Plasma processing apparatus and data analysis apparatus

    公开(公告)号:US11538671B2

    公开(公告)日:2022-12-27

    申请号:US16666842

    申请日:2019-10-29

    IPC分类号: H01J37/32

    摘要: In time-series data indicating light emission of plasma when plasma processing is carried out on a sample by generating the plasma, an analysis apparatus creates combinations of a plurality of light emission wavelengths of elements and a plurality of time intervals within a plasma processing interval and calculates, for each of the combinations of the wavelengths and the time intervals, a correlation between an average value of light emission intensity and the number of times the plasma processing is carried out on the samples for each of the combinations of the wavelengths and the time intervals that have been created. Thereafter, the data analysis apparatus selects, as a combination of the wavelength and the time interval used to observe or control the plasma processing, a combination of a wavelength of light emitting from a specific element and a specific time interval having a maximum correlation.

    Automated analysis device
    3.
    发明授权

    公开(公告)号:US11506534B2

    公开(公告)日:2022-11-22

    申请号:US16472129

    申请日:2017-10-24

    摘要: An automatic analysis apparatus comprises: a light source generating light having a center wavelength equal to or shorter than 340 nm; a fluorescent substance excited by the light source light, and generates light together with transmitted light from the light source, having a wavelength of 340 nm to 800 nm; a condenser lens; at least one slit; a reaction cell holding a reaction solution where a specimen and reagent are mixed, and that the light source light and the light from the fluorescent substance enter; and a detector that detects light transmitted through the reaction cell. The light source, fluorescent substance, condenser lens, and slit are provided along a straight light corresponding to the optical axis. The width of the slit's opening is equal to or narrower than the width of a ray forming an image of the light source at the position of the slit.

    Defect classification device, inspection device, and inspection system

    公开(公告)号:US11442024B2

    公开(公告)日:2022-09-13

    申请号:US16642948

    申请日:2017-09-11

    IPC分类号: G01N21/95 G01N21/956

    摘要: In order to prevent an erroneous determination of an on-film defect, the sensitivity of the post-inspection is reduced so that a film swelling due to a minute defect would not be detected. Classification is performed to determine whether a defect is at least one of an on-film defect and a film swelling, by performing a coordinate correction on the result of a post-inspection by an actual-defect fine alignment using the result of a pre-inspection performed with two-stage thresholds, and by checking defects against each other. In addition, classification is performed to determine whether a defect is at least one of an on-film defect and a film swelling by, during the post-inspection, preparing instruction data from information of the refractive index and thickness of a film formed on a wafer and comparing the instruction data with a signal intensity ratio of a detection system.

    Linear motor for vacuum and vacuum processing apparatus

    公开(公告)号:US11418101B2

    公开(公告)日:2022-08-16

    申请号:US16600010

    申请日:2019-10-11

    摘要: Since wires connected to a linear motor are routed in a vacuum sample chamber, outgassing is generated from wire coating and efficiency of assembly operations is reduced. Further, there is a problem that thrust generation efficiency of the linear motor is reduced when a gap between a coil and a permanent magnet of the linear motor cannot be small. In order to solve the above problems, a linear motor for vacuum is provided, the linear motor for vacuum including: a mover having a permanent magnet; and a stator having a support member to which a coil is fixed, in which the support member includes a vacuum sealing portion that vacuum seals with a wall surface of a vacuum sample chamber, and a feed-through for supplying a current to the coil provided in the vacuum sample chamber.

    Analysis method and semiconductor etching apparatus

    公开(公告)号:US11410836B2

    公开(公告)日:2022-08-09

    申请号:US16281652

    申请日:2019-02-21

    摘要: There is provided a method of analyzing data obtained from an etching apparatus for micromachining a wafer using plasma. This method includes the following steps: acquiring the plasma light-emission data indicating light-emission intensities at a plurality of different wavelengths and times, the plasma light-emission data being measured under a plurality of different etching processing conditions, and being obtained at the time of the etching processing, evaluating the relationship between changes in the etching processing conditions and changes in the light-emission intensities at the plurality of different wavelengths and times with respect to the wavelengths and times of the plasma light-emission data, and identifying the wavelength and the time of the plasma light-emission data based on the evaluation result, the wavelength and the time being to be used for the adjustment of the etching processing condition.

    Connection module and interference avoidance method

    公开(公告)号:US11360111B2

    公开(公告)日:2022-06-14

    申请号:US16636738

    申请日:2018-08-23

    IPC分类号: G01N35/04 G01N35/02 G01N35/00

    摘要: Provided is a connection module with a high degree of freedom for an automatic analyzer which does not depend on a device as a discharge destination. For this purpose, a module to be connected to an automatic analyzer with a rack rotor mechanism includes: a rack discharge mechanism for moving a rack from the rack rotor mechanism to a rotation holder; a rack rotating mechanism for rotating the rack moved to the rotation holder; a conveyor mechanism for transporting the rack from the rack rotating mechanism to a discharge port; and a feeder mechanism for pushing the rack out of the rotation holder to the conveyor mechanism, in which the rack rotating mechanism rotates the rotation holder from a direction parallel to the rack discharge mechanism to a direction parallel to the feeder mechanism and the conveyor mechanism in the selected rotation direction.

    Capillary electrophoresis device
    9.
    发明授权

    公开(公告)号:US11360047B2

    公开(公告)日:2022-06-14

    申请号:US16633641

    申请日:2017-07-31

    IPC分类号: G01N27/447 G01N27/416

    摘要: An electrophoresis device has: a sample tray (112) on which there are placed a positive-electrode-side buffer solution container (103) containing a buffer solution and a phoresis medium container (102) containing a phoresis medium, and which is driven in a vertical direction and a horizontal direction; a thermostat oven unit (113) that holds a capillary array having a capillary head in which a plurality of capillaries are bundled in a single unit at one end thereof in a state where the capillary array being held in a state in which the capillary head protrudes downward, and that keeps the interior temperature constant; a solution-delivering mechanism (106) for delivering the phoresis medium in the phoresis medium container to the capillary array from the capillary head; and a power source for applying a voltage to both ends of the capillary array. Holes for insertion of the capillary head are provided in upper sections of the positive-electrode-side buffer solution container and the phoresis medium container. The thermostat oven unit is provided with a first lid member (207) that is positioned above the sample tray and seals the upper section of the positive-electrode-side buffer solution container while the phoresis medium is being delivered by the solution-delivering mechanism.

    Charged particle beam device
    10.
    发明授权

    公开(公告)号:US11335533B2

    公开(公告)日:2022-05-17

    申请号:US16474846

    申请日:2017-02-24

    IPC分类号: H01J37/20 H01J37/28

    摘要: The purpose of the present invention is to provide a charged particle beam device which suppresses sample deformation caused by placing a sample on a suctioning surface of an electrostatic chuck mechanism, the sample having a temperature different from the suctioning surface. Proposed is a charged particle beam device which has an electrostatic chuck mechanism, the charged particle beam device being provided with: a stage (200) which moves a sample, which is to be irradiated with a charged particle beam, relative to an irradiation position of the charged particle beam; an insulating body (203) which is disposed on the stage and constitutes a dielectric layer of the electrostatic chuck; a first support member (402) which supports the insulating body on the stage; a ring-shaped electrode (400) which encloses the surroundings of the sample and is installed on the insulating body in a contactless manner, and to which a predetermined voltage is applied; and a second support member (405) which supports the ring-shaped electrode.