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公开(公告)号：US09894754B2
公开(公告)日：2018-02-13
申请号：US15423709
申请日：2017-02-03
Applicant: International Business Machines Corporation
Inventor： Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer, III
IPC: H05K1/02 , C08G18/02 , H01L23/473 , H05K7/20 , H05K13/00 , H01L23/373 , H01L23/34 , H01L23/36 , H01L23/367 , C08G18/61 , H01L23/46 , C08G77/04 , C08G77/14 , F16L11/04 , C08L83/04 , F16L11/12 , C08F126/06 , B29C71/04
CPC classification number: H05K1/0272 , B29C71/04 , C08F126/06 , C08G18/02 , C08G18/022 , C08G18/61 , C08G77/04 , C08G77/14 , C08G77/38 , C08G77/50 , C08L83/04 , C08L83/06 , F16L11/04 , F16L11/12 , H01K13/00 , H01L23/34 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/3737 , H01L23/46 , H01L23/473 , H01L2924/00 , H01L2924/0002 , H05K1/0201 , H05K1/0203 , H05K7/20 , H05K7/20509 , H05K13/00 , Y10T29/49002 , Y10T29/49826 , Y10T428/1341 , Y10T428/1345 , Y10T428/1352 , Y10T428/1386 , Y10T428/139 , Y10T428/1393
Abstract: A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIC) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.
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公开(公告)号：US09888570B2
公开(公告)日：2018-02-06
申请号：US14068655
申请日：2013-10-31
Applicant: International Business Machines Corporation
Inventor： Dylan J. Boday , Joseph Kuczynski
CPC classification number: H05K1/0353 , B32B17/02 , B32B17/064 , C03C25/323 , C08G65/485 , C08L71/00 , C08L71/12 , C08L71/126 , C08L2205/02 , C08L2205/05 , H05K1/0326 , H05K1/0366 , H05K3/025 , H05K2201/0358 , Y10T428/31678 , Y10T442/2992
Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.
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公开(公告)号：US09885659B1
公开(公告)日：2018-02-06
申请号：US15285404
申请日：2016-10-04
Applicant: International Business Machines Corporation
Inventor： Eric J. Campbell , Sarah K. Czaplewski , Joseph Kuczynski , Timothy J. Tofil
Abstract: Method and apparatus for determining a quality or characteristic of connectors in electronic components is provided. Methods include applying a UV-responsive indicator solution active for Pd, Ni, or Cu to a connector on an electrical component; irradiating the connector with UV radiation; detecting a response to the UV radiation; and determining a quality of the connector based on the response to the UV radiation. Apparatus includes an enclosure; a support; a dispenser oriented toward the substrate support; a source of UV-responsive indicator solution active for Pd, Ni, or Cu ions fluidly coupled to the dispenser; a UV source coupled to the enclosure; and a radiation sensor positioned to detect light inside the enclosure.
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公开(公告)号：US09884974B2
公开(公告)日：2018-02-06
申请号：US15154138
申请日：2016-05-13
Applicant: International Business Machines Corporation
Inventor： Joseph Kuczynski , Marvin M. Misgen , Debra Neuman-Horn , Joseph F. Prisco , Kevin J. Przybylski
CPC classification number: C09D11/17 , B41M5/287 , B41M2205/04 , B41M2205/18 , B41M2205/24 , B43K29/05 , C09D11/023 , C09D11/50 , C09D11/54
Abstract: An ink composition includes a fluid and a plurality of microcapsules suspended in the fluid. The fluid includes a first chemical compound that exhibits a first color characteristic in a first pH range and exhibits a second color characteristic in a second pH range, where the first color characteristic is visually distinct from the second color characteristic. A second chemical compound is contained within the microcapsules, such that rupturing at least a subset of the plurality of microcapsules releases the second chemical compound. Releasing the second chemical compound shifts a pH of the fluid from a first pH in the first pH range to a second pH in the second pH range.
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公开(公告)号：US09869983B2
公开(公告)日：2018-01-16
申请号：US14561591
申请日：2014-12-05
Applicant: International Business Machines Corporation
Inventor： Daniel J. Buvid , Eric J. Campbell , Tyler Jandt , Joseph Kuczynski
CPC classification number: G05B15/02 , G01M3/18 , G01M3/40 , H05K1/0201 , H05K7/20218 , H05K2201/064
Abstract: A cooling system cools one or more electrical components on a printed circuit board. A piece of bilayer tubing made of an electrically conductive outer layer and an insulating inner layer. The insulating inner layer separates an electrically conductive coolant fluid from the electrically conductive outer layer. A signal generator is configured to inject an electrical signal into the electrically conductive coolant fluid. A sensor circuit electrically connected to the conductive outer layer is configured to detect the signal in the electrically conductive outer layer.
