公开(公告)号：US08079139B1

公开(公告)日：2011-12-20

申请号：US12805976

申请日：2010-08-27

申请人： Shih Chieh Lin ,  Li Min Chen ,  Yung Chieh Chen

发明人： Shih Chieh Lin ,  Li Min Chen ,  Yung Chieh Chen

IPC分类号： H01R43/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48247 ,  H01L2924/181 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method for producing an electro-thermal separation type light emitting diode support structure is provided. One of the embodiments for the support structure has at least two heat dissipation bases and at least two conductive supports which are coupled by a heat dissipation plate and a support plate. Another embodiment for the support structure has at least two heat dissipation bases and at least two conductive supports which are formed by a thick-thin plate. The light emitting diode chips of different types can be configured on the heat dissipation bases of these designs, respectively. Therefore, the invention achieves the goal of using different types of light emitting diode chips at the same time.

摘要翻译： 提供了一种制造电热分离型发光二极管支撑结构的方法。 用于支撑结构的实施例之一具有至少两个散热基座和至少两个通过散热板和支撑板联接的导电支撑件。 用于支撑结构的另一个实施例具有至少两个散热基座和由厚薄板形成的至少两个导电支撑件。 不同类型的发光二极管芯片可以分别配置在这些设计的散热底座上。 因此，本发明实现了同时使用不同类型的发光二极管芯片的目的。

公开(公告)号：US20090027884A1

公开(公告)日：2009-01-29

申请号：US11782983

申请日：2007-07-25

申请人： WAN-SHUN CHOU

发明人： WAN-SHUN CHOU

IPC分类号： F21V5/00 ,  B23P17/00

CPC分类号： H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T29/49616 ,  H01L2924/00014

摘要： A structure of a supporting assembly for a surface mount device LED and a manufacturing method thereof are provided. The structure of a supporting assembly comprises a plate and a substrate of LEDs. The plate has a plurality of supporting areas and a plurality of lenses each of which is respectively disposed on each supporting area. The substrate of LEDs comprises a metallic plate unit and a plurality of a surface mount device LED units each formed on the metallic plate unit. Moreover, the plate is combined with the metallic plate unit, so that each lens is respectively assembled with the corresponding surface mounting device LED unit. Via the above-mentioned structure, mass produced lenses can be assembled with and positioned on the corresponding LED units at the same time. The processes are modified and the production rate is increased.

摘要翻译： 提供了一种用于表面贴装器件LED的支撑组件及其制造方法的结构。 支撑组件的结构包括板和LED的基板。 该板具有多个支撑区域和多个透镜，每个透镜分别设置在每个支撑区域上。 LED的基板包括金属板单元和多个在金属板单元上形成的表面安装器件LED单元。 此外，板与金属板单元组合，使得每个透镜分别与相应的表面安装装置LED单元组装。 通过上述结构，大量生产的透镜可以同时组装并定位在相应的LED单元上。 这些过程被修改，生产率提高。

公开(公告)号：US20150176800A1

公开(公告)日：2015-06-25

申请号：US14140509

申请日：2013-12-25

申请人： I-CHIUN PRECISION INDUSTRY CO., LTD.

发明人： CHIEN-YU CHEN ,  CHING-AN WU

IPC分类号： F21V7/00

CPC分类号： F21V7/00 ,  H01L24/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48245 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A supporting base for a semiconductor chip comprises a substrate, a surrounding wall and a reflection plate. The surrounding wall is formed on the substrate, and an accommodating space is formed between the surrounding wall and the substrate and is provided for receiving the semiconductor chip therein. The semiconductor chip is electrically connected to the substrate. The surrounding wall includes a cut-out portion on one side thereof. The reflection plate is extend to be bent from the substrate, and the reflection plate is configured to correspond to the cut-out portion and the semiconductor and is formed of an obtuse angle with the substrate. Therefore, with such structure, the present invention is able to achieve the effect of an increased illumination range.

摘要翻译： 半导体芯片的支撑基座包括基板，周围壁和反射板。 周围的壁形成在基板上，并且在周围壁和基板之间形成容纳空间，并且设置用于在其中容纳半导体芯片。 半导体芯片电连接到基板。 周围壁在其一侧包括切口部分。 反射板延伸成从基板弯曲，并且反射板被配置为对应于切口部分和半导体，并且与基板形成钝角。 因此，通过这样的结构，本发明能够实现增加的照明范围的效果。

公开(公告)号：US20140075751A1

公开(公告)日：2014-03-20

申请号：US13732728

申请日：2013-01-02

申请人： I-CHIUN PRECISION INDUSTRY CO., LTD.

发明人： Ting-Hsi LI ,  Yu-Jen LIN

IPC分类号： H05K13/00

CPC分类号： H05K13/00 ,  H01L21/4821 ,  H01L33/0095 ,  H01L2933/0033 ,  Y10T29/49149

摘要： The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas.

