Abstract:
The invention provides a method and system for communication between processors. Rather than provide an external network connection solely for providing a communication link between CPUs, the present invention utilizes the network devices to transfer information between CPUs. A transmitting network device marks a control packet, which is intended as a communication between CPUs, as control traffic. The receiving network device will determine whether the received control packet is intended for its own CPU and provide the control packet to its CPU if that is the case.
Abstract:
Methods and network device apparatus for discovering interconnections between a plurality of network devices are disclosed. An example network device apparatus includes a first stack port configured to couple the network device with a next network device and a second stack port configured to couple the network device with a previous network device. The example network device is configured to send, to the next network device through the first stack port, a first probe packet and a routing packet. The example network device is further configured to receive, from the previous network device through the second stack port, a second probe packet and the routing packet. The example network device is still further configured to confirm that the previous network device and the next network device have received configuration information included in the routing packet.
Abstract:
An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.
Abstract:
A method of adjusting fields of a datagram in the handling of the datagram in a network device may comprising receiving a datagram, with the datagram having at least module identifier fields and port identifier fields, at a port of a network device, adding or subtracting an offset value to at least one of the module identifier fields and at least one of the port identifier fields of the datagram based on data registers in the network device, and forwarding the datagram to a legacy device based on the module and port identifier fields of the datagram. A size of each of the module identifier fields and the port identifier fields handled by the legacy device may be smaller than a size of the module identifier fields and port identifier fields handled by the network device.
Abstract:
A method and system for automatically trunking ports connecting network devices arranged in a stacked configuration is provided. The method includes sending a packet, from a sending network device to at least one other receiving network device, through each of a plurality of ports of the network device. The packet includes at least an identifier for identifying the sending network device. The receiving network device maintains a table identifying which ports are connected to a neighboring network device. The network device automatically trunks the ports which are connected to the same network device;
Abstract:
Methods and systems for processing packets in data network using multistage classification are disclosed. An example method for processing packets includes receiving a data packet at a first processing stage and examining the packet at the first processing stage to determine a first attribute of the packet. Based on the first attribute, a first classification is assigned to the packet. In the example method, the packet and the first classification are communicated from the first processing stage to a second processing stage and the packet is examined at the second processing stage to determine a second attribute of the packet. Based on the second attribute, a second classification is assigned to the packet. The example method further includes processing the packet based on the first classification and the second classification.
Abstract:
A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
Abstract:
Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.
Abstract:
Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 μJ per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz. The laser pulsewidth measured at the full width half-maximum points is preferably less than 80 ns.
Abstract:
Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.