公开(公告)号：US20140160692A1

公开(公告)日：2014-06-12

申请号：US14098166

申请日：2013-12-05

Applicant: PC CONCEPTS LIMITED

Inventor： Ping Cheung Michael Lau

IPC: H05K7/00 ,  H05K3/36

CPC classification number: H05K3/366 ,  B41M3/006 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0386 ,  H05K3/36 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/10098 ,  Y10T29/49155 ,  Y10T29/49826

Abstract: The present invention provides a method for surface decoration of a three-dimensional object with ease. In one embodiment of the invention, a planar construction article that is foldable into the object is utilized. In another embodiment of the invention, multiple angle plates that are assembled into the object are utilized. The surface decoration process is carried out before the planar construction article is folded or before the angle panels are assembled together thereby to significantly simplify the decoration process of object faces in different orientations. The invention also provides a three-dimensional object obtained from the methods of the invention.

Abstract translation: 本发明提供一种三维物体的表面装饰方法。 在本发明的一个实施例中，利用可折叠到物体中的平面构造物品。 在本发明的另一个实施例中，利用组装到物体中的多个角板。 表面装饰处理在平面构造制品折叠之前或在角板组装在一起之前进行，从而大大简化了不同取向的物体面的装饰过程。 本发明还提供了从本发明的方法获得的三维物体。

公开(公告)号：US08596821B2

公开(公告)日：2013-12-03

申请号：US12796555

申请日：2010-06-08

Applicant: George R. Brandes ,  Julio A. Garceran

Inventor： George R. Brandes ,  Julio A. Garceran

IPC: F21V21/00

CPC classification number: F21V29/70 ,  F21K9/135 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/60 ,  F21K9/64 ,  F21K9/90 ,  F21V3/049 ,  F21V3/08 ,  F21V3/12 ,  F21V23/005 ,  F21V23/02 ,  F21V29/006 ,  F21V29/506 ,  F21V29/507 ,  F21V29/51 ,  F21V29/57 ,  F21V29/677 ,  F21V29/74 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  F21Y2115/30 ,  H05K2201/047 ,  H05K2201/10106 ,  Y10S362/80 ,  Y10T29/4913

Abstract: LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techiques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

Abstract translation: LED灯泡包括底座或盖部分的开口，以及可选的强制流动元件，用于对流冷却。 导热透光材料可用于冷却，可选地包括翅片。 LED光引擎可以通过平面制造技术由衬底制造并成形为形成基本刚性的直立支撑结构。 机械，电气和热连接可以在LED光引擎和LED灯泡之间进行。

公开(公告)号：US08235574B2

公开(公告)日：2012-08-07

申请号：US12281342

申请日：2006-11-02

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: F21V7/04

CPC classification number: G02B6/0068 ,  G02B6/0031 ,  G02B6/0073 ,  G02B6/0083 ,  G02F1/133615 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: In a light emitting device, LEDs are arranged in a line on a film which is provided with a conductor. The conductor connects the LEDs to a connector. The film is bent at a division line between a region where the LEDs are arranged and a region where the conductor is formed, and disposed on the inner surface of a reflector. A reflective material is arranged on a surface of the conductor region which faces to the LEDs.

Abstract translation: 在发光装置中，LED设置在具有导体的膜上的线上。 导体将LED连接到连接器。 该膜在布置LED的区域和形成导体的区域之间的分割线处弯曲，并且设置在反射器的内表面上。 反射材料布置在面向LED的导体区域的表面上。

公开(公告)号：US20110299292A1

公开(公告)日：2011-12-08

申请号：US13201870

申请日：2010-01-27

Applicant: Thomas Preuschl

Inventor： Thomas Preuschl

IPC: F21V21/00 ,  H05K3/30 ,  H05K1/00

CPC classification number: H05K1/189 ,  F21K9/232 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K3/4691 ,  H05K2201/047 ,  H05K2201/09127 ,  H05K2201/10106 ,  H05K2203/1316 ,  Y10T29/4913

Abstract: In various embodiments, a rigid-flex mounting board for at least one semiconductor light source is provided. The mounting board may include at least one rigid support region configured to mount the at least one semiconductor light source; and a flexible support region, wherein the flexible support region has been produced by thinning of a rigid support region.

Abstract translation: 在各种实施例中，提供了用于至少一个半导体光源的刚性柔性安装板。 安装板可以包括配置成安装至少一个半导体光源的至少一个刚性支撑区域; 以及柔性支撑区域，其中通过使刚性支撑区域变薄来制造柔性支撑区域。

公开(公告)号：US07905006B2

公开(公告)日：2011-03-15

申请号：US12376150

申请日：2006-09-25

Applicant: You Jung Kwon

Inventor： You Jung Kwon

IPC: H04R31/00

CPC classification number: H05K1/189 ,  H04R25/60 ,  H04R25/652 ,  H04R2225/025 ,  H05K2201/047 ,  H05K2201/10083 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908

Abstract: Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.

Abstract translation: 提供了一种用于耳内（ITE）助听器的面板和用于制造耳内（ITE）助听器的面板的方法，其中面板可以以紧凑的尺寸制造，使用可折叠的 柔性印刷电路板（PCB），同时保持质量，实现批量生产，降低制造成本。

公开(公告)号：US20100103631A1

公开(公告)日：2010-04-29

申请号：US12524245

申请日：2007-10-09

Applicant: Cunliang Tong ,  Shuxian Shi

Inventor： Cunliang Tong ,  Shuxian Shi

IPC: H05K5/02

CPC classification number: G06F21/86 ,  H05K1/0275 ,  H05K1/0284 ,  H05K1/141 ,  H05K5/0208 ,  H05K2201/047 ,  H05K2201/10151

Abstract: The present invention is adapted for field of electronic circuit protection and provides a security protection box, for enclosing the protected region of a protected circuit board in order to protect the elements in the protected region. The security protection box comprises a circuit board. The circuit board with thin center and thick periphery forms a box shape, and has the circuit routing layers. The circuit routing layers trigger the associated circuit to erase or destroy the information in the elements in the protected region when the circuit routing layers are physically attacked. The present invention protects the elements in the protected region through covering the protected region on the protected circuit board with a circuit board having thin center and thick periphery.

