公开(公告)号：US10176958B2

公开(公告)日：2019-01-08

申请号：US14389911

申请日：2013-04-26

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Osamu Sakaguchi ,  Michiya Takahashi ,  Shinya Adachi

IPC分类号： H01H85/143 ,  C22C5/06 ,  C22F1/14 ,  C22C5/08 ,  H01H1/0237 ,  C22C1/02 ,  B32B15/01 ,  C22C9/00 ,  H01H11/04 ,  H01H37/76

摘要： The present invention is an electrode material constituting a movable electrode of a thermal fuse, having a five-layer clad structure including a core material layer, an intermediate layer formed on the both sides of the core material layer, and a surface layer formed on the intermediate layer, wherein the core material layer includes Cu, the intermediate layer includes an Ag—Cu-based alloy, the surface layer includes an Ag—CuO-based oxide-dispersed strengthened alloy, and the ratio of the thickness of the intermediate layer to the thickness of the surface layer (intermediate layer/surface layer) is 0.2 or more and 1.0 or less. This electrode material can be manufactured by partially internally oxidizing a three-layer clad material in which plate materials made of an Ag—Cu-based alloy are clad-jointed to both sides of the plate material made of Cu.

公开(公告)号：US10030296B2

公开(公告)日：2018-07-24

申请号：US14649502

申请日：2013-12-02

申请人： ARGOR-HERAEUS SA

发明人： Sergio Arnaboldi ,  Marco Nauer ,  Stefano Ghiringhelli

IPC分类号： C22C5/02 ,  C22F1/14 ,  C22C1/02 ,  C22F1/00 ,  C22F1/02

摘要： Alloy for the manufacturing of jewels or clock components with minimum concentrations of gold of 75 wt %, of copper between 5% and 21%, of silver between 0% and 21%, of iron between 0.5% and 4% and vanadium between 0.1% and 2.0%, intended to increase the tarnishing-resistance of alloys with a minimum content of gold of 75 wt % under environments in which sulphur- and chlorine-compounds are present.

公开(公告)号：US20180112292A1

公开(公告)日：2018-04-26

申请号：US15729711

申请日：2017-10-11

申请人： Nivarox-FAR S.A.

发明人： Denis VINCENT ,  Christian Charbon

IPC分类号： C22C5/02 ,  C22F1/14 ,  G04B99/00 ,  B21B3/00 ,  B21B1/18 ,  B21C1/00

CPC分类号： C22C5/02 ,  A44C27/00 ,  B21B1/18 ,  B21B3/003 ,  B21C1/00 ,  B21F45/00 ,  C21D9/52 ,  C21D9/525 ,  C22F1/14 ,  G04B1/00 ,  G04B99/00

摘要： A precious alloy for horological applications contains by mass, in parts per thousand of the total, 540 to 630 parts of gold, 150 to 220 parts of palladium, 100 to 265 parts of silver, more than 150 to 265 parts of copper, from 0.0 to 0.2 parts of iridium, 0.0 to 4.0 parts of zinc, and the remainder containing iron and/or nickel and/or cobalt. The proportion by mass of the total content of gold, palladium, silver, copper, iridium and zinc is greater than 999.900 parts, the proportion by mass of the remainder is less than 0.100 parts. The density of the alloy includes between 13.5 and 14.5 g/cm3. The proportion by mass of cobalt is less than 0.005 parts, that of iron is less than 0.005 parts, and that of nickel is less than 0.0005 parts. The total of copper and zinc includes between 150 and 270 parts.

公开(公告)号：US09947429B2

公开(公告)日：2018-04-17

申请号：US14889334

申请日：2014-06-11

申请人： KOBE STEEL, LTD.

发明人： Yoko Shida ,  Hiroshi Goto ,  Mototaka Ochi

IPC分类号： B32B15/04 ,  H01B1/02 ,  C23C14/34 ,  C22C5/06 ,  C22F1/00 ,  C22F1/14 ,  H01L23/532 ,  C23C14/18 ,  H01J37/34 ,  H01L51/52

CPC分类号： H01B1/02 ,  C22C5/06 ,  C22F1/00 ,  C22F1/14 ,  C23C14/086 ,  C23C14/185 ,  C23C14/3414 ,  C23C14/5806 ,  H01J37/3429 ,  H01L23/53247 ,  H01L51/5218 ,  H01L2924/0002 ,  Y10T428/12896 ,  H01L2924/00

摘要： An Ag alloy film used for a reflecting electrode or an interconnection electrode, the Ag alloy film exhibiting low electrical resistivity and high reflectivity and having exceptional oxidation resistance under cleaning treatments such as an O2 plasma treatment or UV irradiation, wherein the Ag alloy film contains either In in an amount of larger than 2.0 atomic % to 2.7 atomic % or smaller; or Zn in an amount of larger than 2.0 atomic % to 3.5 atomic % or smaller; or both. The Ag alloy film may further contain Bi in an amount of 0.01 to 1.0 atomic %.

