摘要:
A nonvolatile memory device includes a device isolation layer defining an active region protruding from a semiconductor substrate and an active region separation layer isolating the active region into first and second active regions spaced apart from each other. The active region separation layer is narrower than the device isolation layer. Moreover, the nonvolatile memory device further includes first and second memory cells formed in the first and second active regions, respectively.
摘要:
Disclosed herein is a charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same. The charge trap-type 3-level non-volatile semiconductor memory device includes a memory array including a plurality of memory elements, each capable of storing data in at least two charge trap regions depending on the direction of current flow, and a page buffer driven to map three data bits to threshold voltage groups of the two charge trap regions. The charge trap-type non-volatile semiconductor memory device has charge trap regions each storing 1.5 bits of data. That is, a single memory element has charge trap regions for storing 3 bits of data, thereby improving device integration while maintaining a high operating speed during programming and reading operations.
摘要:
A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
摘要:
Semiconductor devices and methods of forming devices that have field oxides in trenches are disclosed. According to the methods, a semiconductor substrate is prepared. An upper trench is formed at a predetermined region of the semiconductor substrate and a bottom trench is formed at a bottom surface of the upper trench. A field oxide is formed to fill the bottom trench and the upper trench. At this time, the upper trench has a wider width than the bottom trench.
摘要:
Floating trap non-volatile memory devices and methods are provided. The memory devices include a semiconductor substrate and an adjacent gate electrode. Between the substrate and the gate electrode may be a tunneling insulating layer having a first dielectric constant, a blocking insulating layer having a second dielectric constant that is greater than the first dielectric constant, and a charge storage layer.
摘要:
Floating trap non-volatile memory devices and methods are provided. The memory devices include a semiconductor substrate and an adjacent gate electrode. Between the substrate and the gate electrode may be a tunneling insulating layer having a first dielectric constant, a blocking insulating layer having a second dielectric constant that is greater than the first dielectric constant, and a charge storage layer.
摘要:
A semiconductor memory device having a dummy active region is provided, which includes a plurality of parallel main active regions and a dummy active region coupled to ends of the main active regions. The main preferably active regions are arranged in a main memory cell array region and extend to or through a dummy cell array region surrounding the main memory cell array region. Further, the dummy active region is perpendicular to the main active regions. A redundancy cell array region may intervene between the main memory cell array region and the dummy cell array region. In this case, the main active regions are extended to the dummy cell array region through the redundancy cell array region.
摘要:
A NAND-type flash memory device for preventing punchthrough and a method for forming the same are provided. The NAND-type flash memory device includes a string selection transistor, a plurality of cell memory transistors, and a ground selection transistor being sequentially connected in series. The device further includes a bitline contact connected to a drain region of the string selection transistor, and a common source line connected to a source region of the ground selection transistor. Impurities are heavily doped to a drain-to-channel interface in the string selection transistor and a channel-to-source interface in the ground selection transistor, forming pockets for preventing punchthrough. The pockets are preferably formed using a tilted ion implantation using the vertical gate structures as masks.
摘要:
A memory cell array of a non-volatile semiconductor memory device includes unit strings grouped into first strings belonging to a first string group and second strings belonging to a second string group. Each unit string has a memory cells for storing data in a non-volatile state. Each first string is coupled between an associated bit line of a first bit line group and a first common source line whereas each second string is coupled between an associated bit line of a second bit line group and a second common source line. The bit lines and the common source lines are made of different conductive layers. In accordance with the invention, it is possible to achieve a less critical layout of sense amplifiers coupled to bit lines while easily performing a photolithography process as required in the manufacture of the memory device.
摘要:
A method for manufacturing a mask-ROM comprises a first process of forming a spacer on a side wall of a gate electrode; a second process of eliminating the spacer disposed on the side wall of the gate electrode of an on-cell; and a third process of doping impurity on the entire surface of a semiconductor substrate formed in the preceding process.