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235 条记录 (耗时 0.027 秒)

    Thermoplastic molding materials based on partly aromatic poly-amides and polyetherimides
    81.
    发明授权
    Thermoplastic molding materials based on partly aromatic poly-amides and polyetherimides 失效
    基于部分芳族聚酰胺和聚醚酰亚胺的热塑性成型材料

    公开(公告)号：US5780576A

    公开(公告)日：1998-07-14

    申请号：US631096

    申请日：1996-04-12

    申请人： Martin Weber ,  Herbert Fisch ,  Gunter Pipper ,  Axel Gottschalk

    发明人： Martin Weber ,  Herbert Fisch ,  Gunter Pipper ,  Axel Gottschalk

    IPC分类号： C08L71/00 ,  C08L77/00 ,  C08L77/06 ,  C08L79/08 ,  C08G69/08 ,  C08G73/10

    CPC分类号： C08L77/00 ,  C08L71/00 ,  C08L77/06 ,  C08L79/08 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/31721

    摘要： Thermoplastic molding materials contain A) from 1 to 99% by weight of a partly aromatic copolyamide composed of a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid, a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid, a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine and a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, B) from 1 to 99% by weight of a polyetherimide, C) from 0 to 30% by weight of a polymeric component having OH groups, D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, E) from 0 to 40% by weight of rubber impact modifiers and F) from 0 to 40% by weight of conventional additives and processing assistants.

    摘要翻译： 热塑性成型材料包含A）1至99重量％的部分芳族共聚酰胺，其由a1- 30-44摩尔％的衍生自对苯二甲酸的单元组成，a2）6至25摩尔％衍生的单元 来自间苯二甲酸，a3）43〜49.5摩尔％的衍生自六亚甲基二胺的单元和a4）0.5〜7摩尔％的衍生自6〜30个碳原子的脂肪族环状二胺的单元，成分a1 ）与a4）一起提供100％的B）1至99重量％的聚醚酰亚胺，C）0至30重量％的具有OH基团的聚合物组分，D）0至60重量％的纤维 或颗粒填料或其混合物，E）0至40重量％的橡胶抗冲改性剂和F）0至40重量％的常规添加剂和加工助剂。

    Reinforced thermoplastic molding compositions based on polyarylene ethers
    84.
    发明授权
    Reinforced thermoplastic molding compositions based on polyarylene ethers 有权
    基于聚亚芳基醚的增强热塑性成型组合物

    公开(公告)号：US08703862B2

    公开(公告)日：2014-04-22

    申请号：US13115513

    申请日：2011-05-25

    申请人： Martin Weber ,  Christian Maletzko ,  Mark Völkel

    发明人： Martin Weber ,  Christian Maletzko ,  Mark Völkel

    IPC分类号： C08J3/02 ,  C08J3/20 ,  C08K5/13 ,  C08G59/00 ,  C08G65/00

    CPC分类号： C08L71/00 ,  C08L81/06

    摘要： The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.

    摘要翻译： 本发明涉及由以下组分组成的热塑性模塑组合物：（A）每个聚合物链平均具有至多0.1个酚类末端基团的至少一种聚亚芳基醚（A1）和至少一种聚亚芳基醚（A2），其具有 每个聚合物链平均至少1.5个酚类端基，（B）至少一种纤维或颗粒填料，和（C）任选的其它添加剂和/或加工助剂。 本发明还涉及本发明的热塑性模塑组合物的制备方法，其用于生产模制品，纤维，泡沫或薄膜以及所得模制品，纤维，泡沫和薄膜的用途。

    THERMOPLASTIC MOLDING COMPOSITION
    85.
    发明申请
    THERMOPLASTIC MOLDING COMPOSITION 有权
    热塑性成型组合物

    公开(公告)号：US20140017427A1

    公开(公告)日：2014-01-16

    申请号：US13548698

    申请日：2012-07-13

    申请人： Claudia Mettlach ,  Martin Weber ,  Christian Maletzko ,  Bernd Trotte

    发明人： Claudia Mettlach ,  Martin Weber ,  Christian Maletzko ,  Bernd Trotte

    IPC分类号： C08G75/23 ,  B32B1/02

    CPC分类号： C08G75/23 ,  C08G75/08 ,  Y10T428/1352

    摘要： The present invention relates to the use of a molding composition for producing a feed container consisting essentially of a copolymer composed of (A) from 5 to 60% by weight of units of the formula (I) and (B) from 40 to 95% by weight of units of the formula (II) where the total of the proportions by weight is 100% by weight, based on the copolymer, and where the demolding force of the molding composition is from 1800 to 2800 N.

