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    Electrochemical Fabrication Method and Application for Producing Three-Dimensional Structures Having Improved Surface Finish
    82.
    发明申请
    Electrochemical Fabrication Method and Application for Producing Three-Dimensional Structures Having Improved Surface Finish 审中-公开
    电化学制造方法及应用于生产具有改进表面光洁度的三维结构

    公开(公告)号：US20090084756A1

    公开(公告)日：2009-04-02

    申请号：US12242802

    申请日：2008-09-30

    申请人： Adam L. Cohen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： C23F1/00 ,  C25D5/02

    CPC分类号： C25D5/02 ,  B81C1/00373 ,  B81C2201/019 ,  C23F1/00 ,  C25D1/003 ,  H01P11/003

    摘要： An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or conditioning operations are varied between layers or between different portions of a layer such that different surface qualities are obtained. In other embodiments varying surface quality may be obtained without varying removal or conditioning operations but instead by relying on differential interaction between removal or conditioning operations and different materials encountered by these operations.

    摘要翻译： 电化学制造工艺从多个沉积材料层产生三维结构（例如组件或器件），其中通过去除沉积材料的选定表面的材料或条件的操作产生一些层的至少一些部分的形成。 在一些实施例中，去除或调节操作在层之间或层的不同部分之间变化，使得获得不同的表面质量。 在其它实施例中，可以在不改变去除或调节操作的情况下获得变化的表面质量，而是通过依赖于去除或调节操作与这些操作遇到的不同材料之间的差异相互作用。

    Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures
    83.
    发明申请
    Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures 审中-公开
    不适合的面罩和形成三维结构的方法和装置

    公开(公告)号：US20080230392A1

    公开(公告)日：2008-09-25

    申请号：US12055188

    申请日：2008-03-25

    申请人： Adam L. Cohen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： C25D5/02

    CPC分类号： B81C1/00182 ,  B33Y10/00

    摘要： Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).

    摘要翻译： 电化学制造技术用于修饰衬底或从多个覆盖和粘附层形成多层结构（例如组件或器件）。 掩模用于选择性地蚀刻或沉积材料。 一些掩模可以是接触型并且可以由多种材料形成，其中一些可以是支撑材料，其中一些可以是用于接触基底的配合材料，一些可以是中间材料。 在一些实施例中，接触掩模可以具有适形的接触表面（即具有足够的柔性或可变形性的表面，使得它们可以基本上符合基底的表面以与其形成密封），或者它们可以具有半刚性或甚至刚性的表面。 在掩模用于选择性沉积操作的实施例中，可以在沉积之后执行蚀刻操作以去除闪蒸沉积物（来自旨在被掩蔽的区域的不希望的沉积物）。

    Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials
    84.
    发明授权
    Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials 有权
    用于电化学制造多层结构的方法，包括掺入所选材料的无掩模，图案化，多层厚度沉积的区域

    公开(公告)号：US07384530B2

    公开(公告)日：2008-06-10

    申请号：US10841001

    申请日：2004-05-07

    申请人： Adam L. Cohen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： C25D5/02 ,  C25D5/48

    CPC分类号： B81C1/00126 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/032 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

    摘要： The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques. In certain embodiments, the apparatuses of the invention include structures having non-layered elements, retained sacrificial materials, three or more different deposited materials, and interlaced elements.

    摘要翻译： 本发明包括制造方法和装置。 在申请人的发明的至少一些实施例中，所述方法包括以下过程：无掩模地选择性沉积非分层结构，选择性蚀刻和/或沉积，而不使用单独的掩模和/或光刻技术，保留牺牲材料的选定部分 在牺牲材料的其它部分的去除（例如蚀刻）期间，沉积除结构和牺牲材料之外的材料，包括多于一种类型的结构和/或牺牲材料，以及制造隔行元件。 本发明的方法的实施例通过电沉积或其他技术提供增强的能力，性质，柔性和制造三维结构。 在某些实施例中，本发明的装置包括具有非层状元件，保留的牺牲材料，三种或更多种不同沉积材料和隔行元件的结构。

    Micro-scale and meso-scale hydraulic and pneumatic tools, methods for using, and methods for making
    85.
    发明授权
    Micro-scale and meso-scale hydraulic and pneumatic tools, methods for using, and methods for making 有权
    微尺度和中尺度液压和气动工具，使用方法和制造方法

    公开(公告)号：US08241228B1

    公开(公告)日：2012-08-14

    申请号：US12139445

    申请日：2008-06-13

    申请人： Adam L. Cohen ,  Chris R. Folk ,  Richard T. Chen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Chris R. Folk ,  Richard T. Chen ,  Dennis R. Smalley