公开(公告)号：US20170266608A1

公开(公告)日：2017-09-21

申请号：US15085496

申请日：2016-03-30

申请人： Chien-Hsun Chuang ,  Hsing-Hua Tsai

发明人： Chien-Hsun Chuang ,  Hsing-Hua Tsai

IPC分类号： B01D53/22 ,  C25D7/04 ,  C25D5/48 ,  C23C14/24 ,  C23C14/16 ,  B23K1/008 ,  C22F1/14 ,  B01D53/04 ,  C22C5/04 ,  C23C14/34

CPC分类号： B01D53/22 ,  B01D53/0407 ,  B01D2053/223 ,  B01D2253/1122 ,  B01D2256/16 ,  B01D2257/102 ,  B23K1/008 ,  B23K20/008 ,  B23K20/16 ,  B23K20/24 ,  B23K2101/06 ,  B23K2101/34 ,  B23K2103/04 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  C01B3/505 ,  C22C5/04 ,  C22F1/14 ,  C23C14/165 ,  C23C14/24 ,  C23C14/34 ,  C25D5/48 ,  C25D7/04

摘要： A structure of assembly grasp for palladium-alloy tubes and the manufacturing method thereof are described. The structure of assembly grasp for palladium-alloy tubes includes a grasp with a plurality of holes, a plurality of palladium-alloy tubes inserted into the plurality of holes, and an intermetallic compound layer between the palladium-alloy tubes and the inner sidewalls of the plurality of holes.

公开(公告)号：US20170250410A1

公开(公告)日：2017-08-31

申请号：US15592522

申请日：2017-05-11

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

发明人： HONG YANG ,  JIANBO WU

IPC分类号： H01M4/92 ,  B22F1/00 ,  C22C5/04 ,  C22F1/14

CPC分类号： H01M4/921 ,  B22F1/0018 ,  B22F1/0085 ,  B22F1/0088 ,  B22F2001/0037 ,  B22F2301/15 ,  B22F2301/25 ,  B22F2304/054 ,  B22F2998/10 ,  C22C5/04 ,  C22F1/14 ,  H01M4/926

摘要： A noble metal-based electrocatalyst comprises a bimetallic particle comprising a noble metal and a non-noble metal and having a polyhedral shape. The bimetallic particle comprises a surface-segregated composition where an atomic ratio of the noble metal to the non-noble metal is higher in a surface region and in a core region than in a sub-surface region between the surface and core regions. A method of treating a noble metal-based electrocatalyst comprises annealing a bimetallic particle comprising a noble metal and a non-noble metal and having a polyhedral shape at a temperature in the range of from about 100° C. to about 1100° C.

公开(公告)号：US09745645B2

公开(公告)日：2017-08-29

申请号：US14632316

申请日：2015-02-26

申请人： King Fahd University of Petroleum and Minerals

发明人： Qasem Ahmed Drmosh ,  Mohammad Kamal Hossain ,  Nouar Amor Tabet

IPC分类号： C23C14/18 ,  C22C5/06 ,  C22F1/14 ,  C23C14/08 ,  C23C14/58 ,  B22F1/00

CPC分类号： C22C5/06 ,  B22F1/0014 ,  B22F1/0018 ,  B22F2001/0037 ,  C22F1/14 ,  C23C14/086 ,  C23C14/185 ,  C23C14/5806

摘要： A method of preparing silver nanoparticles, including silver nanorings. A zinc oxide thin film is formed initially by direct-current sputtering of a zinc target onto a substrate. A silver thin film is then formed by a similar sputtering technique, of a silver target onto the zinc oxide thin film. After that, the silver thin film is subject to an annealing treatment. The temperature, duration and atmosphere of the annealing treatment can be varied to control the average particle size, average distance between particles (density), particle size distribution of the silver nanoparticles. In at least one embodiment, silver nanoparticles of ring structure are produced.