    摘要翻译： 本发明涉及用于生产饲料容器的用途，所述饲料容器主要由以下组成的共聚物组成：（A）5至60重量％的式（I）和（B）的单元为40至95重量％ （II）的单位，其中基于共聚物的重量比为100重量％，并且模塑组合物的脱模力为1800至2800N。

    Method for producing semiconductor wafers composed of silicon with reduced pinholes
    86.
    发明授权
    Method for producing semiconductor wafers composed of silicon with reduced pinholes 有权
    用于制造具有减小的针孔的由硅组成的半导体晶片的方法

    公开(公告)号：US08628613B2

    公开(公告)日：2014-01-14

    申请号：US13089352

    申请日：2011-04-19

    申请人： Martin Weber ,  Werner Schachinger ,  Piotr Filar

    发明人： Martin Weber ,  Werner Schachinger ,  Piotr Filar

    IPC分类号： C30B15/14

    CPC分类号： C30B29/06 ,  C30B15/18 ,  C30B15/305

    摘要： Silicon semiconductor wafers are produced by pulling a single crystal at a seed crystal from a melt heated in a crucible; supplying heat to the center of the crucible bottom with a heating power which, in the course of the growth of a cylindrical section of the single crystal, is increased at least once to not less than 2 kW and is then decreased again; and slicing semiconductor wafers from the pulled single crystal.

    摘要翻译： 通过从在坩埚中加热的熔体中的晶种拉出单晶来制造硅半导体晶片; 以坩埚底部的中心供热，其加热功率在单晶体的圆柱形部分的生长过程中至少增加一次至不小于2kW，然后再次降低; 并从拉出的单晶切片半导体晶片。

    Segmented polyarylene ether block copolymers
    87.
    发明授权
    Segmented polyarylene ether block copolymers 失效
    分段聚亚芳基醚嵌段共聚物

    公开(公告)号：US08524853B2

    公开(公告)日：2013-09-03

    申请号：US13376901

    申请日：2010-05-31

    申请人： Cecile Gibon ,  Martin Weber ,  Reinoud J. Gaymans ,  Ranimol Stephen

    发明人： Cecile Gibon ,  Martin Weber ,  Reinoud J. Gaymans ,  Ranimol Stephen

    IPC分类号： C08G8/02

    CPC分类号： C08G69/42 ,  C08G69/40 ,  C08L81/06 ,  C08L2205/05 ,  C08L77/00

    摘要： The present invention relates to polyarylene ether block copolymers according to the general formula A-K—X—K-A, where —X— is a polyarylene ether segment with number-average molar mass of at least 5000 g/mol, and A- is a segment of the general structure R2NH—(R1—NH—CO—Ar—CO—NH)n—R1—NH—, in which R1 is a linear or branched alkylene group having from 2 to 12 carbon atoms and Ar is an arylene group having from 6 to 18 carbon atoms, and R2 is selected from aryloyl, alkyloyl, and H, and in which the number average of n is from 1 to 3, and there is a coupling group K of the structure —CO—Ar3—CO— linking each A to X, in which Ar13 is an aromatic group having from 6 to 18 carbon atoms. The present invention also relates to a process for the production of the polyarylene ether block copolymers of the invention, to polymer compositions comprising the polyarylene ether block copolymers of the invention, and also to the use thereof for the production of moldings, of films, of fibers, or of foams.

