公开(公告)号：US20060215153A1

公开(公告)日：2006-09-28

申请号：US11443222

申请日：2006-05-31

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

IPC分类号： G01N21/88

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

公开(公告)号：US20060043293A1

公开(公告)日：2006-03-02

申请号：US11209759

申请日：2005-08-24

申请人： Takashi Doi ,  Noriaki Arai ,  Hidetoshi Morokuma ,  Katsumi Setoguchi ,  Fumihiro Sasajima ,  Maki Tanaka ,  Atsushi Miyamoto

发明人： Takashi Doi ,  Noriaki Arai ,  Hidetoshi Morokuma ,  Katsumi Setoguchi ,  Fumihiro Sasajima ,  Maki Tanaka ,  Atsushi Miyamoto

IPC分类号： G21K7/00 ,  G21K5/10

CPC分类号： G21K1/08 ,  G01N2223/07 ,  G01N2223/32 ,  H01J37/1478 ,  H01J37/153 ,  H01J37/21 ,  H01J37/28 ,  H01J2237/1536 ,  H01J2237/216

摘要： A charged particle beam adjustment apparatus for tilting an electron beam by a tilt deflector is disclosed. The tilt angle adjustment of the electron beam and the distortion adjustment for correcting the image distortion generated when the electron beam is tilted are conducted on a specified sample such as a pyramidal sample. The images before and after the tilting are acquired and processed to determine the tilt angle value and the distortion amount. The tilt angle adjustment and the adjustment for correction of the distortion are automated in accordance with a predetermined processing flow.

摘要翻译： 公开了一种用于使倾斜偏转器倾斜电子束的带电粒子束调节装置。 在电子束倾斜时产生的图像失真的电子束的倾斜角度调整和畸变调整是在金字塔形样品等特定的样品上进行的。 获取并处理倾斜之前和之后的图像以确定倾斜角度值和失真量。 根据预定的处理流程，自动地进行倾斜角调整和矫正矫正。

公开(公告)号：US20050133718A1

公开(公告)日：2005-06-23

申请号：US10995388

申请日：2004-11-24

申请人： Atsushi Miyamoto ,  Maki Tanaka ,  Hidetoshi Morokuma

发明人： Atsushi Miyamoto ,  Maki Tanaka ,  Hidetoshi Morokuma

IPC分类号： G01B15/04 ,  G01N23/00 ,  G01N23/225 ,  H01J37/28

CPC分类号： H01J37/28 ,  G01B15/04 ,  G01N23/2251 ,  H01J2237/226 ,  H01J2237/2814

摘要： It is predicted that an observational direction (or an incident direction of an electron beam) in an observed image actually obtained has some errors compared to a set value. The error portion affects the analysis of the observed image later. Therefore, a convergent electron beam is irradiated on a specimen with a known shape, electrons discharged from the specimen surface are detected, an image of the electron is obtained, an incident direction of the convergent electron beam is estimated based on a geometric deformation on an image of the specimen with a known shape, and a 3D shape or a shape of a cross section of a specimen to be observed from a SEM image of the specimen to be observed is obtained by use of the information of the incident direction of the estimated convergent electron beam.

摘要翻译： 预测实际获得的观察图像中的观察方向（或电子束的入射方向）与设定值相比具有一些误差。 错误部分稍后影响观察图像的分析。 因此，会聚电子束被照射在具有已知形状的样本上，检测从试样表面排出的电子，获得电子的图像，基于上述几何变形来估计会聚电子束的入射方向 通过使用估计的样本的入射方向的信息，获得具有已知形状的样本的图像，以及待观察的样本的SEM图像将要观察的样本的3D形状或截面形状 会聚电子束。

公开(公告)号：US06613593B2

公开(公告)日：2003-09-02

申请号：US09942862

申请日：2001-08-31

申请人： Maki Tanaka ,  Masahiro Watanabe ,  Kenji Watanabe ,  Mari Nozoe ,  Hiroshi Miyai

发明人： Maki Tanaka ,  Masahiro Watanabe ,  Kenji Watanabe ,  Mari Nozoe ,  Hiroshi Miyai

IPC分类号： G01R3126

CPC分类号： G01N23/2251

摘要： A method and apparatus for inspecting a semiconductor device in which failure occurrence conditions on a whole wafer are estimated by calculating the statistic of potential contrasts in pattern sections from sampled images to implement higher throughput, and defective conditions of a process are detected at an early stage with the help of time series data of the estimated result.

