公开(公告)号：US08717547B2

公开(公告)日：2014-05-06

申请号：US12894305

申请日：2010-09-30

Applicant: Claudia Gorschboth ,  Jing Li ,  Klaus Vogler ,  Olaf Kittelmann ,  Thomas Deisinger ,  Gerhard Robl

Inventor： Claudia Gorschboth ,  Jing Li ,  Klaus Vogler ,  Olaf Kittelmann ,  Thomas Deisinger ,  Gerhard Robl

IPC: G01C3/08

CPC classification number: B23K26/02 ,  A61F9/009 ,  Y10T29/49826 ,  Y10T156/10

Abstract: A process for producing an interface unit and also a group of such interface units are specified. The interface unit exhibits a first reference surface for beaming in radiation, a second reference surface for emitting the radiation, and an axis extending in the direction from the first to the second reference surface. The production process comprises the steps of setting an optical path length of the interface unit between the first and second reference surfaces along the axis and the fixing of the set optical path length of the interface unit. The optical path length of the interface unit is set in such a way that radiation of a defined numerical aperture beamed in at the first reference surface exhibits a focus location that is predetermined with respect to the second reference surface in the direction of the axis. A precise and uniform focus location with respect to the second reference surface is obtained.

Abstract translation: 指定了用于生成接口单元以及一组这样的接口单元的处理。 接口单元呈现用于辐射辐射的第一参考表面，用于发射辐射的第二参考表面和沿从第一参考表面到第二参考表面的方向延伸的轴线。 生产过程包括以下步骤：沿着轴线设置第一和第二参考表面之间的界面单元的光路长度以及固定接口单元的设定的光程长度。 接口单元的光路长度被设定为使得在第一基准表面上射出的限定数值孔径的辐射表现出相对于第二参考表面在轴线方向上预定的聚焦位置。 获得相对于第二参考表面的精确且均匀的焦点位置。

公开(公告)号：US20140027418A1

公开(公告)日：2014-01-30

申请号：US13982837

申请日：2012-01-30

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: B23K1/005 ,  B23K26/02 ,  B23K35/362

CPC classification number: B23K1/0056 ,  B23K26/02 ,  B23K35/362 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75263 ,  H01L2224/81065 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/8191 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

Abstract: The present invention relates to a method for electrically contacting terminal faces of two substrates (6, 7), in particular of a chip (6) and of a carrier substrate (7). Furthermore, the invention relates to a device for performing a second phase of the method according to the invention. The method according to the invention takes place in two successive phases, wherein, in a first phase, the chip (6) is positioned with its terminal faces against terminal faces of the substrate (7) and laser energy (5) is applied to the chip (6) at the rear and, in a subsequent second phase, in a housing (3), a flux medium is applied and at the same time a reflow is performed by means of laser energy (5) being applied to the chip (6) at the rear, and a process of rinsing the housing interior is subsequently performed. The device according to the invention for performing a second phase of the method comprises a carrier table (1) and a housing (3), which together with a top side of the carrier table (1) forms a housing interior, in which the component arrangement is positioned, and also a laser light source (5), which is oriented in such a way that the laser radiation impinges on the first substrate (6) on the rear side.

Abstract translation: 本发明涉及一种用于电接触两个基片（6,7）特别是芯片（6）和载体衬底（7）的端面的方法。 此外，本发明涉及一种用于执行根据本发明的方法的第二阶段的装置。 根据本发明的方法在两个连续的阶段中进行，其中在第一阶段中，芯片（6）定位成使其端子面抵靠衬底（7）的端面，激光能量（5）被施加到 在后面的芯片（6），并且在随后的第二阶段中，在壳体（3）中，施加通量介质，并且同时通过施加到芯片上的激光能量（5）来执行回流 6），并且随后执行冲洗外壳内部的过程。 根据本发明的用于执行该方法的第二阶段的装置包括承载台（1）和壳体（3），其与承载台（1）的顶侧一起形成壳体内部，其中部件 并且还具有激光光源（5），其以使得激光辐射照射在后侧上的第一基板（6）的方式定向。