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Patent Agency Ranking
公开(公告)号：US09859226B1
公开(公告)日：2018-01-02
申请号：US15377924
申请日：2016-12-13
Applicant: International Business Machines Corporation
Inventor： Eric J. Campbell , Sarah K. Czaplewski , Joseph Kuczynski , Timothy J. Tofil , Jason T. Wertz , Jing Zhang
CPC classification number: H01L23/57 , H01L23/06 , H01L23/3107 , H01L23/573
Abstract: Devices and methods for resisting or preventing physical tampering of electronic components are described. A tamper resistant apparatus comprises a tampering sensor having a surface at which a first and second conductive portion are disposed. A core-shell particle (or a plurality of particles) is disposed on the surface of the tampering sensor. The core-shell particle has a liquid metallic core and a shell surrounding the core. When tampering occurs, forces associated with the tampering cause the core-shell particle to rupture. The released liquid metallic core material can form a conductive pathway between the first and second conductive portions of the tampering sensor. The tampering sensor triggers a security response when the first and second conductive portions are electrically connected to each other by the metallic material from the ruptured core-shell particle(s).
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公开(公告)号：US09804216B2
公开(公告)日：2017-10-31
申请号：US15071314
申请日：2016-03-16
Applicant: International Business Machines Corporation
Inventor： Samuel R. Connor , Michael A. Cracraft , Jonathan W. Jackson , Joseph Kuczynski
CPC classification number: G01R29/12 , G01N27/60 , G01R5/28 , G01R15/165 , G01R29/0878 , G01R31/14
Abstract: Embodiments relate to a method, apparatus, and system for passively detecting strength of an electromagnetic field. An electroactive polymer (EAP) is configured with an antenna in communication with an RC circuit. The EAP is positioned proximal to a sensor. In response to receipt of a transient electromagnetic pulse due to an electrostatic discharge, the circuit captures the received pulse and transmits the pulse to the EAP. The EAP reacts to the pulse in the form of a deflection. The magnitude of the deflection correlates to the field strength which caused the received pulse. As deflection of the EAP is communicated to the proximally positioned sensor, a recording of the electrostatic discharge takes place.
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公开(公告)号：US09801271B2
公开(公告)日：2017-10-24
申请号：US15423745
申请日：2017-02-03
Applicant: International Business Machines Corporation
Inventor： Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer, III
IPC: H05K1/02 , H01L23/367 , H01L23/473 , C08G77/38 , C08F126/06 , H01L23/34 , H01K13/00 , H01L23/373 , H01L23/36 , H05K13/00 , H05K7/20 , F16L11/04 , F16L11/12 , H01L23/46 , C08G18/02 , B29C71/04 , C08G77/04 , C08G77/50 , C08G77/14 , C08G18/61 , C08L83/06 , C08L83/04
CPC classification number: H05K1/0272 , B29C71/04 , C08F126/06 , C08G18/02 , C08G18/022 , C08G18/61 , C08G77/04 , C08G77/14 , C08G77/38 , C08G77/50 , C08L83/04 , C08L83/06 , F16L11/04 , F16L11/12 , H01K13/00 , H01L23/34 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/3737 , H01L23/46 , H01L23/473 , H01L2924/00 , H01L2924/0002 , H05K1/0201 , H05K1/0203 , H05K7/20 , H05K7/20509 , H05K13/00 , Y10T29/49002 , Y10T29/49826 , Y10T428/1341 , Y10T428/1345 , Y10T428/1352 , Y10T428/1386 , Y10T428/139 , Y10T428/1393
Abstract: A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIC) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.
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公开(公告)号：US20170291978A1
公开(公告)日：2017-10-12
申请号：US15095842
申请日：2016-04-11
Applicant: International Business Machines Corporation
Inventor： Suraush Q. Khambati , Joseph Kuczynski , Jason T. Wertz
IPC: C08F299/02
CPC classification number: C08F299/02 , B29C31/04 , B29C47/062 , B29C47/10 , B29C47/56 , B29C47/8805 , B29C65/00 , C08G18/62 , C08G81/021 , C08G81/022
Abstract: A process of forming a macromolecular block copolymer includes forming a first high molecular weight polymer using a first extruder of an extruder system that includes multiple extruders. The first extruded high molecular weight polymer has a first length terminating at a joiner of the extruder system and has a first set of material properties along the first length. The process also includes forming a second high molecular weight polymer using a second extruder of the extruder system. The second extruded high molecular weight polymer has a second length terminating at the joiner of the extruder system and has a second set of material properties along the second length. The process further includes bonding the first extruded high molecular weight polymer to the second extruded high molecular weight polymer to form a macromolecular block copolymer having a first segment of the first length and a second segment of the second length.
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公开(公告)号：US20170269144A1
公开(公告)日：2017-09-21
申请号：US15071314
申请日：2016-03-16
Applicant: International Business Machines Corporation
Inventor： Samuel R. Connor , Michael A. Cracraft , Jonathan W. Jackson , Joseph Kuczynski
CPC classification number: G01R29/12 , G01N27/60 , G01R5/28 , G01R15/165 , G01R29/0878 , G01R31/14
Abstract: Embodiments relate to a method, apparatus, and system for passively detecting strength of an electromagnetic field. An electroactive polymer (EAP) is configured with an antenna in communication with an RC circuit. The EAP is positioned proximal to a sensor. In response to receipt of a transient electromagnetic pulse due to an electrostatic discharge, the circuit captures the received pulse and transmits the pulse to the EAP. The EAP reacts to the pulse in the form of a deflection. The magnitude of the deflection correlates to the field strength which caused the received pulse. As deflection of the EAP is communicated to the proximally positioned sensor, a recording of the electrostatic discharge takes place.
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