摘要翻译： 通过从采样图像中计算图案部分中的潜在对比度的统计量来估计半导体装置的检查方法和装置，其中通过计算采样图像中的图形部分的电位对比度的统计量来估计整个晶片的故障发生状况，以实现更高的吞吐量， 在估计结果的时间序列数据的帮助下。

公开(公告)号：US20080291437A1

公开(公告)日：2008-11-27

申请号：US12182438

申请日：2008-07-30

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

IPC分类号： G01N21/88

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

摘要翻译： 在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息 具有相应的检查条件。 多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的 获得。 对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

公开(公告)号：US20080237456A1

公开(公告)日：2008-10-02

申请号：US12110443

申请日：2008-04-28

申请人： Atsushi MIYAMOTO ,  Maki Tanaka ,  Hidetoshi Morokuma

发明人： Atsushi MIYAMOTO ,  Maki Tanaka ,  Hidetoshi Morokuma

IPC分类号： G01D18/00 ,  G01N23/00

CPC分类号： H01J37/28 ,  G01B15/04 ,  G01N23/2251 ,  H01J2237/226 ,  H01J2237/2814

摘要： A method and device for observing a specimen, in which a convergent electron beam is irradiated and scanned from a desired direction, on a surface of a calibration substrate on which a pattern with a known shape is formed, and a beam SEM image of the pattern formed on the calibration substrate is obtained. An actual direction of the electron beam irradiated on the surface of the calibration substrate is calculated by use of the information about an apparent geometric deformation of the known shape on the SEM image, and the actual direction of the electron beam to the desired is adjusted direction by using information of the calculated direction. The pattern with the known shape formed on the calibration substrate has a crystal plane formed by anisotropic chemical etching

摘要翻译： 一种用于观察其中从所需方向照射并扫描会聚电子束的样本在其上形成有已知形状的图案的校准基板的表面上的图案的束SEM扫描图像 形成在校准基板上。 通过使用关于SEM图像上的已知形状的表观几何变形的信息，计算照射在校准基板的表面上的电子束的实际方向，将电子束的实际方向调整为所需的调整方向 通过使用计算出的方向的信息。 在校准基板上形成的具有已知形状的图案具有由各向异性化学蚀刻形成的晶面

公开(公告)号：US07417444B2

公开(公告)日：2008-08-26

申请号：US11269617

申请日：2005-11-09

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： G01R31/305 ,  H01J37/28

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.

摘要翻译： 一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射， 在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

公开(公告)号：US07365325B2

公开(公告)日：2008-04-29

申请号：US11651031

申请日：2007-01-09

申请人： Atsushi Miyamoto ,  Maki Tanaka ,  Hidetoshi Morokuma

发明人： Atsushi Miyamoto ,  Maki Tanaka ,  Hidetoshi Morokuma

IPC分类号： G01N23/00 ,  G01B11/14

CPC分类号： H01J37/28 ,  G01B15/04 ,  G01N23/2251 ,  H01J2237/226 ,  H01J2237/2814

摘要： A method and device for observing a specimen in which an electron beam is irradiated and scanned from an oblique direction, onto a surface of a calibration substrate on which a pattern with a known shape is formed, and an SEM image of the surface of the calibration substrate is obtained. An angle in an oblique direction of the electron beam irradiated is obtained and is adjusted to a desired angle. The electron beam is irradiated from the adjusted desired angle in the oblique direction, onto a specimen substrate on which a pattern is formed, and an SEM image of the specimen substrate is obtained. The SEM image of the specimen substrate is processed by use of the information of the desired angle, and a 3D image of the pattern on the specimen substrate or a shape of a cross section of the pattern is obtained.