    摘要翻译： 本发明涉及根据通式AKXKA的聚亚芳基醚嵌段共聚物，其中-X-是具有至少5000g / mol的数均摩尔质量的聚亚芳基醚链段，A-是通式结构的一部分R2NH - （R1-NH-CO-Ar-CO-NH）n-R1-NH-，其中R1是具有2至12个碳原子的直链或支链亚烷基，Ar是具有6至18个碳原子的亚芳基 原子，R 2选自芳氧基，烷酰基和H，其中n的数均为1〜3，并且存在连接各A至X的结构-CO-Ar 3 -CO的结合基团K ，其中Ar 13是具有6至18个碳原子的芳族基团。 本发明还涉及本发明的聚亚芳基醚嵌段共聚物的制备方法，包括本发明的聚亚芳基醚嵌段共聚物的聚合物组合物，以及其用于制备模制品的用途 纤维，或泡沫。

    Lighting elements composed of polyesters
    89.
    发明授权
    Lighting elements composed of polyesters 有权
    由聚酯组成的照明元件

    公开(公告)号：US08440761B2

    公开(公告)日：2013-05-14

    申请号：US11994937

    申请日：2006-07-13

    申请人： Andreas Eipper ,  Martin Weber ,  Carsten Weiss

    发明人： Andreas Eipper ,  Martin Weber ,  Carsten Weiss

    IPC分类号： C08L67/00 ,  C08F12/08

    CPC分类号： C08L67/02 ,  C08L25/14 ,  C08L2666/06

    摘要： Lighting elements composed of thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of at least one thermoplastic polyester, B) from 0.1 to 50% by weight of at least one terpolymer, obtainable from b1) at least one vinylaromatic monomer, b2) at least one C1-C4-alkyl (meth)acrylate or (meth)acrylonitrile, and b3) from 0.1 to 10% by weight, based on the total weight of the components b1) to b3), of at least one monomer which comprises an α,β-unsaturated anhydride, and C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.

    摘要翻译： 由热塑性模塑组合物组成的照明元件，其包含A）10至99.9重量％的至少一种热塑性聚酯，B）0.1至50重量％的至少一种三元共聚物，可由b1）至少一种乙烯基芳族单体，b2 ）至少一种（甲基）丙烯酸C 1 -C 4烷基酯或（甲基）丙烯腈，和b3）基于组分b1）至b3）的总重量为0.1至10重量％的至少一种单体， 包括α，β-不饱和酸酐和C）0至60重量％的其它添加剂，其中组分A）至C）的重量百分比的总和为100％。

    Semiconductor wafer composed of monocrystalline silicon and method for producing it
    90.
    发明授权
    Semiconductor wafer composed of monocrystalline silicon and method for producing it 有权
    由单晶硅组成的半导体晶片及其制造方法

    公开(公告)号：US08398766B2

    公开(公告)日：2013-03-19

    申请号：US12548862

    申请日：2009-08-27

    申请人： Timo Mueller ,  Gudrun Kissinger ,  Walter Heuwieser ,  Martin Weber

    发明人： Timo Mueller ,  Gudrun Kissinger ,  Walter Heuwieser ,  Martin Weber

    IPC分类号： C30B15/02

    CPC分类号： C30B29/06 ,  C30B15/04 ,  C30B15/203 ,  C30B15/305 ,  C30B30/04 ,  C30B33/02

    摘要： Semiconductor wafers composed of monocrystalline silicon and doped with nitrogen contain an OSF region and a Pv region, wherein the OSF region extends from the center radially toward the edge of the wafer as far as the Pv region; the wafer has an OSF density of less than 10 cm−2, a BMD density in the bulk of at least 3.5×108 cm−3, and a radial distribution of the BMD density with a fluctuation range BMDmax/BMDmin of not more than 3. The wafers are produced by controlling initial nitrogen content and maintaining oxygen within a narrow window, followed by a heat treatment.

    摘要翻译： 由单晶硅构成并掺杂有氮的半导体晶片包含OSF区域和Pv区域，其中OSF区域从中心径向延伸至晶片边缘至Pv区域; 晶片具有小于10cm -2的OSF密度，至少3.5×10 8 cm -3的本体的BMD密度以及具有不大于3的波动范围BMDmax / BMDmin的BMD密度的径向分布 通过控制初始氮含量并将氧保持在窄窗口内，然后进行热处理来生产晶片。