Method for communication between processors
    1.
    发明授权
    Method for communication between processors 有权
    处理器之间的通信方法

    公开(公告)号:US08432809B2

    公开(公告)日:2013-04-30

    申请号:US11200007

    申请日:2005-08-10

    CPC classification number: H04L49/65 H04L43/50 H04L45/02 H04L45/583 H04L49/351

    Abstract: The invention provides a method and system for communication between processors. Rather than provide an external network connection solely for providing a communication link between CPUs, the present invention utilizes the network devices to transfer information between CPUs. A transmitting network device marks a control packet, which is intended as a communication between CPUs, as control traffic. The receiving network device will determine whether the received control packet is intended for its own CPU and provide the control packet to its CPU if that is the case.

    Abstract translation: 本发明提供了一种用于处理器之间的通信的方法和系统。 本发明不是仅提供用于在CPU之间提供通信链路的外部网络连接,而是利用网络设备在CPU之间传送信息。 发送网络设备标记作为CPU之间的通信的控制分组,作为控制业务。 接收网络设备将确定接收到的控制分组是否适用于其自己的CPU,并且如果是这样,则向其CPU提供控制分组。

    Dynamic connectivity determination
    2.
    发明授权
    Dynamic connectivity determination 失效
    动态连接确定

    公开(公告)号:US08295202B2

    公开(公告)日:2012-10-23

    申请号:US12684676

    申请日:2010-01-08

    CPC classification number: H04L43/50 H04L41/0816 H04L41/0873 H04L41/12

    Abstract: Methods and network device apparatus for discovering interconnections between a plurality of network devices are disclosed. An example network device apparatus includes a first stack port configured to couple the network device with a next network device and a second stack port configured to couple the network device with a previous network device. The example network device is configured to send, to the next network device through the first stack port, a first probe packet and a routing packet. The example network device is further configured to receive, from the previous network device through the second stack port, a second probe packet and the routing packet. The example network device is still further configured to confirm that the previous network device and the next network device have received configuration information included in the routing packet.

    Abstract translation: 公开了用于发现多个网络设备之间的互连的方法和网络设备装置。 示例性网络设备设备包括被配置为将网络设备与下一个网络设备耦合的第一堆叠端口和被配置为将网络设备与先前网络设备耦合的第二堆叠端口。 该示例网络设备被配置为通过第一堆栈端口向下一个网络设备发送第一探测分组和路由分组。 示例网络设备还被配置为从先前的网络设备通过第二堆栈端口接收第二探测分组和路由分组。 示例网络设备还被配置为确认先前的网络设备和下一个网络设备已经接收到包括在路由分组中的配置信息。

    REMAPPING MODULE IDENTIFIER FIELDS AND PORT IDENTIFIER FIELDS
    4.
    发明申请
    REMAPPING MODULE IDENTIFIER FIELDS AND PORT IDENTIFIER FIELDS 有权
    取款模块识别码字段和端口标识符字段

    公开(公告)号:US20100265952A1

    公开(公告)日:2010-10-21

    申请号:US12830728

    申请日:2010-07-06

    Abstract: A method of adjusting fields of a datagram in the handling of the datagram in a network device may comprising receiving a datagram, with the datagram having at least module identifier fields and port identifier fields, at a port of a network device, adding or subtracting an offset value to at least one of the module identifier fields and at least one of the port identifier fields of the datagram based on data registers in the network device, and forwarding the datagram to a legacy device based on the module and port identifier fields of the datagram. A size of each of the module identifier fields and the port identifier fields handled by the legacy device may be smaller than a size of the module identifier fields and port identifier fields handled by the network device.

    Abstract translation: 在网络设备中处理数据报中调整数据报的字段的方法可以包括在网络设备的端口处接收数据报,数据报至少具有模块标识符字段和端口标识符字段,添加或减去 基于所述网络设备中的数据寄存器,将所述数据报的至少一个模块标识符字段和所述端口标识符字段中的至少一个的偏移值,并且基于所述模块标识符字段的模块和端口标识符字段将所述数据报转发到传统设备 数据报 由遗留设备处理的每个模块标识符字段和端口标识符字段的大小可以小于由网络设备处理的模块标识符字段和端口标识符字段的大小。

    HiGig AUTOTRUNKING
    5.
    发明申请

    公开(公告)号:US20100172365A1

    公开(公告)日:2010-07-08

    申请号:US12502017

    申请日:2009-07-13

    CPC classification number: H04L45/02

    Abstract: A method and system for automatically trunking ports connecting network devices arranged in a stacked configuration is provided. The method includes sending a packet, from a sending network device to at least one other receiving network device, through each of a plurality of ports of the network device. The packet includes at least an identifier for identifying the sending network device. The receiving network device maintains a table identifying which ports are connected to a neighboring network device. The network device automatically trunks the ports which are connected to the same network device;