公开(公告)号：US20130256283A1

公开(公告)日：2013-10-03

申请号：US13877093

申请日：2011-09-21

Applicant: Jeihad Zeadan

Inventor： Jeihad Zeadan

IPC: B23K26/20

CPC classification number: B23K26/20 ,  B23K26/02 ,  B23K26/032 ,  B23K26/0823 ,  B23K26/21

Abstract: A welding method, e.g., a laser welding method, for connecting a first workpiece to a second workpiece, includes a first method step in which the first and the second workpiece are brought into contact with each other; a second method step in which a desired welding distortion is ascertained; and a third method step in which the first and the second workpiece are welded to each other as a function of the welding distortion, and/or in which the first and the second workpiece are rotated about an axis of rotation at a rotational speed, the first and the second workpiece being welded to each other as a function of the rotational speed.

Abstract translation: 用于将第一工件连接到第二工件的焊接方法，例如激光焊接方法，包括使第一工件和第二工件相互接触的第一方法步骤; 确定期望的焊接变形的第二方法步骤; 以及第三方法步骤，其中第一和第二工件作为焊接变形的函数彼此焊接，和/或其中第一和第二工件围绕旋转轴线以旋转速度旋转， 第一和第二工件根据转速相互焊接。

公开(公告)号：US20130213944A1

公开(公告)日：2013-08-22

申请号：US13882194

申请日：2011-10-18

Applicant: Olivier Dellea ,  Pascal Fugier ,  Zoé Tebby

Inventor： Olivier Dellea ,  Pascal Fugier ,  Zoé Tebby

IPC: B23K26/02

CPC classification number: B23K26/02 ,  B41J2/442 ,  B41J2/465 ,  G03F7/20 ,  G03F7/2053 ,  G03F7/70383 ,  H01L21/0272 ,  H01L21/0275

Abstract: In the field of photolithography systems designed to produce electronic components using the technique known as “lift-off” on a plane substrate comprising one or more plane photosensitive layers, a system uses a laser direct-write technique. It comprises optical or mechanical means configured such that the useful part of the optical beam is inclined on the plane of the photosensitive layers in order to create profiles with an inverted slope within said layers, the useful part of the optical beam being the part of the optical beam which effectively contributes to creating said profiles. In one preferred embodiment, the system comprises means for partial shuttering of the optical beam situated in the neighborhood of the focusing optics.

Abstract translation: 在设计用于使用在包括一个或多个平面感光层的平面基板上使用称为“剥离”的技术来生产电子部件的光刻系统领域中，系统使用激光直写技术。 其包括光学或机械装置，其被配置为使得光束的有用部分在感光层的平面上倾斜，以便在所述层内产生具有倒置斜率的轮廓，光束的有用部分是 光束有效地用于创建所述轮廓。 在一个优选实施例中，该系统包括用于部分快门位于聚焦光学器件附近的光束的装置。

公开(公告)号：US08476097B2

公开(公告)日：2013-07-02

申请号：US12675190

申请日：2008-08-28

Applicant: Jiri Springer

Inventor： Jiri Springer

IPC: H01L11/00

CPC classification number: H01L21/3043 ,  B23K26/02 ,  B23K26/40 ,  B23K2103/172 ,  H01L31/046 ,  H01L31/0463 ,  Y02E10/50

Abstract: A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens to the first conducting layer. Portions of the first conducting layer are scribed form a trench through the layer. The lens focuses the beam and has a focal length at least 100 mm. The focused beam includes an effective portion effective for the scribing and an ineffective portion ineffective for the scribing. The substrate sags and the first conducting layer remains in the effective portion of the focused beam across the area during the step of applying. One or more active layers are provided on the first conducting layer. A second conducting layer is provided on the one or more active layers.

