摘要:
A polyamic acid comprising at least 10 mol % repeating units represented by the formula [1] or [2]; and a polyimide represented by the formula [3] or [4] which is obtained from the polyamic acid. A polyimide film having high heat resistance and satisfactory in light-transmitting properties and tensile strength is obtained from the polyamic acid. (In the formulae, R1 and R2 each independently represents hydrogen or C1-10 alkyl; R3 and R4 each independently represents hydrogen, halogeno, C1-10alkyl, or phenyl or the R3 and R4 on adjoining carbon atoms are bonded to each other to form C3-8 cycloalkyl or phenyl; R5 represents a divalent organic group; and n is an integer of 2 or larger.)
摘要:
A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.
摘要:
The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.
摘要:
An insulated wire including a conductor, and an insulating film formed by coating and baking an insulating varnish on the conductor directly or via another insulation layer. The insulating varnish includes a phenolic hydroxyl group-containing polyimide resin represented by a chemical formula (1): where X is a tetravalent aromatic group composing an aromatic tetracarboxylic dianhydride residue, Y1 is a divalent aromatic group including one or more phenolic hydroxyl groups and Y2 is a divalent aromatic group not including a phenolic hydroxyl group A ratio of the number Z1 of phenolic hydroxyl groups included in Y1 of the chemical formula (1) to the number Z2 of an imide group included in the chemical formula (1) is 0.15≦Z1/Z2≦0.85.
摘要:
A method of forming a polymeric material includes forming a solution including at least two solvents and at least two diamines. The at least two diamines include oxydianiline (ODA) in an amount of about 50% to about 90% based on the total moles of the at least two diamines and include m-phenylenediamine (MPD) in an amount of about 10% to about 50% based on the total moles of the at least two diamines. The at least two solvents include a high polarity solvent in an amount of about 40% to about 90% based on the total weight of the at least two solvents and include a low polarity solvent in an amount of about 10% to about 60% based on the total weight of the at least two solvents. The method further includes adding pyromellitic dianhydride (PMDA) to the solution in a ratio of about 0.9 to about 1.05 based on the total moles of the at least two diamines to form a polyamic acid solution. In addition, the method includes imidizing the polyamic acid solution to form a polyimide material.
摘要:
A liquid crystal display device comprises a color filter substrate and an array substrate. An optical compensation film is disposed on the color filter substrate and/or the array substrate, wherein the optical compensation film comprises a polyimide, comprising the following formula: wherein n is an integer greater than 1, and wherein when A is cyclo-aliphatic compound, B is aromatic compound or cyclo-aliphatic compound, and when A is aromatic compound, B is cyclo-aliphatic compound.
摘要:
A porous insulating film comprising a highly heat resistant resin film having a fine porous structure with a mean pore size of 0.01-5 μm in at least the center of the film, and a porosity of 15-80%. A laminate is prepared by forming a heat resistant adhesive layer or a conductive metal layer or an inorganic or metal substrate on one or both sides of the porous insulating film or by forming an inorganic or metal substrate on one side of the porous insulating film and a conductive metal layer on the other side.
摘要:
A cross-linked polyimide is disclosed. The cross-linked polyimide includes a polyimide and at least one oxygenated hydrocarbon. The oxygenated hydrocarbon cross-links the polyimide. A porous cross-linked membrane is also disclosed. The porous cross-linked membrane includes a support structure and a cross-linked polyimide disposed on the support structure. The cross-linked polyimide includes a polyimide; and at least one oxygenated hydrocarbon cross-linking the polyimide. Also disclosed are methods of making the cross-linked polyimide and the porous cross-linked membrane.
摘要:
A polyimide precursor liquid composition of the present invention includes at least one type of tetracarboxylic dianhydride or derivative thereof, at least one type of diamine or derivative thereof, and a polar polymerization solvent, wherein the polyimide precursor liquid composition further includes a cyclic compound, and wherein the cyclic compound has a boiling point of 200° C. or more and comprises carbon, hydrogen and oxygen atoms. A polyimide coating film of the present invention is obtained by converting the polyimide precursor liquid composition into imide. Thus, the present invention provides a polyimide coating or film that is substantially colorless and transparent, and that is useful as, for example, a heat resistant coating film for liquid crystals, organic electroluminescence, touch panels and solar cells and the like.
摘要:
A porous insulating film comprising a highly heat resistant resin film having a fine porous structure with a mean pore size of 0.01-5 nullm in at least the center of the film, and a porosity of 15-80%. A laminate is prepared by forming a heat resistant adhesive layer or a conductive metal layer or an inorganic or metal substrate on one or both sides of the porous insulating film or by forming an inorganic or metal substrate on one side of the porous insulating film and a conductive metal layer on the other side.