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公开(公告)号：US08574720B2
公开(公告)日：2013-11-05
申请号：US12842174
申请日：2010-07-23
CPC分类号： H01B3/306 , B32B5/16 , C08G73/105 , C08G73/1075 , C08J5/18 , C08J2379/08 , C09J7/25 , C09J163/00 , C09J2463/00 , C09J2479/086 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/26 , Y10T428/2982 , Y10T428/31515 , Y10T428/31721
摘要： The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.
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公开(公告)号：US20130209769A1
公开(公告)日：2013-08-15
申请号：US13370019
申请日：2012-02-09
CPC分类号： B32B27/08 , B32B27/16 , B32B27/20 , B32B27/281 , B32B27/304 , B32B27/322 , B32B2250/24 , B32B2264/102 , B32B2270/00 , B32B2307/204 , B32B2307/206 , B32B2307/54 , B32B2457/04 , C08J5/18 , C08J2379/08 , Y10T428/252
摘要： The present disclosure is directed to a corona resistant structure having a polyimide layer. The polyimide layer is composed of a chemically converted polyimide and a corona resistant composite filler. The chemically converted polyimide is derived from at least 50 mole percent of an aromatic dianhydride and at least 50 mole percent of an aromatic diamine. The corona resistant composite filler has an organic component and an inorganic ceramic oxide component. The weight ratio of the organic component to the inorganic ceramic oxide component is from 0.01 to 1.0. At least a portion of the organic component comprises an organo-siloxane moiety or an organo-metaloxane moiety.
摘要翻译： 本公开涉及具有聚酰亚胺层的耐电晕结构。 聚酰亚胺层由化学转化的聚酰亚胺和耐电晕复合填料组成。 化学转化的聚酰亚胺衍生自至少50摩尔％的芳族二酐和至少50摩尔％的芳族二胺。 耐电晕复合填料具有有机成分和无机陶瓷氧化物成分。 有机成分与无机陶瓷氧化物成分的重量比为0.01〜1.0。 有机组分的至少一部分包含有机硅氧烷部分或有机 - 金属氧化物部分。
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3.发明授权Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto 失效用于接受选择性金属化的可光活化的聚酰亚胺组合物，以及与其相关的方法和组合物公开(公告)号：US08323802B2
公开(公告)日：2012-12-04
申请号：US12491692
申请日：2009-06-25
申请人： Meredith L. Dunbar , Yueh-Ling Lee , Carl B. Wang
发明人： Meredith L. Dunbar , Yueh-Ling Lee , Carl B. Wang
IPC分类号： B32B27/06
CPC分类号： C08L79/08 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K3/013 , C08K3/22 , H05K1/0346 , H05K1/036 , H05K1/0373 , H05K3/185 , H05K2201/0154 , H05K2201/0209 , H05K2203/107 , Y10T428/31721 , Y10T428/31725
摘要： The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.
摘要翻译： 本发明一般涉及分散在聚酰亚胺基体中的聚酰亚胺复合材料，它是有用的尖晶石晶体填料，其中复合材料具有介于0.05和0.60微米-1之间的可见光到红外光消光系数。 由此形成的复合聚酰亚胺通常用于制造具有与聚酰亚胺基底相邻的精细导电路径的电路。 通常使用无电极金属电镀步骤在基板上形成这些精细的导电通路。 首先，聚酰亚胺复合材料的表面通常通过使用激光束进行光激活，然后将光活化部分电镀以在膜的表面上形成细线或路径。
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公开(公告)号：US20120251808A1
公开(公告)日：2012-10-04
申请号：US13486284
申请日：2012-06-01
IPC分类号： B32B5/16
CPC分类号： H01B3/306 , B32B5/16 , C08G73/105 , C08G73/1075 , C08J5/18 , C08J2379/08 , C09J7/25 , C09J163/00 , C09J2463/00 , C09J2479/086 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/26 , Y10T428/2982 , Y10T428/31515 , Y10T428/31721
摘要： The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.
摘要翻译： 本公开涉及厚度为8至152微米，60度光泽值为2至35，光密度大于或等于2且介电强度大于1400V / mil的基膜。 该基膜包含基础膜的71至96重量％的化学转化（部分或全部芳族）聚酰亚胺。 基膜还包含颜料和消光剂。 消光剂的存在量为基膜的1.6至10重量％，中值粒径为1.3至10微米，密度为2至4.5g / cc。 颜料的存在量为基膜的2至9重量％。 本公开还涉及包括基膜与粘合剂层组合的覆盖膜。
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公开(公告)号：US20100263919A1
公开(公告)日：2010-10-21
申请号：US12086296
申请日：2006-12-28
申请人： Yueh-Ling Lee , Meredith L. Dunbar , Xin Shane Fang , Carl Wang
发明人： Yueh-Ling Lee , Meredith L. Dunbar , Xin Shane Fang , Carl Wang
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/165 , C25D5/02 , C25D5/54 , H05K1/0373 , H05K3/0032 , H05K2201/0236
摘要： An electronic type substrate having 40 to 97 weight-percent polymer and 3 to 60 weight-percent auto-catalytic crystalline filler. An interconnect or a conductor trace is created in the substrate by: i. drilling or ablating with a high energy electromagnetic source, such as a laser, thereby selectively activating the multi cation crystal filler along the surface created by the drilling or ablating step; and ii. metalizing by electroless and/or electrolytic plating into the drilled or ablated portion of the substrate, where the metal layer is formed in a contacting relationship with the activated multi cation crystal filler at the interconnect boundary without a need for a separate metallization seed layer or pre-dip.