Abstract translation: 一种薄膜太阳能电池的制造方法，其特征在于，在面积至少为0.75m 2的基板上设置第1导电层。 第一导电层位于该区域的沉积部分中。 通过透镜将紫外激光束施加到第一导电层。 第一导电层的一部分被刻划形成通过该层的沟槽。 镜头聚焦光束，焦距至少为100 mm。 聚焦光束包括对于划线有效的有效部分和对划线无效的无效部分。 在施加步骤期间，衬底凹陷和第一导电层保留在聚焦束的有效部分中。 在第一导电层上提供一个或多个有源层。 在一个或多个活性层上提供第二导电层。

公开(公告)号：US20130146567A1

公开(公告)日：2013-06-13

申请号：US13701873

申请日：2011-05-23

Applicant: Thomas Graf ,  Andreas Josef Birnesser

Inventor： Thomas Graf ,  Andreas Josef Birnesser

IPC: B23K15/02

CPC classification number: B23K15/02 ,  B23K26/02 ,  B23K26/03 ,  B23K26/04 ,  B23K26/20 ,  B23K26/707

Abstract: A welding device has a beam source to generate electromagnetic beams for absorption in an object to be welded at a welding location, and at least one sensor situated to detect electromagnetic process beams generated during welding at the welding location. The sensor is to generate a sensor signal as a function of the detected process beams. The welding device also has a processing unit, which is connected to the sensor and the beam source, the processing unit being configured to control at least one parameter of the beam generation of the beam source as a function of the sensor signal. The welding device is to delimit by a window a beam bundle of the emitted process beams in a plane transverse to the beam propagation direction; in the plane, the window has a longitudinal dimension greater than a transversal dimension of the window perpendicular to the longitudinal dimension.

Abstract translation: 焊接装置具有用于在焊接位置处产生用于吸收待焊接物体的电磁束的光束源，以及用于检测在焊接位置处焊接期间产生的电磁处理光束的至少一个传感器。 传感器将根据检测到的过程光束产生一个传感器信号。 焊接装置还具有连接到传感器和光束源的处理单元，处理单元被配置为根据传感器信号来控制光束源的光束产生的至少一个参数。 焊接装置是在与光束传播方向横切的平面中由窗口界定发射的过程光束的束束; 在平面中，窗口的纵向尺寸大于垂直于纵向尺寸的窗口的横向尺寸。

公开(公告)号：US20120103952A1

公开(公告)日：2012-05-03

申请号：US13281984

申请日：2011-10-26

Applicant: Keiji Nomaru

Inventor： Keiji Nomaru

IPC: B23K26/06

CPC classification number: B23K26/02 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/364 ,  B23K26/40 ,  B23K37/0211 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/268 ,  H01S3/00

Abstract: An optical transmitting unit transmits a pulsed laser beam oscillated by a pulsed laser beam oscillator to a focusing unit in a laser processing apparatus. A wavelength band expanding unit expands the wavelength band of the pulsed laser beam, and a pulse width expanding unit increases the pulse width of the expanded pulsed laser beam. A focusing lens focuses the expanded pulsed laser beam. An optical fiber transmits the focused pulsed laser beam through a collimating lens and a pulse width compressing unit compresses the pulse width of the collimated pulsed laser beam to restore the original pulse width for transmission.

Abstract translation: 光发射单元将由脉冲激光束振荡器振荡的脉冲激光束发射到激光加工设备中的聚焦单元。 波长带扩展单元扩大脉冲激光束的波长带，并且脉冲宽度扩展单元增加扩展脉冲激光束的脉冲宽度。 聚焦透镜聚焦扩展的脉冲激光束。 光纤通过准直透镜传输聚焦的脉冲激光束，并且脉冲宽度压缩单元压缩准直脉冲激光束的脉冲宽度以恢复原始脉冲宽度以进行传输。

公开(公告)号：US08161855B2

公开(公告)日：2012-04-24

申请号：US12225186

申请日：2007-02-14

Applicant: Yoshihiro Yamaguchi ,  Takahiro Iriyama ,  Satoshi Ohnishi

Inventor： Yoshihiro Yamaguchi ,  Takahiro Iriyama ,  Satoshi Ohnishi

IPC: B26D5/00 ,  B23K7/10 ,  B23K10/00 ,  B23K26/08

CPC classification number: B26D7/22 ,  B23K9/013 ,  B23K10/00 ,  B23K26/02 ,  B23K26/38 ,  B23K37/006 ,  B26D5/00 ,  B26F3/004 ,  Y10T83/148 ,  Y10T83/159

