Semiconductor Component with an Emitter Control Electrode
    81.
    发明申请
    Semiconductor Component with an Emitter Control Electrode 有权
    具有发射极控制电极的半导体元件

    公开(公告)号:US20110156095A1

    公开(公告)日:2011-06-30

    申请号:US12977755

    申请日:2010-12-23

    IPC分类号: H01L29/739

    摘要: A semiconductor component includes a first emitter zone of a first conductivity type, a second emitter zone of a second conductivity type, a first base zone arranged between the first and second emitter zones and a first control structure. The first control structure includes a control electrode arranged adjacent the first emitter zone, the control electrode being insulated from the first emitter zone by a first dielectric layer and extending in a current flow direction of the semiconductor component. The first control structure includes a first control connection and at least one first connection zone arranged between the first control connection and the control electrode and comprising a semiconductor material.

    摘要翻译: 半导体部件包括第一导电类型的第一发射极区域,第二导电类型的第二发射极区域,布置在第一和第二发射极区域之间的第一基极区域和第一控制结构。 第一控制结构包括布置在第一发射区附近的控制电极,控制电极通过第一介电层与第一发射区绝缘,并沿着半导体部件的电流流动方向延伸。 第一控制结构包括第一控制连接和布置在第一控制连接和控制电极之间并且包括半导体材料的至少一个第一连接区域。

    Soft Switching Semiconductor Component with High Robustness and Low Switching Losses
    83.
    发明申请
    Soft Switching Semiconductor Component with High Robustness and Low Switching Losses 有权
    具有高稳定性和低开关损耗的软开关半导体元件

    公开(公告)号:US20070278472A1

    公开(公告)日:2007-12-06

    申请号:US11757451

    申请日:2007-06-04

    IPC分类号: H01L29/06

    摘要: A semiconductor component includes a semiconductor body and a second semiconductor zone of a first conductivity type that serves as a rear side emitter. The second semiconductor zone is preceded by a plurality of third semiconductor zones of a second conductivity type that is opposite to the first conductivity type. The third semiconductor zones are spaced apart from one another in a lateral direction. In addition, provided within the semiconductor body is a field stop zone spaced apart from the second semiconductor zone, thereby reducing an electric field in the direction toward the second semiconductor zone.

    摘要翻译: 半导体部件包括半导体主体和用作后侧发射极的第一导电类型的第二半导体区。 第二半导体区域之前是与第一导电类型相反的多个第二导电类型的第三半导体区域。 第三半导体区域在横向彼此间隔开。 此外,设置在半导体本体内的是与第二半导体区间隔开的场阻挡区域,从而减小朝向第二半导体区域的方向的电场。

    Method for Producing a Stop Zone in a Semiconductor Body and Semiconductor Component Having a Stop Zone
    84.
    发明申请
    Method for Producing a Stop Zone in a Semiconductor Body and Semiconductor Component Having a Stop Zone 有权
    用于在半导体体中产生停止区域的方法和具有停止区域的半导体部件

    公开(公告)号:US20060286753A1

    公开(公告)日:2006-12-21

    申请号:US11423026

    申请日:2006-06-08

    IPC分类号: H01L21/336

    摘要: A method for producing a buried stop zone in a semiconductor body and a semiconductor component having a stop zone, has the method steps of: providing a semiconductor body having a first and a second side and a basic doping of a first conduction type, irradiating the semiconductor body via one of the sides with protons, as a result of which protons are introduced into a first region of the semiconductor body situated at a distance from the irradiation side, carrying out a thermal process in which the semiconductor body is heated to a predetermined temperature for a predetermined time duration, the temperature and the duration being chosen such that hydrogen-induced donors are generated both in the first region and in a second region adjacent to the first region in the direction of the irradiation side.

    摘要翻译: 一种用于在半导体本体中制造掩埋阻挡区域的方法和具有停止区域的半导体部件的方法,具有以下方法步骤:提供具有第一和第二侧的半导体本体和第一导电类型的基本掺杂, 半导体本体通过一个侧面具有质子,其结果是将质子引入位于离辐射侧一定距离处的半导体主体的第一区域中,从而进行热处理,其中半导体主体被加热到预定的 温度预定的持续时间,选择温度和持续时间,使得在照射侧的方向上在第一区域和邻近第一区域的第二区域中产生氢诱导的供体。

    Method for producing semiconductor elements
    85.
    发明申请
    Method for producing semiconductor elements 有权
    半导体元件的制造方法

    公开(公告)号:US20060030126A1

    公开(公告)日:2006-02-09

    申请号:US11166768

    申请日:2005-06-24

    摘要: A method for producing semiconductor elements comprises forming a hydrogen-correlated doping in a treatment region The treatment region comprises at least part of a region which (i) lies outside an inner contiguous zone containing an integrated semiconductor circuit arrangement but not the respective associated separating zones and (ii) lies within an outer contiguous zone containing the respective integrated semiconductor circuit arrangement (10) and also the respective associated separating zones.

