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公开(公告)号：US20240310589A1
公开(公告)日：2024-09-19
申请号：US18675112
申请日：2024-05-27
申请人： Ayar Labs, Inc.
发明人： Alexandra Wright , Mark Wade , Chen Sun , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Roy Edward Meade , Derek Van Orden
CPC分类号： G02B6/4202 , G02B6/2934 , G02B6/4216 , G02B6/4219 , G02B6/4287
摘要： An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
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公开(公告)号：US20240295760A1
公开(公告)日：2024-09-05
申请号：US18661110
申请日：2024-05-10
申请人： Ayar Labs, Inc.
发明人： Sidney Buchbinder , John Fini , Anatol Khilo
CPC分类号： G02F1/0147 , G02B6/136 , G02F1/011 , H01S5/026 , H01S5/0612 , G02F2201/06 , G02F2203/50
摘要： A thermo-optic phase shifter includes a substrate having a cavity formed into an upper region of the substrate. The thermo-optic phase shifter includes an optical waveguide disposed above the substrate. The optical waveguide extends across and above the cavity. The thermo-optic phase shifter also includes a heater device disposed along a lateral side of the optical waveguide. The heater device extends across and above the cavity. The cavity is formed by an undercut etching process after the optical waveguide and the heater device is formed. The optical waveguide can be formed to include one or more segments that pass over the cavity. Also, a second heater device can be included such that the one or more segments of the optical waveguide that extend over the cavity are bracketed by heater devices. Thermal transmission structures can be included to enhance heat transfer between the heater device(s) and the optical waveguide.
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公开(公告)号：US11982887B2
公开(公告)日：2024-05-14
申请号：US17070891
申请日：2020-10-14
申请人： Ayar Labs, Inc.
发明人： Sidney Buchbinder , John Fini , Anatol Khilo
CPC分类号： G02F1/0147 , G02B6/136 , G02F1/011 , H01S5/026 , H01S5/0612 , G02F2201/06 , G02F2203/50
摘要： A thermo-optic phase shifter includes a substrate having a cavity formed into an upper region of the substrate. The thermo-optic phase shifter includes an optical waveguide disposed above the substrate. The optical waveguide extends across and above the cavity. The thermo-optic phase shifter also includes a heater device disposed along a lateral side of the optical waveguide. The heater device extends across and above the cavity. The cavity is formed by an undercut etching process after the optical waveguide and the heater device is formed. The optical waveguide can be formed to include one or more segments that pass over the cavity. Also, a second heater device can be included such that the one or more segments of the optical waveguide that extend over the cavity are bracketed by heater devices. Thermal transmission structures can be included to enhance heat transfer between the heater device(s) and the optical waveguide.
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公开(公告)号：US20240061181A1
公开(公告)日：2024-02-22
申请号：US18499093
申请日：2023-10-31
申请人： Ayar Labs, Inc.
CPC分类号： G02B6/30 , H01L21/565 , G02B6/122 , G02B6/428
摘要： A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
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公开(公告)号：US11822128B2
公开(公告)日：2023-11-21
申请号：US17516602
申请日：2021-11-01
申请人： Ayar Labs, Inc.
CPC分类号： G02B6/30 , G02B6/122 , H01L21/565 , G02B6/428
摘要： A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
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公开(公告)号：US20230370170A1
公开(公告)日：2023-11-16
申请号：US18354379
申请日：2023-07-18
申请人： Ayar Labs, Inc.
发明人： Roy Edward Meade , Vladimir Stojanovic , Chen Sun , Mark Wade , Hugo Saleh , Charles Wuischpard
CPC分类号： H04B10/80 , G02B6/4249 , G02B6/4274 , G11C5/04 , G11C5/06 , G11C5/141 , G11C11/42 , H04B10/516
摘要： A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
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7.发明公开公开(公告)号：US20230367072A1
公开(公告)日：2023-11-16
申请号：US18357131
申请日：2023-07-23
申请人： Ayar Labs, Inc.
发明人： Pavan Bhargava , Derek Van Orden , Mark Wade , John Fini , Chen Sun , Milos Popovic , Anatol Khilo
CPC分类号： G02B6/29343 , G02B6/2934 , G02B27/1006 , G02B6/2766 , G02B6/2773 , G02B6/272 , G02B6/4213 , G02B6/4215 , H04B10/60
摘要： An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.
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公开(公告)号：US11774679B2
公开(公告)日：2023-10-03
申请号：US17582900
申请日：2022-01-24
申请人： Ayar Labs, Inc.
发明人： Pavan Bhargava , John Fini , Derek Van Orden , Chen Sun , Mark Wade
IPC分类号： G02B6/293 , G02F1/225 , G01J1/04 , G01J1/44 , G02B6/12 , H01L31/0232 , H01L31/105
CPC分类号： G02B6/2934 , G01J1/0425 , G01J1/44 , G02B6/12007 , G02F1/2257 , H01L31/02327 , H01L31/105 , G01J2001/446 , G02B6/29338 , G02F2203/15
摘要： A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.
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公开(公告)号：US20230291493A1
公开(公告)日：2023-09-14
申请号：US18180100
申请日：2023-03-07
申请人： Ayar Labs, Inc.
发明人： Manan Raval , Matthew Sysak , Judson Ryckman , Sidney Buchbinder
CPC分类号： H04J14/0282 , H04Q11/0067
摘要： An optical distribution network includes a fore-positioned optical multiplexer section that has a plurality of optical inputs and a plurality of intermediate optical outputs. Each of the plurality of optical inputs of the fore-positioned optical multiplexer section receives a respective one of a plurality of input light signals of different wavelengths. The fore-positioned optical multiplexer section multiplexes a unique subset of the plurality of input light signals onto each of the plurality of intermediate optical outputs. The optical distribution network also includes an optical coupler section that has a plurality of optical inputs respectively optically connected to the plurality of intermediate optical outputs of the fore-positioned optical multiplexer section. The optical coupler section distributes a portion of each light signal received at each of the plurality of optical inputs of the optical coupler section to each and every one of a plurality of optical outputs of the optical coupler section.
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公开(公告)号：US11500153B2
公开(公告)日：2022-11-15
申请号：US17070601
申请日：2020-10-14
申请人： Ayar Labs, Inc.
发明人： Roy Edward Meade , Chong Zhang , Haiwei Lu , Chen Li
摘要： A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
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