    Abstract translation: 提供一种用于自动中继连接以堆叠配置布置的网络设备的端口的方法和系统。 该方法包括通过网络设备的多个端口中的每个端口从发送网络设备向至少一个其他接收网络设备发送分组。 该分组至少包括用于识别发送网络设备的标识符。 接收网络设备维护一个表,其中标识哪些端口连接到相邻网络设备。 网络设备自动中继连接到同一网络设备的端口;

    Network packet processing using multi-stage classification
    6.
    发明申请
    Network packet processing using multi-stage classification 失效
    网络数据包处理采用多级分类

    公开(公告)号:US20080205403A1

    公开(公告)日:2008-08-28

    申请号:US11711984

    申请日:2007-02-28

    Abstract: Methods and systems for processing packets in data network using multistage classification are disclosed. An example method for processing packets includes receiving a data packet at a first processing stage and examining the packet at the first processing stage to determine a first attribute of the packet. Based on the first attribute, a first classification is assigned to the packet. In the example method, the packet and the first classification are communicated from the first processing stage to a second processing stage and the packet is examined at the second processing stage to determine a second attribute of the packet. Based on the second attribute, a second classification is assigned to the packet. The example method further includes processing the packet based on the first classification and the second classification.

    Abstract translation: 公开了使用多级分类处理数据网络中数据包的方法和系统。 处理分组的示例性方法包括在第一处理阶段接收数据分组,并在第一处理阶段检查分组以确定分组的第一属性。 基于第一属性,将第一分类分配给分组。 在示例性方法中,将分组和第一分类从第一处理阶段传送到第二处理阶段,并且在第二处理阶段检查分组以确定分组的第二属性。 基于第二属性,向分组分配第二分类。 该示例方法还包括基于第一分类和第二分类处理分组。

    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES
    7.
    发明申请
    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
    使用具有特殊定制电源配置的激光脉冲进行链接处理

    公开(公告)号:US20080203071A1

    公开(公告)日:2008-08-28

    申请号:US12052577

    申请日:2008-03-20

    Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

    Abstract translation: 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲,或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长(例如绿色和紫外线)来切断连接,而不会对基板和钝化结构材料的任何一侧和底层 链接。

    Ultraviolet laser ablative patterning of microstructures in semiconductors
    9.
    发明申请
    Ultraviolet laser ablative patterning of microstructures in semiconductors 审中-公开
    半导体微结构的紫外激光烧蚀图案化

    公开(公告)号:US20060091126A1

    公开(公告)日:2006-05-04

    申请号:US11280957

    申请日:2005-11-15

    Abstract: Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 μJ per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz. The laser pulsewidth measured at the full width half-maximum points is preferably less than 80 ns.

    Abstract translation: 特征尺寸小于50微米的图案使用紫外激光烧蚀直接在半导体,特别是硅,GaAs,磷化铟或单晶蓝宝石中形成。 这些图案包括用于集成电路连接的非常高的纵横比圆柱形通孔开口; 包含在半导体晶片上的加工芯片的分割; 和微型切割以从母半导体晶片分离微电路工件。 来自二极管泵浦Q开关频率三倍的Nd:YAG,Nd:YVO 4或Nd:YLF的激光输出脉冲(32)以高速精度被引导到工件(12) 使用复合光束定位器。 光学系统产生约10微米的高斯光点尺寸或顶帽光束轮廓。 用于使用这种聚焦光点尺寸的半导体高速烧蚀处理的脉冲能量大于5kHz,优选高于15kHz的脉冲重复频率时,每脉冲大于200μJ。 在全宽度半最大点处测量的激光脉冲宽度优选小于80ns。

    Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
    10.
    发明申请
    Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously 有权
    使用同轴间隔的多个激光束点的半导体结构处理

    公开(公告)号:US20050282407A1

    公开(公告)日:2005-12-22

    申请号:US11051500

    申请日:2005-02-04

    CPC classification number: B23K26/067 H01L21/76894

    Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.

    Abstract translation: 方法和系统使用多个激光束选择性地照射半导体衬底上或内部的结构。 这些结构被布置成在大体上沿长度方向延伸的一排。 该方法产生沿着与半导体衬底相交的第一激光束轴传播的第一激光束和沿着与半导体衬底相交的第二激光束轴传播的第二激光束。 该方法同时将第一和第二激光束引导到行中不同的第一和第二结构。 该方法使第一激光束和第二激光束相对于半导体衬底在基本上平行于该行的长度方向的方向基本上一致地移动,以便用一个或多个第一和第二激光器选择性地照射该行中的结构 梁同时进行。

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