摘要翻译： 本发明涉及一种LED引线框架的制造方法。 该方法包括以下步骤：（a）通过注射成型形成具有多个引线区域的金属基底; （b）电镀金属基底; 和（c）在每个引导区域上形成绝缘壳体。

公开(公告)号：USD662235S1

公开(公告)日：2012-06-19

申请号：US29349950

申请日：2010-05-24

申请人： You Cheun Lain ,  Meng Hsien Chou ,  Chun Ping Hsu

设计人： You Cheun Lain ,  Meng Hsien Chou ,  Chun Ping Hsu

公开(公告)号：USD627501S1

公开(公告)日：2010-11-16

申请号：US29349599

申请日：2010-04-16

申请人： Hung Jie Lin ,  Yu Hsin Tsai ,  Meng Hsieh Chou

设计人： Hung Jie Lin ,  Yu Hsin Tsai ,  Meng Hsieh Chou

公开(公告)号：US09533423B2

公开(公告)日：2017-01-03

申请号：US14716928

申请日：2015-05-20

申请人： I-CHIUN PRECISION INDUSTRY CO., LTD.

发明人： Wan-Shun Chou

IPC分类号： B26B21/38 ,  H02K33/00

CPC分类号： B26B21/38 ,  H02K33/00

摘要： A vibrating razor includes a handle, a razor blade and a flat-type vibration motor. The handle includes a front end having a receiving slot provided thereon; wherein the receiving slot includes a bottom wall. The razor blade is arranged at the front end of the handle. The flat-type vibration motor is arranged within the receiving slot and includes an outer shell with a cover; wherein the cover includes an external protruding dot on one side of an outer surface thereof. The flat-type vibration motor contacts the bottom wall of the receiving slot via the external protruding dot. Therefore, the external protruding dot can be utilized to increase the vibration strength of the razor blade as the flat-type vibration motor rotates to impact the bottom wall of the receiving slot.

摘要翻译： 振动剃刀包括手柄，剃刀刀片和平型振动马达。 手柄包括：前端，其上设有接纳槽; 其中所述接收槽包括底壁。 剃刀刀片布置在手柄的前端。 扁平型振动电动机设置在容纳槽内，并包括具有盖的外壳; 其中所述盖在其外表面的一侧上包括外部突出点。 扁平型振动电机通过外部突出点与接收槽的底壁接触。 因此，当扁平型振动马达旋转以冲击接收槽的底壁时，可以利用外部突出点来增加剃刀刀片的振动强度。

公开(公告)号：US20150323141A1

公开(公告)日：2015-11-12

申请号：US14271684

申请日：2014-05-07

申请人： I-CHIUN PRECISION INDUSTRY CO., LTD.

发明人： Wan-Shun CHOU ,  Ming-Xian LIN

IPC分类号： F21K99/00 ,  F21V5/04

CPC分类号： F21V5/04 ,  F21V5/043 ,  F21W2131/103 ,  F21Y2115/10

摘要： An optical component includes a light-emitting surface and a bottom surface opposite to the light-emitting surface. The light-emitting surface and the bottom surface cooperatively form a negative lens portion, two first positive lens portions, and two second positive lens portions. The first positive lens portions and the second positive lens portions surround the negative lens portion and arranged in a stagger manner. The first positive lens portion have a first curvature, the second position lens portion have a second curvature smaller larger than the first curvature.

摘要翻译： 光学部件包括发光面和与发光面相反的底面。 发光面和底面协同地形成负透镜部分，两个第一正透镜部分和两个第二正透镜部分。 第一正透镜部分和第二正透镜部分围绕负透镜部分并且以错开的方式布置。 第一正透镜部分具有第一曲率，第二位置透镜部分具有比第一曲率更小的第二曲率。

公开(公告)号：USD694202S1

公开(公告)日：2013-11-26

申请号：US29434653

申请日：2012-10-15

申请人： Shih-Chieh Lin ,  Shao-Cheng Tseng

设计人： Shih-Chieh Lin ,  Shao-Cheng Tseng

公开(公告)号：US08192058B2

公开(公告)日：2012-06-05

申请号：US12703763

申请日：2010-02-11

申请人： Meng Hsieh Chou ,  Yen Chi Wu

发明人： Meng Hsieh Chou ,  Yen Chi Wu

IPC分类号： F21V3/00

CPC分类号： F21S8/02 ,  F21V17/162 ,  F21V17/164 ,  F21V29/745 ,  F21V29/75 ,  F21V29/763 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED recessed light with transparent board includes a heat sink base, an LED illumination module, a sleeve, a transparent board and a positioning element. The heat sink base has a first surface and a second surface. The LED illumination module is mounted on the first surface of the heat sink base thereof. The sleeve is mounted on the first surface of the heat sink, so as to the LED illumination module is located within the sleeve, and the sleeve is formed with an open end, which has an internal flange. The transparent board is arranged at internal flange of the sleeve for covering the sleeve. And the positioning element is mounted at the sleeve for positioning the transparent board.

摘要翻译： 具有透明板的LED嵌入式灯具包括散热器基座，LED照明模块，套筒，透明板和定位元件。 散热器底座具有第一表面和第二表面。 LED照明模块安装在其散热器基座的第一表面上。 套筒安装在散热器的第一表面上，以使LED照明模块位于套筒内，并且套筒形成开口端，该开口端具有内部凸缘。 透明板布置在套筒的内部凸缘上以覆盖套筒。 定位元件安装在套筒上，用于定位透明板。