公开(公告)号：US08394656B2

公开(公告)日：2013-03-12

申请号：US12831898

申请日：2010-07-07

申请人： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

发明人： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

IPC分类号： H01L21/00

CPC分类号： B81C1/00047 ,  B81B2201/047 ,  B81C2201/0108 ,  B81C2201/0111 ,  G02B26/001

摘要： MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

摘要翻译： 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。

公开(公告)号：US20130050228A1

公开(公告)日：2013-02-28

申请号：US13221717

申请日：2011-08-30

申请人： Kurt Edward Petersen ,  Ravindra V. Shenoy ,  Justin Phelps Black ,  David William Burns ,  Srinivasan Kodaganallur Ganapathi ,  Philip Jason Stephanou ,  Nicholas Ian Buchan

发明人： Kurt Edward Petersen ,  Ravindra V. Shenoy ,  Justin Phelps Black ,  David William Burns ,  Srinivasan Kodaganallur Ganapathi ,  Philip Jason Stephanou ,  Nicholas Ian Buchan

IPC分类号： G06T1/00 ,  H01L23/15 ,  H01L21/78 ,  H01L21/52

CPC分类号： H01L23/053 ,  B81B2201/047 ,  B81C1/0023 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14609 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.

摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。 在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。

公开(公告)号：US20130050155A1

公开(公告)日：2013-02-28

申请号：US13221744

申请日：2011-08-30

申请人： Kurt Edward Petersen ,  Ravindra V. Shenoy ,  Justin Phelps Black ,  David William Burns ,  Srinivasan Kodaganallur Ganapathi ,  Philip Jason Stephanou ,  Nicholas Ian Buchan

发明人： Kurt Edward Petersen ,  Ravindra V. Shenoy ,  Justin Phelps Black ,  David William Burns ,  Srinivasan Kodaganallur Ganapathi ,  Philip Jason Stephanou ,  Nicholas Ian Buchan

IPC分类号： G09G5/00 ,  H05K13/00 ,  H05K7/00

CPC分类号： B81B7/0067 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0109 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/5313 ,  H01L2924/00014 ,  H01L2924/00

摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.

摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。 在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。

公开(公告)号：US20130049611A1

公开(公告)日：2013-02-28

申请号：US13663323

申请日：2012-10-29

申请人： QUALCOMM MEMS Technologies, Inc.

发明人： Sameer Wadhwa

IPC分类号： G05F1/10 ,  H05B37/02

CPC分类号： G05F1/565 ,  G09G3/3466

摘要： Power efficient power supply regulator circuits are disclosed. The circuits are configured to modify their overhead current according to current load. This is particularly advantageous for use in display devices with widely varying current loads. Such displays include bi-stable displays, such as interferometric modulation displays, LCD displays, and DMD displays.

公开(公告)号：US20130038565A1

公开(公告)日：2013-02-14

申请号：US13207024

申请日：2011-08-10

申请人： Donald J. Elloway ,  Mark M. Mignard ,  William J. Cummings ,  Russel A. Martin

发明人： Donald J. Elloway ,  Mark M. Mignard ,  William J. Cummings ,  Russel A. Martin

IPC分类号： G06F3/045 ,  G06F3/041

CPC分类号： G06F3/0412 ,  G06F3/0416

摘要： This disclosure provides systems, methods and apparatus for touch sensing on a display device. In one aspect, a method is provided for reducing electrical interference on a display including bi-stable display elements and touch sensing elements without a grounded shielding layer between display elements and touch sensing elements. The method may include placing at least a portion of an array of bi-stable display elements in a selected state with display driver circuitry, maintaining the display elements in the selected state, and obtaining a signal from a touch-sensing element using touch sensing driver circuitry different from the display driver circuitry when the display elements remain in the selected state.

摘要翻译： 本公开提供了用于显示设备上的触摸感测的系统，方法和装置。 在一个方面，提供一种用于减少显示器上的电干扰的方法，包括双稳态显示元件和触摸感测元件，而在显示元件和触摸感测元件之间没有接地屏蔽层。 该方法可以包括将显示驱动器电路将显示元件置于选定状态的双稳态显示元件的阵列的至少一部分，将显示元件保持在选定状态，以及使用触摸感测驱动器从触摸感应元件获得信号 当显示元件保持在选择状态时，与显示驱动器电路不同的电路。

公开(公告)号：US20130032385A1

公开(公告)日：2013-02-07

申请号：US13197162

申请日：2011-08-03

申请人： Peng Cheng Lin ,  Mario Francisco Velez

发明人： Peng Cheng Lin ,  Mario Francisco Velez

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： B81B7/0058 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/095 ,  B81C2203/0136 ,  B81C2203/0163 ,  G01P1/023 ,  H01G5/16 ,  H01L23/315 ,  H01L23/552 ,  H01L2924/0002 ,  Y10T29/49146 ,  H01L2924/00

摘要： This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.