Abstract translation: 本发明适用于电子电路保护领域，并提供了一个安全保护盒，用于封装受保护电路板的受保护区域，以保护受保护区域中的元件。 安全保护箱包括电路板。 具有薄中心和厚边缘的电路板形成盒形，并具有电路布线层。 当电路布线层遭到物理攻击时，电路布线层触发相关电路以擦除或破坏受保护区域中的元件中的信息。 本发明通过用具有薄的中心和厚的外围的电路板覆盖受保护的电路板上的保护区域来保护受保护区域中的元件。

公开(公告)号：US20100008034A1

公开(公告)日：2010-01-14

申请号：US12172580

申请日：2008-07-14

Applicant: Jonathan R. Hinkle

Inventor： Jonathan R. Hinkle

IPC: G06F1/16 ,  H01S4/00

CPC classification number: G06F1/20 ,  H05K1/117 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/09745 ,  H05K2201/10159 ,  H05K2203/302 ,  Y10T29/49002

Abstract: Memory systems and methods of forming memory modules. In one embodiment, a computer memory system includes a substantially tubular frame with an elongate card edge extending along the frame. A flexible circuit comprising a flexible substrate, a plurality of memory chips affixed to the flexible substrate, and a plurality of electrical terminals interconnected with the memory chips, is secured along a perimeter of the tubular frame with the electrical terminals arranged along the card edge.

Abstract translation: 内存系统和形成内存模块的方法。 在一个实施例中，计算机存储器系统包括具有沿框架延伸的细长卡边缘的基本上管状的框架。 包括柔性基板，固定到柔性基板的多个存储芯片以及与存储芯片互连的多个电端子的柔性电路沿着管状框架的周边被固定，电端子沿卡边缘布置。

公开(公告)号：US20090261368A1

公开(公告)日：2009-10-22

申请号：US12243026

申请日：2008-10-01

Applicant: BILY WANG ,  SHIH-YU WU ,  WEN-KUEI WU

Inventor： BILY WANG ,  SHIH-YU WU ,  WEN-KUEI WU

IPC: H01L33/00 ,  H01L21/50

CPC classification number: H05K1/189 ,  F21K9/68 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K1/056 ,  H05K2201/047 ,  H05K2201/09036 ,  H05K2201/2054 ,  H05K2203/302 ,  H01L2924/00

Abstract: An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.

Abstract translation: 使用基板作为灯罩的LED芯片封装结构包括基板单元和发光单元。 基板单元具有带灯罩形状的基板主体。 发光单元具有多个发光元件，电子设置在基板主体的内表面上。 因此，由发光元件投影的光束的一部分被基板主体的内表面反射出灯罩。

公开(公告)号：US20090052165A1

公开(公告)日：2009-02-26

申请号：US12281342

申请日：2006-11-02

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: G02F1/13357 ,  F21V17/00

CPC classification number: G02B6/0068 ,  G02B6/0031 ,  G02B6/0073 ,  G02B6/0083 ,  G02F1/133615 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: LEDs (43) are arranged in a line on a film (41) which is provided with a conductor (44). The conductor (44) connects the LEDs (43) to a connector (45). The film (41) is bent at a division line (41c) between a region (41a) wherein the LEDs (43) are arranged and a region (41b) wherein the conductor (44) is formed, and placed on the inner surface of a reflector. A reflective material (46) is arranged on a surface of the conductor region (41b) which faces to the LEDs (43).

Abstract translation: 在设置有导体（44）的膜（41）上配置有LED（43）。 导体（44）将LED（43）连接到连接器（45）。 薄膜（41）在布置有LED（43）的区域（41a）和形成有导体（44）的区域（41b）之间的分割线（41c）处弯曲，并且被放置在 反射器 在面向LED（43）的导体区域（41b）的表面上布置有反射材料（46）。

公开(公告)号：US07326912B2

公开(公告)日：2008-02-05

申请号：US11259124

申请日：2005-10-27

Applicant: Chia-Chu Cheng ,  Tzu-Heng Liu ,  Ming-Ho Wang

Inventor： Chia-Chu Cheng ,  Tzu-Heng Liu ,  Ming-Ho Wang

IPC: H01L27/00 ,  G06K9/00

CPC classification number: G06K9/00013 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/047

Abstract: A contact image-sensing module having fingerprint-scanning function is described. The image-sensing module has a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least one flex circuit board. The first rigid circuit substrate, the second rigid circuit substrate, and the third rigid circuit substrate respectively and electrically connect to the flex circuit board in order to form a first composite substrate, a second composite substrate, and a third composite substrate. Each of the second composite substrate and the third composite substrate respectively is not located in the same plane and has a predetermined angle with respect to the plane where the first composite plane is located.

Abstract translation: 描述具有指纹扫描功能的接触式图像感测模块。 图像感测模块具有柔性/刚性复合衬底，其具有第一刚性电路衬底，第二刚性电路衬底，第三刚性电路衬底和至少一个柔性电路板。 第一刚性电路基板，第二刚性电路基板和第三刚性电路基板分别电连接到柔性电路板以形成第一复合基板，第二复合基板和第三复合基板。 第二复合基板和第三复合基板中的每一个分别不位于同一平面中，并且相对于第一复合平面所在的平面具有预定的角度。