Abstract: A cutting machine secures safety of a worker during movement of a head without lowering production efficiency. When moving a cutting head without cutting material to be cut upon a table, a moving truck and the cutting head are moved at a higher speed as compared with when cutting the material to be cut. If, when the moving truck and the cutting head are moving at high speed, a worker who is present upon the table intercepts either of light beams which are located in front of and behind a horizontal beam, then this movement speed is decelerated to a safe low speed, but the task of cutting the material is not interrupted. Subsequently, when the worker approaches the horizontal beam closer, and contacts a wire or a bar in the vicinity of the horizontal beam, movement of the moving truck and the cutting head is forcibly stopped.

Abstract translation: 切割机在头部移动期间确保工人的安全性，而不降低生产效率。 当切割头没有切割切割材料在桌子上移动切割头时，与切割要切割的材料相比，移动的卡车和切割头以更高的速度移动。 如果当移动的卡车和切割头高速移动时，存在于工作台上的工人拦截位于水平梁前方和后方的光束之一，然后将该移动速度减速到安全 低速，但是切割材料的任务不会中断。 随后，当工作人员靠近水平梁并且接触水平梁附近的线或杆时，强制停止移动的卡车和切割头的移动。

公开(公告)号：US08092446B2

公开(公告)日：2012-01-10

申请号：US11549472

申请日：2006-10-13

Applicant: Mark Bischoff ,  Dirk Müehlhoff ,  Gregor Stobrawa

Inventor： Mark Bischoff ,  Dirk Müehlhoff ,  Gregor Stobrawa

IPC: A61B18/20

CPC classification number: B23K26/02 ,  A61F9/00827 ,  A61F2009/00872 ,  A61F2009/00897 ,  B23K26/035 ,  B23K26/0624 ,  B23K26/0876

Abstract: In a device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material; optics focusing the pulsed processing laser radiation to a center of interaction in the material and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacts with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a≦10 μm from each other.

Abstract translation: 在用于通过激光辐射进行材料处理的装置中，包括用于与材料相互作用的发射脉冲激光辐射的激光辐射源; 将脉冲处理激光辐射聚焦到材料中的相互作用中心的光学器件和扫描单元移动材料内的相互作用中心的位置。 每个处理激光脉冲与分配给激光脉冲的相互作用中心区域中的材料相互作用，使得材料在相互作用区域中分离。 控制单元控制扫描单元和激光辐射源，使得通过相互作用区域的顺序布置在材料中产生切割表面。 控制单元控制激光辐射源和扫描单元，使得相邻的相互中心位于距离彼此10μm的空间距离处。

公开(公告)号：US20110208343A1

公开(公告)日：2011-08-25

申请号：US11719390

申请日：2005-11-14

Applicant: Michael Tyler ,  Robert W. Colby ,  Jeffrey W. Leonard ,  Lindsey M. Dotson ,  David A. Watt ,  Cris E. Hill ,  Laura H. Campbell

Inventor： Michael Tyler ,  Robert W. Colby ,  Jeffrey W. Leonard ,  Lindsey M. Dotson ,  David A. Watt ,  Cris E. Hill ,  Laura H. Campbell

IPC: G06F19/00

CPC classification number: H05K3/0026 ,  B23K26/02 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K31/12 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/225 ,  H05K2201/09936 ,  H05K2203/163

Abstract: A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.

Abstract translation: 一种方法和系统在目标材料的激光加工中增加了加工样品产量，其包括在公共基底上形成的多个样品。 优选实施例实现能够在激光处理系统中存储在激光处理期间以某种方式遭受错误的缺陷样本的列表的特征。 一旦共同的基板被完全处理，系统就会向操作人员提供不正确处理的标本的数量，并给予操作者运行一个软件程序的机会，在一个优选的实施例中，该程序使用激光来刻划在 每个不正确加工的样品。