摘要翻译： 本公开提供了用于在薄膜盖上形成金属薄膜屏蔽以保护下面空腔中的机电系统装置的系统和方法。 在一个方面，使用双层或多层薄膜结构来密封机电装置。 例如，金属薄膜屏蔽可以配合在氧化物薄膜帽上以封装机电装置，并防止由于晶片变薄，切割和封装组件引起的应力引起的劣化，从而增强机电装置在封装空腔中的生存性。 在再分配层处理期间，在晶片表面上形成诸如铜层的金属薄膜屏蔽，被图案化和金属化。

公开(公告)号：US20130027440A1

公开(公告)日：2013-01-31

申请号：US13539016

申请日：2012-06-29

申请人： Russel Allyn Martin ,  Zhanpeng Feng ,  Jyotindra Raj Shakya ,  Paul Eric Jacobs ,  Clarence Chui

发明人： Russel Allyn Martin ,  Zhanpeng Feng ,  Jyotindra Raj Shakya ,  Paul Eric Jacobs ,  Clarence Chui

IPC分类号： G09G5/10

CPC分类号： G02B26/001 ,  G09G3/2003 ,  G09G3/2074 ,  G09G3/3466 ,  G09G2310/0235 ,  G09G2320/0242 ,  G09G2320/0626 ,  G09G2320/0666

摘要： A field-sequential color architecture is included in a reflective mode display. The reflective mode display may be a direct-view display such as an interferometric modulator display. The reflective mode display may include three or more different subpixel types, each of which corresponds to a color. Data for each color may be written sequentially to all subpixels of the display. Flashing of a corresponding colored light, e.g., from a front light of the display, may be timed to immediately follow a process of writing data for that color. Colors other than the field color may be used to produce grayscale. The field color may correspond to the most significant bit (MSB) and the other colors may correspond to other bits.

摘要翻译： 反射模式显示中包含场顺序色彩架构。 反射模式显示可以是诸如干涉式调制器显示器的直视显示器。 反射模式显示可以包括三个或更多个不同的子像素类型，每个子像素类型对应于颜色。 每个颜色的数据可以顺序写入显示器的所有子像素。 可以定时闪烁相应的彩色光，例如来自显示器的前灯，以便立即遵循为该颜色写入数据的过程。 可以使用除场颜色以外的颜色来产生灰度。 场颜色可以对应于最高有效位（MSB），而其它颜色可以对应于其他位。

公开(公告)号：US20130021313A1

公开(公告)日：2013-01-24

申请号：US13189428

申请日：2011-07-22

申请人： Alok Govil

发明人： Alok Govil

IPC分类号： G09G5/00

CPC分类号： G02B26/00 ,  G02B26/001 ,  G09G3/3466 ,  G09G2300/0426 ,  G09G2300/0842 ,  G09G2310/0251

摘要： Methods and devices for reducing the voltage required to update an array of display elements having variable capacitance are described herein. In one implementation, the method includes driving a display element to a first state using a reset drive line. The method further includes driving the display element to a second state using a column drive line. The capacitance of the display element is higher in the first state than in the second state

摘要翻译： 这里描述了用于降低更新具有可变电容的显示元件阵列所需的电压的方法和装置。 在一个实现中，该方法包括使用复位驱动线将显示元件驱动到第一状态。 该方法还包括使用列驱动线将显示元件驱动到第二状态。 显示元件的电容在第一状态下高于第二状态

公开(公告)号：US08358459B2

公开(公告)日：2013-01-22

申请号：US13076326

申请日：2011-03-30

申请人： Brian J Gally ,  William J. Cummings

发明人： Brian J Gally ,  William J. Cummings

IPC分类号： G02B26/00 ,  G02B26/08

CPC分类号： G02B26/001 ,  B44F1/10 ,  B44F1/14 ,  G02B27/2228 ,  G09G3/3466 ,  G09G3/3473 ,  Y10T29/49002

摘要： An ornamental display device having an interferometric modulator for displaying an ornamental image. The ornamental device may also have a signal receiver configured to receive an external signal. The ornamental device may further have a processor configured to control an image on the display based on the external signal. The external signal is emitted from a controller configured to control a plurality of ornamental devices to display coordinated images. The ornamental device may have a patterned diffuser formed on a transparent substrate to provide an ornamental image or information. The ornamental device may be a piece of jewelry or an article that may be worn. The image displayed may have an iridescent appearance. A controller may also be used to control images displayed on multiple ornamental device to provide coordinated images based on externals received or pre-programmed images.

摘要翻译： 一种装饰显示装置，具有用于显示装饰图像的干涉式调制器。 装饰装置还可以具有被配置为接收外部信号的信号接收器。 装饰设备还可以具有被配置为基于外部信号来控制显示器上的图像的处理器。 外部信号从被配置为控制多个装饰设备的控制器发射以显示协调的图像。 装饰装置可以具有形成在透明基板上的图案化扩散器，以提供装饰图像或信息。 装饰装置可以是可以佩戴的首饰或物品。 显示的图像可能有虹彩色的外观。 还可以使用控制器来控制在多个装饰装置上显示的图像，以基于所接收的外部图像或预先编程的图像提供协调的图像。

公开(公告)号：US20130016037A1

公开(公告)日：2013-01-17

申请号：US13180394

申请日：2011-07-11

申请人： Hung-Jen Wang

发明人： Hung-Jen Wang

IPC分类号： G06T1/00 ,  B32B37/14 ,  B32B37/02 ,  G06F3/01 ,  G02B26/00

CPC分类号： G02B26/001 ,  G02B26/0841

摘要： A reflective subpixel array may be formed in which an absorption layer is formed on a back substrate, which may obviate the need for a black mask on a front substrate upon which the reflective subpixel array is formed. In some implementations, the black mask layer may be formed only in post areas on the front substrate. The absorption layer may absorb light that enters between subpixel rows and/or columns. The absorption layer may include at least one highly conductive layer that can form part of the signal routing for the display. Conductive spacers may be formed to connect the conductive absorption layer to a conductive layer of the subpixel array.

摘要翻译： 可以形成反射子像素阵列，其中在后基板上形成吸收层，这可以消除在其上形成反射子像素阵列的前基板上需要黑色掩模。 在一些实施方案中，黑色掩模层可以仅形成在前基板上的后区域中。 吸收层可以吸收进入子像素行和/或列之间的光。 吸收层可以包括至少一个可以形成用于显示器的信号路由的一部分的高导电层。 可以形成导电间隔物以将导电吸收层连接到子像素阵列的导电层。