a response to switching of the set amount of light better than said first illumination unit and which uses illumination light which is superposed on the illumination light from said first illumination unit to illuminate said illuminated object, and an illumination controller which controls the amount of illumination light of said second illumination unit by switching the set amount of light in accordance with the control information while maintaining the amount of illumination light of said first illumination unit at a predetermined amount.

    Abstract translation: 照明系统包括:第一照明单元,其使用根据设定量的照明照明物体的照明光量;第二照明单元,其对所设定的光量的转换比所述第一照明更好地响应 并且其使用重叠在来自所述第一照明单元的照明光上以照亮所述被照明物体的照明光;照明控制器,其通过根据所述第一照明单元切换所述设定光量来控制所述第二照明单元的照明光量 控制信息,同时将所述第一照明单元的照明光量保持在预定量。

    Method of bonding substrates and apparatus for bonding substrates
    88.
    发明申请
    Method of bonding substrates and apparatus for bonding substrates 审中-公开
    接合基板的方法和用于接合基板的装置

    公开(公告)号:US20040261930A1

    公开(公告)日:2004-12-30

    申请号:US10786402

    申请日:2004-02-25

    Inventor: Shinichi Ogimoto

    Abstract: There is disclosed a method comprising bonding two substrates to each other by a sealing agent, obtaining a positional shift amount between the bonded two substrates, and moving at least one of the two substrates by a correction movement amount obtained by multiplying the positional shift amount by a correction coefficient larger than 1 to correct the positional shift amount between these two substrates.

    Abstract translation: 公开了一种方法,包括通过密封剂将两个基板彼此粘合,获得接合的两个基板之间的位置偏移量,并且通过将位置偏移量乘以 校正系数大于1,以校正这两个基板之间的位置偏移量。

    Liquid crystal dropping apparatus and method
    89.
    发明申请
    Liquid crystal dropping apparatus and method 审中-公开
    液晶滴下装置及方法

    公开(公告)号:US20040156989A1

    公开(公告)日:2004-08-12

    申请号:US10649700

    申请日:2003-08-28

    Inventor: Shinichi Ogimoto

    CPC classification number: G02F1/1341 G02F2001/13415

    Abstract: A liquid crystal dropping apparatus is capable of achieving a high-speed liquid crystal dropping operation and of improving the productivity. The liquid crystal dropping apparatus 10 includes a container 40 for containing a liquid crystal L, a liquid crystal dispensing device 20 for dropping the liquid crystal L contained in the container 40 on a substrate 1, and a stage-moving device 12 for moving the substrate 1 relative to the liquid crystal dispensing device 20. The liquid crystal dispensing device 20 includes a sucking means (suction port 21 and such) for taking out from the container 40 a quantity of the liquid crystal L corresponding to a quantity of the liquid crystal L to be dropped, a temporary storage means (storage chambers 22) for temporarily storing the liquid crystal L taken out from the container 40, and a discharge means (discharge port 23 and such) for discharging the temporarily stored liquid crystal L.

    Abstract translation: 液晶滴下装置能够实现高速液晶滴下操作并提高生产率。 液晶滴下装置10包括用于容纳液晶L的容器40,用于将容纳在容器40中的液晶L滴落在基板1上的液晶分配装置20和用于移动基板的载物台移动装置12 液晶分配装置20包括用于从容器40取出与液晶L的量对应的液晶L的吸引装置(吸入口21等) 用于临时存储从容器40取出的液晶L的临时存储装置(存储室22)和用于排出临时储存的液晶L的排出装置(排出口23等)。

    Substrates laminating apparatus and method
    90.
    发明申请
    Substrates laminating apparatus and method 失效
    基板层压装置及方法

    公开(公告)号:US20030205333A1

    公开(公告)日:2003-11-06

    申请号:US10385856

    申请日:2003-03-12

    Abstract: At least when an upper glass substrate 3 held by an upper retention head 10 and a lower glass substrate 4 held by a lower retention head 11 are abutted on each other through a sealing material 5, air cylinders 25, 25 apply a lifting force balancing with a dead weight of the upper retention head 10 to the upper retention head 10 to cancel its dead weight. In this state, the upper glass substrate 3 and the lower glass substrate 4 are abutted on each other through the sealing material 5.

    Abstract translation: 至少当由上保持头10保持的上玻璃基板3和由下保持头11保持的下玻璃基板4通过密封材料5彼此抵接时​​,气缸25,25施加与 将上保持头10固定到上保持头10以取消其自重。 在这种状态下,上玻璃基板3和下玻璃基板4通过密封材料5彼此抵接。

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