摘要翻译： 具有40至97重量％聚合物和3至60重量％自催化结晶填料的电子型基材。 通过以下方式在衬底中形成互连或导体迹线：i。 用诸如激光器的高能电磁源进行钻孔或烧蚀，从而沿着由钻孔或烧蚀步骤产生的表面选择性地激活多阳离子晶体填料; 和ii。 通过无电镀和/或电解电镀金属化到衬底的钻孔或烧蚀部分中，其中金属层在互连边界处与活化的多阳离子晶体填料形成接触关系，而不需要单独的金属化种子层或预先 -蘸。
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6.发明授权Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto 失效可用于电子电路类型应用的组合物，使用扩增光可图案化，以及与其相关的方法和组合物公开(公告)号：US07547849B2
公开(公告)日：2009-06-16
申请号：US11153206
申请日：2005-06-15
申请人： Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Carl B. Wang , Brian C. Auman , Shane Fang
发明人： Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Carl B. Wang , Brian C. Auman , Shane Fang
CPC分类号： H05K3/185 , C23C18/02 , C23C18/1216 , C23C18/1233 , C23C18/1295 , C23C18/204 , Y10T428/24917 , Y10T428/25 , Y10T428/31511 , Y10T428/3154 , Y10T428/31725 , Y10T428/31786
摘要： A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.
摘要翻译： 可光活化的聚合物组合物和聚合物复合材料包括选自环氧树脂，二氧化硅填充的环氧树脂，双马来酰亚胺树脂，双马来酰亚胺三嗪，含氟聚合物，聚酯，聚苯醚/聚苯醚树脂，聚丁二烯/聚异戊二烯交联树脂（和共聚物），液体 结晶聚合物，聚酰胺，氰酸酯或其组合，聚合物粘合剂的存在量为40,45,50,55,60,65,70,75,80,85,90,95,96或97重量 - 聚合物组合物的总重量; 存在量为3,4,5,6,7,8,9,10,11,12,13,14,15,20,25,30,35,40,45,50,55的尖晶石晶体填料 和60重量％的聚合物组合物的总重量，以及制备其的方法。
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公开(公告)号：US08653512B2
公开(公告)日：2014-02-18
申请号：US13510628
申请日：2010-11-19
IPC分类号： H01L29/08
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及薄膜晶体管组合物。 薄膜晶体管组合物具有半导体材料和基板。 基板由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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公开(公告)号：US08541107B2
公开(公告)日：2013-09-24
申请号：US12850739
申请日：2010-08-05
CPC分类号： C09D179/08 , C08J5/18 , C08J2379/08 , C08K3/013 , C08K3/36 , C09J7/20 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2463/00 , C09J2479/086 , Y10T428/259 , Y10T428/26 , Y10T428/28 , Y10T428/287 , Y10T428/2982 , Y10T428/31511 , Y10T428/31721
摘要： The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.
摘要翻译： 本公开涉及厚度为8至152微米，60度光泽值为2至35，光密度大于或等于2且介电强度大于1400V / mil的基膜。 基膜包含基础膜的63至96重量％的化学转化（部分或全部芳族）聚酰亚胺。 基膜还包含颜料和消光剂。 消光剂的存在量为基膜的1.6至10重量％，中值粒径为1.3至10微米，密度为2至4.5g / cc。 颜料的存在量为基膜的2-35重量％。 本公开还涉及包括基膜与粘合剂层组合的覆盖膜。
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9.发明申请MULTILAYER FILM FOR ELECTRONIC CIRCUITRY APPLICATIONS AND METHODS RELATING THERETO 审中-公开电子电路用多层薄膜及其相关方法公开(公告)号：US20130011645A1
公开(公告)日：2013-01-10
申请号：US13348180
申请日：2012-01-11
IPC分类号： B32B27/08
CPC分类号： B32B27/08 , B32B27/18 , B32B27/281 , B32B2250/24 , H01L23/552 , H01L23/564 , H01L2924/0002 , H05K3/281 , H05K2201/0154 , H05K2201/0209 , Y10T428/269 , H01L2924/00
摘要： The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a base polymer, a carbon black filler or pigment and a dielectric filler. The core layer is a polymer with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a base polymer, a low conductivity carbon black filler or pigment and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers.
摘要翻译： 本公开涉及一种用于电子电路应用的多层膜，其具有防止不需要的电子和电磁波干扰的有利的屏障特性，以及防止灰尘或其它类似类型的不需要的异物干扰。 本公开的多层膜具有至少三层。 第一外层包含基础聚合物，炭黑填料或颜料和介电填料。 芯层是具有小于5重量％填料的聚合物。 第二外层类似于第一外层，并且包含基础聚合物，低导电性炭黑填料或颜料和介电填料。 两个外层可以相同或不同。 任选地，也可以在两个外层之间使用附加层。
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公开(公告)号：US20120228616A1
公开(公告)日：2012-09-13
申请号：US13510628
申请日：2010-11-19
IPC分类号： H01L29/786
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及薄膜晶体管组合物。 薄膜晶体管组合物具有半导体材料和基板。 基板由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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