摘要翻译： 一种用于观察其中电子束从倾斜方向照射和扫描的样本到其上形成有已知形状的图案的校准基板的表面上的方法和装置以及校准表面的SEM图像 得到底物。 获得照射的电子束的倾斜方向的角度并将其调节到期望的角度。 将电子束从倾斜方向的调整好的所需角度照射到形成图案的试样基板上，得到试样基板的SEM图像。 通过使用期望角度的信息来处理样本基板的SEM图像，并且获得样本基板上的图案的3D图像或图案的横截面的形状。

公开(公告)号：US20070131877A9

公开(公告)日：2007-06-14

申请号：US10062666

申请日：2002-02-05

申请人： Takashi Hiroi ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Munenori Fukunishi ,  Hiroshi Miyai ,  Yasuhiko Nara ,  Mitsunobu Isobe

发明人： Takashi Hiroi ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Munenori Fukunishi ,  Hiroshi Miyai ,  Yasuhiko Nara ,  Mitsunobu Isobe

IPC分类号： G01N23/00

CPC分类号： G06K9/6211 ,  G01N23/22 ,  G06K9/033 ,  G06K2209/19 ,  G06T7/001 ,  G06T2207/30148

摘要： Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, the present invention, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, enables the retrieval of image data via an outside results confirmation system. Further, in the case of defect data of a plurality of substrates, it is enabled to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.

摘要翻译： 通常，由检查系统输出的缺陷数据仅包括诸如坐标数据，面积和投影长度的特征定量数据，并且仅有用于移动到缺陷位置的坐标数据可以被有效地利用。 相比之下，本发明通过使用除了特征定量数据之外的图像数据作为检查系统的缺陷数据，能够经由外部结果确认系统检索图像数据。 此外，在多个基板的缺陷数据的情况下，能够通过图像检索相似缺陷的事实在检查期间显示缺陷图像，并且检索结果被显示为趋势，使得可以在显示缺陷图像期间显示缺陷图像 通过搜索图像上的类似缺陷并将其显示为趋势，指定趋势上的基板，从而显示其缺陷图并指定缺陷图上的缺陷来进行检查。

公开(公告)号：US07164128B2

公开(公告)日：2007-01-16

申请号：US10995388

申请日：2004-11-24

申请人： Atsushi Miyamoto ,  Maki Tanaka ,  Hidetoshi Morokuma

发明人： Atsushi Miyamoto ,  Maki Tanaka ,  Hidetoshi Morokuma

IPC分类号： G01N23/00 ,  G01B11/14

CPC分类号： H01J37/28 ,  G01B15/04 ,  G01N23/2251 ,  H01J2237/226 ,  H01J2237/2814

摘要： It is predicted that an observational direction (or an incident direction of an electron beam) in an observed image actually obtained has some errors compared to a set value. The error portion affects the analysis of the observed image later. Therefore, a convergent electron beam is irradiated on a specimen with a known shape, electrons discharged from the specimen surface are detected, an image of the electron is obtained, an incident direction of the convergent electron beam is estimated based on a geometric deformation on an image of the specimen with a known shape, and a 3D shape or a shape of a cross section of a specimen to be observed from a SEM image of the specimen to be observed is obtained by use of the information of the incident direction of the estimated convergent electron beam.

摘要翻译： 预测实际获得的观察图像中的观察方向（或电子束的入射方向）与设定值相比具有一些误差。 错误部分稍后影响观察图像的分析。 因此，会聚电子束被照射在具有已知形状的样本上，检测从试样表面排出的电子，获得电子的图像，基于上述几何变形来估计会聚电子束的入射方向 通过使用估计的样本的入射方向的信息，获得具有已知形状的样本的图像，以及待观察的样本的SEM图像将要观察的样本的3D形状或截面形状 会聚电子束。