    IPC分类号： A61B5/00

    CPC分类号： A61B17/3201 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/00539 ,  A61B2017/00544 ,  Y10T403/7011

    摘要： Embodiments are directed to micro-scale or meso-scale hydraulically or pneumatically actuated devices, methods for forming such devices using multi-layer, multi-material electrochemical fabrication methods and particularly fabricating (i.e. building up) a plurality of components of devices that are moveable relative to one another in pre-assembled configurations wherein special features are designed into the devices (e.g. wide gaps in fabrication positions and narrowed gaps in working regions of component movement, mechanisms that inhibit the return of device components to fabrication positions after being moved into working regions, used of cylindrical interference and/or checkerboard bushings, etching holes in selected locations to allow removal of sacrificial material) to allow such fabrication to occur without violating intra-layer minimum feature size constraints while still obtaining effective gaps between components that are smaller than the minimum features size limits. Particular applications of such devices involve medical applications and in particular minimally invasive procedures where devices would be moved into a desired working area within a body of a patient via a lumen and then actuated while at the working location.

    摘要翻译： 实施例涉及微尺度或中尺度液压或气动致动装置，使用多层多材料电化学制造方法形成这种装置的方法，并且特别地制造（即，建立）可移动的装置的多个部件 相对于彼此的预组装配置，其中将特殊特征设计到装置中（例如，制造位置中的宽间隙和部件移动的工作区域中的狭窄间隙，阻止装置部件移动到加工后的制造位置的机构 区域，使用圆柱形干涉和/或棋盘衬套，在选定位置蚀刻孔以允许去除牺牲材料），以允许这种制造发生而不违反层内最小特征尺寸约束，同时仍获得小于 最小特征尺寸限制。 这种装置的具体应用涉及医疗应用，特别是微创手术，其中装置将通过内腔移动到患者身体内的期望工作区域中，然后在工作位置被致动。

    Non-conformable masks and methods and apparatus for forming three-dimensional structures
    86.
    发明授权
    Non-conformable masks and methods and apparatus for forming three-dimensional structures 有权
    用于形成三维结构的不合格掩模和方法和装置

    公开(公告)号：US07368044B2

    公开(公告)日：2008-05-06

    申请号：US10724513

    申请日：2003-11-26

    申请人： Adam L. Cohen ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Dennis R. Smalley

    IPC分类号： C25D5/02 ,  B23H3/00

    CPC分类号： B81C1/00182 ,  B33Y10/00

    摘要： Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).

    摘要翻译： 电化学制造技术用于修饰衬底或从多个覆盖和粘附层形成多层结构（例如组件或器件）。 掩模用于选择性地蚀刻或沉积材料。 一些掩模可以是接触型并且可以由多种材料形成，其中一些可以是支撑材料，其中一些可以是用于接触基底的配合材料，一些可以是中间材料。 在一些实施例中，接触掩模可以具有适形的接触表面（即具有足够的柔性或可变形性的表面，使得它们可以基本上符合基底的表面以与其形成密封），或者它们可以具有半刚性或甚至刚性的表面。 在掩模用于选择性沉积操作的实施例中，可以在沉积之后执行蚀刻操作以去除闪蒸沉积物（来自旨在被掩蔽的区域的不希望的沉积物）。

    Multi-step release method for electrochemically fabricated structures
    90.
    发明授权
    Multi-step release method for electrochemically fabricated structures 有权
    电化学制造结构的多步释放方法

    公开(公告)号：US08512578B2

    公开(公告)日：2013-08-20

    申请号：US12892734

    申请日：2010-09-28

    申请人： Adam L. Cohen ,  Michael S. Lockard ,  Dale S. McPherson

    发明人： Adam L. Cohen ,  Michael S. Lockard ,  Dale S. McPherson

    IPC分类号： C25D5/02 ,  B81C1/00

    CPC分类号： C23C18/1689 ,  B33Y10/00 ,  B81C1/0019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G03F7/00

    摘要： Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

    摘要翻译： 多层结构由至少一种结构材料（例如镍）进行电化学制造，其被构造成限定期望的结构并且可以附着到基底上，并且由至少一种围绕期望的材料的牺牲材料（例如铜） 结构体。 在结构形成之后，通过多级蚀刻操作去除牺牲材料。 在一些实施例中，待移除的牺牲材料可以位于基底上或附加部件内的通道等内。 多级蚀刻操作可以通过中间后处理活动来分离，它们可以通过清洁操作或阻隔材料去除操作等分开。 障碍物可以通过与结构材料或基底接触而固定就位，或者它们可以通过牺牲材料单独固定在适当位置，并且因此在所有保留牺牲材料被蚀刻之后可以被自由地去除。