摘要:
A low threshold voltage NMIS area and a high threshold voltage PMIS area are set by a photoresist mask also used for well formation. Using a photoresist mask with openings for the NMIS and PMIS, the NMIS and PMIS areas are set by one ion implantation step. After gate oxidation, ion implantation is conducted through an amorphous silicon film onto wells, channels, and gate electrodes. A plurality of CMIS threshold voltages can be set and the gate electrodes of both polarities can be formed in a reduced number of steps using photoresist. This solves the problem in which photomasks are required as many as there are ion implantation types for wells, channel stoppers, gate electrodes, and threshold voltage control and hence the number of manufacturing steps and the production cost are increased.
摘要:
A MISFET capable of a high speed operation includes a metal silicide layer in a high concentration region aligned with a gate side wall layer on a self-alignment basis. A MISFET which can be driven at a high voltage includes an LDD portion having a width greater than the width of the side wall layer, a high concentration region in contact with the LDD portion and a metal silicide layer in the high concentration region.
摘要:
In forming a plug 21 of a polycrystalline silicon film in a contact hole 19 to which a bit line BL is connected, the upper surface of the plug 21 is retracted downward from the upper edge of the contact hole 19, and a plug 22 of a laminate of a TiN film 26 and a W film 27 is formed on the plug 21. Then, the W film deposited on the contact hole 19 is patterned to form a bit line BL having a width narrower than the diameter of the contact hole 19. Here, the W film 27 constituting part of the plug 22 in the contact hole 19 is etched, but the TiN film 26 constituting another part of the plug 22 is not almost etched.
摘要:
A semiconductor device having and electrically erasable and programmable nonvolatile memory, for example, a rewritable nonvolatile memory including memory cells arranged in rows and columns and disposed to facilitate both flash erasure as well as selective erasure of individual units of plural memory cells. The semiconductor device which functions as a microcomputer chip also has a processing unit and includes an input terminal for receiving an operation mode signal for switching the microcomputer between a first operation mode in which the flash memory is rewritten under control of a processing unit and a second operation mode in which the flash memory is rewritten under control of separate writing circuit externally connectable to the microcomputer.
摘要:
A semiconductor device having and electrically erasable and programmable nonvolatile memory, for example, a rewritable nonvolatile memory including memory cells arranged in rows and columns and disposed to facilitate both flash erasure as well as selective erasure of individual units of plural memory cells. The semiconductor device which functions as a microcomputer chip also has a processing unit and includes an input terminal for receiving an operation mode signal for switching the microcomputer between a first operation mode in which the flash memory is rewritten under control of a processing unit and a second operation mode in which the flash memory is rewritten under control of separate writing circuit externally connectable to the microcomputer.
摘要:
A plurality of memory cells have their sources and drains formed integrally with n.sup.+ -buried layers acting as first data lines in a semiconductor substrate. The n.sup.+ -buried layers are connected with second data lines through transfer MISFETs. These transfer MISFETs have their gates made of the same layer of polycrystalline silicon as that of the floating gates of memory cells are shunted at each predetermined number of bits by Al lines having a lower resistance than that of the polycrystalline silicon.
摘要翻译:多个存储单元的源极和漏极与在半导体衬底中用作第一数据线的n +层作为一体形成。 n +掩埋层通过传输MISFET与第二数据线连接。 这些转移MISFET的栅极由具有比多晶硅电阻低的Al线在每个预定位数被分流的同一多晶硅层制成。
摘要:
An electrically rewritable flash memory device which has a memory cell array arranged in rows and columns of memory cells and which is divided into a plurality of memory blocks having different memory capacities. Each memory block having one or more rows of memory cells. A common voltage control circuit is provided for each of the memory blocks for applying a first potential to a common conductor for a memory block containing a memory cell selected with a selection voltage applied to its associated data line conductor for a writing operation and a second potential higher than the first potential to a common conductor for a memory block containing a memory cell unselected with the selection voltage applied to its associated data line conductor and containing no selected memory cell for a writing operation. A microcomputer having a CPU and the above-mentioned electrically rewritable flash memory formed in a single semiconductor chip includes an input terminal for receiving an operation mode signal for switching the microcomputer between a first operation mode in which the flash memory is rewritten under control of the CPU and a second operation mode in which the flash memory is rewritten under control of separate writing circuit externally connectable to the microcomputer.
摘要:
A plurality of memory cells have their sources and drains formed integrally with n.sup.+ -buried layers acting as first data lines in a semiconductor substrate. The n.sup.+ -buried layers are connected with second data lines through transfer MISFETs. These transfer MISFETs have their gates made of the same layer of polycrystalline silicon as that of the floating gates of memory cells and are shunted at each predetermined number of bits by Al lines having a lower resistance than that of the polycrystalline silicon. The aforementioned memory cells are made by a method comprising the steps of: forming over a semiconductor substrate sequentially the first gate insulating film, a first conductor layer for the floating gate electrode, an insulating film having at least its uppermost layer of a silicon nitride film for the second gate insulating film, and a damage preventing film of a silicon oxide film; patterning the silicon oxide film, the insulating film and the first conductor layer in a stripe shape; and forming, by ion implantation, an n.sup.+ -buried layer extending in a first direction by using the stripe-patterned silicon oxide film as a mask. As a result, the second gate insulating film can be prevented from having its quality degraded by the damage of the ion implantation.
摘要:
A method of fabrication comprising forming a semiconductor integrated circuit device LSI which has a microcomputer CPU furnished with an EPROM, determining a program for controlling the microcomputer CPU and to be set in the EPROM (performing an initial evaluation) while information is being written into and erased from the EPROM built in the semiconductor integrated circuit device LSI, and thereafter forming a semiconductor integrated circuit device LSI in which the EPROM of the first-mentioned semiconductor integrated circuit device LSI is replaced with a mask ROM. In replacing the EPROM with the mask ROM, peripheral circuits required for both the EPROM and the mask ROM have their circuit arrangements held basically the same, and specific peripheral circuits for use in only the EPROM have their circuit regions left as they are as logically inactive regions.
摘要:
An automatic document feeder includes a sheet feeding tray on which a document is stacked; a slit glass on which the document is scanned while moving; a discharge path in which the document is conveyed after the document is scanned; a document discharge unit to which the document is discharged through the discharge path; and a stamp device that makes a mark on a scanned surface of the document being in the discharge path. The stamp device includes a printing unit that faces the scanned surface of the document. The printing unit is movable between a first position at which the printing unit faces the document being in the discharge path and a second position at which the printing unit is retracted from the discharge path.