公开(公告)号：US20170067143A1

公开(公告)日：2017-03-09

申请号：US15258475

申请日：2016-09-07

申请人： SEIKO EPSON CORPORATION

发明人： Masao NAKAYAMA ,  Eiju HIRAI ,  Toshihiro SHIMIZU ,  Motoki TAKABE ,  Eiji OSAWA

IPC分类号： C23C14/18 ,  H01L41/277 ,  B41J2/16 ,  C23C14/58 ,  C22F1/14 ,  C22F1/18 ,  H01L41/29 ,  C23C14/34

CPC分类号： C23C14/185 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1646 ,  C22F1/14 ,  C22F1/183 ,  C23C14/3414 ,  C23C14/5806 ,  H01L41/0477 ,  H01L41/0973 ,  H01L41/29

摘要： A method of manufacturing a piezoelectric element provided with first electrodes, a piezoelectric body layer, and a second electrode including a first platinum layer and second platinum layer, in which the first platinum layer having compression stress is formed on the piezoelectric body layer, which is provided on the first electrodes, using a sputtering technique, and the second platinum layer having tensile stress, is formed on the first platinum layer using a sputtering technique with a lower sputtering power than that when the first platinum layer is formed.

摘要翻译： 一种制造压电元件的方法，该压电元件设置有第一电极，压电体层和包括第一铂层和第二铂层的第二电极，其中在压电体层上形成具有压应力的第一铂层， 使用溅射技术，使用溅射技术在第一铂层上形成具有拉伸应力的第二铂层，并且使用溅射功率低于形成第一铂层时的溅射功率。

公开(公告)号：US20170008130A1

公开(公告)日：2017-01-12

申请号：US15119171

申请日：2015-02-19

申请人： MORGAN ADVANCE CERAMICS, INC

发明人： Mark Miklos ,  Abdelouahab Ziani

IPC分类号： B23K35/02 ,  B23K35/40 ,  C22C5/02 ,  B21C1/02 ,  C22C30/00 ,  C22F1/14 ,  C22F1/10 ,  B23K35/30 ,  C22C19/05

CPC分类号： B23K35/0227 ,  B21C1/02 ,  B22F1/0011 ,  B22F3/17 ,  B22F5/12 ,  B22F7/08 ,  B22F2998/10 ,  B23K35/0244 ,  B23K35/0261 ,  B23K35/0266 ,  B23K35/3013 ,  B23K35/3033 ,  B23K35/304 ,  B23K35/40 ,  B23K35/406 ,  C21D7/10 ,  C22C5/02 ,  C22C19/058 ,  C22C30/00 ,  C22F1/10 ,  C22F1/14 ,  B22F2003/248

摘要： Brazing alloy wire formed from a composite comprising a sheath of at least one ductile first phase and a core comprising particles of a different composition to the sheath, in which: the sheath has an annealing temperature in degrees K the particles have a melting point at least 20% above the annealing temperature of the sheath the particles have a size distribution in which 25% by weight or less comprise particles less than 25 μm in size the particles are discrete

摘要翻译： 由包括至少一个延性第一相的护套和包含与护套不同组成的颗粒的芯的复合材料形成的钎焊合金线，其中​​：所述护套具有以K为单位的退火温度，所述熔体的熔点至少为 颗粒具有尺寸分布的外壳的退火温度高20％，其中25重量％或更少的颗粒包含小于25μm的颗粒，颗粒是离散的

公开(公告)号：US09534307B2

公开(公告)日：2017-01-03

申请号：US14430653

申请日：2013-09-17

申请人： DOWA METALTECH CO., LTD.

发明人： Keisuke Shinohara ,  Masafumi Ogata ,  Hiroshi Miyazawa ,  Akira Sugawara

IPC分类号： B32B15/01 ,  C25D3/46 ,  C25D7/00 ,  C25D5/50 ,  H01R13/03 ,  H01H1/02 ,  C22C5/06 ,  C22C9/00 ,  C22F1/08 ,  C22F1/14 ,  H01H1/023 ,  H01H11/04 ,  H01H1/025

CPC分类号： C25D3/46 ,  B32B15/018 ,  C22C5/06 ,  C22C9/00 ,  C22F1/08 ,  C22F1/14 ,  C25D5/10 ,  C25D5/34 ,  C25D5/50 ,  C25D7/00 ,  H01H1/02 ,  H01H1/023 ,  H01H1/025 ,  H01H11/041 ,  H01H11/045 ,  H01H2011/046 ,  H01R13/03 ,  H01R2201/26 ,  Y10T428/12896

摘要： In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafter, an aging treatment is carried out to produce a silver-plated product wherein an area fraction in {200} orientation of the surface layer is 15% or more.

摘要翻译： 在其中在基材表面上或在形成在基材上的下层的表面上形成银表面的镀银产品中，银的表面层通过电镀在银镀浴中形成， 含有1〜15mg / L的硒，其中银与游离氰的质量比在0.9〜1.8的范围内，然后进行时效处理，得到镀银制品，其中， {200}表面层的取向为15％以上。