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    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
    82.
    发明申请
    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof 审中-公开
    具有有源器件的同轴波导微结构及其形成方法

    公开(公告)号：US20160268665A1

    公开(公告)日：2016-09-15

    申请号：US15079614

    申请日：2016-03-24

    Applicant: Nuvotronics, INC

    Inventor： David W. Sherrer ,  John J. Fisher

    IPC: H01P3/06 ,  H01P11/00

    CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

    Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

    Laminate structures having a hole surrounding a probe for propagating millimeter waves
    85.
    发明授权
    Laminate structures having a hole surrounding a probe for propagating millimeter waves 有权
    具有围绕探针的孔的叠层结构，用于传播毫米波

    公开(公告)号：US09270005B2

    公开(公告)日：2016-02-23

    申请号：US13527698

    申请日：2012-06-20

    Applicant: Yigal Leiba ,  Elad Dayan

    Inventor： Yigal Leiba ,  Elad Dayan

    IPC: H01P5/107 ,  H01P3/00 ,  H01P3/12 ,  H01P11/00

    CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/121 ,  H01P11/002 ,  Y10T156/1052

    Abstract: Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.

    Abstract translation: 包括微带，探针和RF集成电路的印刷电路板上的毫米波系统的各种实施例，以及用于制造所述系统的方法。 各种实施例具有延伸穿过PCB中的层的孔，从而改善辐射传播。 各种实施例具有通过延伸穿过PCB中的层的多个通孔产生的导电笼，从而增加辐射传播。 这种系统的制造比当前系统的制造更容易且更便宜。

    Microwave Chip Package Device
    86.
    发明申请
    Microwave Chip Package Device 有权
    微波芯片封装器件

    公开(公告)号：US20160043455A1

    公开(公告)日：2016-02-11

    申请号：US14453746

    申请日：2014-08-07

    Applicant: Infineon Technologies AG

    Inventor： Ernst Seler ,  Maciej Wojnowski ,  Walter Hartner ,  Josef Boeck

    IPC: H01P5/107

    CPC classification number: H01P5/107 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01P1/042 ,  H01P11/002 ,  H01P11/003 ,  H04B5/00

    Abstract: A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.

    Abstract translation: 微波器件包括包括微波半导体芯片和与半导体封装件相关联的波导部件的半导体封装。 波导部分被配置为传送微波波导信号。 它包括一个或多个片段。 微波装置还包括变换元件，其被配置为将来自微波半导体芯片的微波信号转换成微波波导信号，或者将微波波导信号转换为用于微波半导体芯片的微波信号。

    Additive Manufacturing for Radio Frequency Hardware
    89.
    发明申请
    Additive Manufacturing for Radio Frequency Hardware 有权
    射频硬件的添加剂制造

    公开(公告)号：US20150097746A1

    公开(公告)日：2015-04-09

    申请号：US14049861

    申请日：2013-10-09

    Applicant: THE BOEING COMPANY

    Inventor： Allen Wayne Wilson ,  Patrick Chalit Pattamanuch ,  Leonard Rosenheck

    IPC: H01Q13/00 ,  B24B1/00

    CPC classification number: H01Q13/00 ,  B24B31/116 ,  H01P11/002

    Abstract: A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.

    Abstract translation: 提出了一种方法和装置。 使用添加剂制造设备形成具有内部通道的结构。 含有研磨颗粒的粘性介质通过内部通道使用磨料流加工设备来形成用于内部通道的期望的表面粗糙度。

    Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort
    90.
    发明授权
    Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort 有权
    叠层PCB和波导之间的转换，其包括具有用作波导 - 回溯的印刷导电表面的层

    公开(公告)号：US08912859B2

    公开(公告)日：2014-12-16

    申请号：US13031285

    申请日：2011-02-21

    Applicant: Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    Inventor： Yigal Leiba ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel

    IPC: H01P5/107 ,  H01P3/12 ,  H01P11/00

    CPC classification number: H01P5/107 ,  H01P3/121 ,  H01P11/002

    Abstract: A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

    Abstract translation: 使用印刷电路板（PCB）内的导电结构将电磁毫米波引向波导的系统。 该系统包括具有孔和至少两个属于PCB的薄片的波导。 印刷在一个薄片上的第一导电表面位于孔的上方，使得第一导电表面至少覆盖大部分孔。 可选地填充或镀有导电材料的多个垂直互连访问（VIA）孔将第一导电表面电连接到波导，在孔上形成导电笼。 可选地，印刷在PCB的一个层压板上的探针位于笼内并且在孔上方。

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