    摘要翻译: 一种用于制造半导体元件的方法包括在处理区域中形成氢相关掺杂。处理区域包括至少部分区域(i)位于包含集成半导体电路布置的内连续区域之外的区域,但不包括各自相关联的分离区 和(ii)位于包含相应的集成半导体电路装置(10)的外部连续区域中,以及相应的相关联的分离区域。

    Semiconductor diode and IGBT
    86.
    发明申请
    Semiconductor diode and IGBT 有权
    半导体二极管和IGBT

    公开(公告)号:US20050161746A1

    公开(公告)日:2005-07-28

    申请号:US11023040

    申请日:2004-12-23

    摘要: A semiconductor diode (1, 1′) has an anode (2), a cathode (3) and a semiconductor volume (7) provided between anode (2) and cathode (3). A plurality of semiconductor zones (81 to 84) are formed in the semiconductor volume (7), which semiconductor zones are inversely doped with respect to their immediate surroundings, spaced apart from one another and provided in the vicinity of the cathode (3). The semiconductor zones are spaced apart from the cathode (3).

    摘要翻译: 半导体二极管(1,1')具有设置在阳极(2)和阴极(3)之间的阳极(2),阴极(3)和半导体体积(7)。 在半导体体积(7)中形成有多个半导体区域(81〜84),该半导体区域相对于它们的紧邻环境相反地被掺杂,彼此间隔开并设置在阴极(3)附近。 半导体区域与阴极(3)间隔开。

    Semiconductor device with trench structures including a recombination structure and a fill structure
    88.
    发明授权
    Semiconductor device with trench structures including a recombination structure and a fill structure 有权
    具有包括复合结构和填充结构的沟槽结构的半导体器件

    公开(公告)号:US08921931B2

    公开(公告)日:2014-12-30

    申请号:US13487540

    申请日:2012-06-04

    IPC分类号: H01L29/66 H01L29/78

    摘要: A semiconductor body of a semiconductor device includes a doped layer of a first conductivity type and one or more doped zones of a second conductivity type. The one or more doped zones are formed between the doped layer and the first surface of a semiconductor body. Trench structures extend from one of the first and the second opposing surface into the semiconductor body. The trench structures are arranged between portions of the semiconductor body which are electrically connected to each other. The trench structures may be arranged for mitigating mechanical stress, locally controlling charge carrier mobility, locally controlling a charge carrier recombination rate and/or shaping buried diffusion zones.

    摘要翻译: 半导体器件的半导体本体包括第一导电类型的掺杂层和第二导电类型的一个或多个掺杂区。 一个或多个掺杂区形成在半导体本体的掺杂层和第一表面之间。 沟槽结构从第一和第二相对表面之一延伸到半导体本体中。 沟槽结构布置在彼此电连接的半导体本体的部分之间。 沟槽结构可以被布置用于减轻机械应力,局部地控制电荷载流子迁移率,局部地控制电荷载流子复合速率和/或成形掩埋扩散区。

    Semiconductor device including an edge area and method of manufacturing a semiconductor device
    90.
    发明授权
    Semiconductor device including an edge area and method of manufacturing a semiconductor device 有权
    包括边缘区域的半导体器件和制造半导体器件的方法

    公开(公告)号:US08779509B2

    公开(公告)日:2014-07-15

    申请号:US13539959

    申请日:2012-07-02

    IPC分类号: H01L21/14

    摘要: A semiconductor device includes a doped layer which contains a first dopant of a first conductivity type. In the doped layer, a counter-doped zone is formed in an edge area that surrounds an element area of the semiconductor device. The counter-doped zone contains at least the first dopant and a second dopant of a second conductivity type, which is the opposite of the first conductivity type. A concentration of the second dopant is at least 20% and at most 100% of a concentration of the first dopant. The dopants in the counter-doped zone decrease charge carrier mobility and minority carrier lifetime such that the dynamic robustness of the semiconductor device is increased.

    摘要翻译: 半导体器件包括含有第一导电类型的第一掺杂剂的掺杂层。 在掺杂层中,在围绕半导体器件的元件区域的边缘区域中形成反掺杂区域。 反掺杂区至少包含与第一导电类型相反的第二导电类型的第一掺杂剂和第二掺杂剂。 第二掺杂剂的浓度为第一掺杂剂的浓度的至少20%且至多100%。 反掺杂区中的掺杂剂降低了载流子迁移率和少数载流子寿命,从而提高了半导体器件的动态鲁棒性。