公开(公告)号：US20140035164A1

公开(公告)日：2014-02-06

申请号：US14052691

申请日：2013-10-11

申请人： Kwang-jin Moon ,  Byung-lyul Park ,  Dong-chan Lim ,  Deok-young Jung ,  Gil-heyun Choi ,  Dae-lok Bae ,  Pil-kyu Kang

发明人： Kwang-jin Moon ,  Byung-lyul Park ,  Dong-chan Lim ,  Deok-young Jung ,  Gil-heyun Choi ,  Dae-lok Bae ,  Pil-kyu Kang

IPC分类号： H01L23/522

CPC分类号： H01L23/5226 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a via structure having a top surface with a planar portion and a protrusion portion that is surrounded by the planar portion, and includes a conductive structure including a plurality of conductive lines contacting at least a part of the top surface of the via structure.

摘要翻译： 半导体器件包括具有平面部分的顶表面和由平面部分包围的突出部分的通孔结构，并且包括导电结构，该导电结构包括与通孔的顶表面的至少一部分接触的多条导线 结构体。

公开(公告)号：US20130187287A1

公开(公告)日：2013-07-25

申请号：US13627790

申请日：2012-09-26

申请人： Byung-lyul Park ,  Gil-Heyun Choi ,  Suk-Chul Bang ,  Kwang-Jin Moon ,  Dong-Chan Lim ,  Deok-Young Jung

发明人： Byung-lyul Park ,  Gil-Heyun Choi ,  Suk-Chul Bang ,  Kwang-Jin Moon ,  Dong-Chan Lim ,  Deok-Young Jung

IPC分类号： H01L23/498

CPC分类号： H01L21/76898 ,  H01L21/76801 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565

摘要： A semiconductor device includes a circuit pattern over a first surface of a substrate, an insulating interlayer covering the circuit pattern, a TSV structure filling a via hole through the insulating interlayer and the substrate, an insulation layer structure on an inner wall of the via hole and on a top surface of the insulating interlayer, a buffer layer on the TSV structure and the insulation layer structure, a conductive structure through the insulation layer structure and a portion of the insulating interlayer to be electrically connected to the circuit pattern, a contact pad onto a bottom of the TSV structure, and a protective layer structure on a second surface the substrate to surround the contact pad.

摘要翻译： 半导体器件包括在衬底的第一表面上的电路图案，覆盖电路图案的绝缘夹层，填充通过绝缘夹层和衬底的通孔的TSV结构，在通孔的内壁上的绝缘层结构 并且在绝缘中间层的上表面上，具有TSV结构和绝缘层结构的缓冲层，通过绝缘层结构的导电结构和电连接到电路图案的绝缘夹层的一部分，接触垫 到TSV结构的底部，以及在第二表面上的保护层结构，以包围接触垫。

公开(公告)号：US20130130204A1

公开(公告)日：2013-05-23

申请号：US13638232

申请日：2011-01-31

申请人： Seung-Chan Lim

发明人： Seung-Chan Lim

IPC分类号： F41G3/26

CPC分类号： F41G3/2622 ,  F41A33/02 ,  F41G3/265 ,  F41G3/2655 ,  F41G3/2666 ,  F41J5/02

摘要： Provided is a firing weapon simulation system simulating leading firing. The firing weapon simulation system is configured to include laser firing apparatus mounted on a firing weapon and a target sensing apparatus attached to a target. The laser firing apparatus includes a first control unit, a firing switch which is driven cooperatively with firing of the firing weapon, an image processing unit which measuring a leading angle from an image including the moving target, a first GPS receiver, a laser beam firer, and a motor assembly which rotates the laser beam firer. When the firing switch is switched on, the first control unit generates the firing data, allows the motor assembly to reversely rotate the laser beam firer by a measured value of the leading angle, and allows the laser beam firer to emit the laser beam carrying the firing data. The target sensing apparatus includes a second control unit, a sensing circuit unit which extracts firing data from the laser beam, a second GPS receiver, and a hitting situation indicator which indicates hitting result according to a driving signal transmitted from the second control unit. The second control unit solves simultaneous equations of the trajectory equation of the firing weapon and the equation of motion of the target to determine whether or not the target is hit and outputs a result of the determination to the hitting situation indicator.

摘要翻译： 提供模拟射击的射击武器模拟系统。 射击武器模拟系统被配置为包括安装在击发武器上的激光发射装置和附接到目标的目标感测装置。 激光发射装置包括第一控制单元，与点火武器的点火协同驱动的点火开关，从包括移动目标的图像测量前导角的图像处理单元，第一GPS接收器，激光束发射器 以及旋转激光束火焰器的马达组件。 当点火开关接通时，第一控制单元产生点火数据，允许电动机组件将激光束火焰器反向旋转一个测量值的前角，并允许激光束发射激光束 发射数据。 目标感测装置包括第二控制单元，从激光束提取发射数据的感测电路单元，第二GPS接收器，以及根据从第二控制单元发送的驱动信号指示击中结果的击中状况指示符。 第二控制单元解决射击武器的轨迹方程和目标的运动方程的联立方程，以确定目标是否被击中，并将确定的结果输出到击球状态指示符。

公开(公告)号：US20130119547A1

公开(公告)日：2013-05-16

申请号：US13603978

申请日：2012-09-05

申请人： Su-kyoung Kim ,  Gil-heyun Choi ,  Byung-Iyul Park ,  Kwang-jin Moon ,  Kun-sang Park ,  Dong-chan Lim ,  Do-sun Lee

发明人： Su-kyoung Kim ,  Gil-heyun Choi ,  Byung-Iyul Park ,  Kwang-jin Moon ,  Kun-sang Park ,  Dong-chan Lim ,  Do-sun Lee

IPC分类号： H01L23/532 ,  H01L23/498

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2924/13091 ,  H01L2924/00

摘要： An integrated circuit device includes a substrate through which a first through-hole extends, and an interlayer insulating film on the substrate, the interlayer insulating film having a second through-hole communicating with the first through-hole. A Through-Silicon Via (TSV) structure is provided in the first through-hole and the second through-hole. The TSV structure extends to pass through the substrate and the interlayer insulating film. The TSV structure comprises a first through-electrode portion having a top surface located in the first through-hole, and a second through-electrode portion having a bottom surface contacting with the top surface of the first through-electrode portion and extending from the bottom surface to at least the second through-hole. Related fabrication methods are also described.

摘要翻译： 集成电路器件包括：第一通孔延伸穿过的衬底和衬底上的层间绝缘膜，所述层间绝缘膜具有与第一通孔连通的第二通孔。 在第一通孔和第二通孔中设置有硅通孔（TSV）结构。 TSV结构延伸穿过衬底和层间绝缘膜。 TSV结构包括具有位于第一通孔中的顶表面的第一通电极部分和具有与第一贯穿电极部分的顶表面接触并从底部延伸的底表面的第二通电极部分 表面至少到第二通孔。 还描述了相关的制造方法。

公开(公告)号：US08390120B2

公开(公告)日：2013-03-05

申请号：US12913748

申请日：2010-10-27

申请人： Kwang-Jin Moon ,  Pil-Kyu Kang ,  Dae-Lok Bae ,  Gil-Heyun Choi ,  Byung-Lyul Park ,  Dong-Chan Lim ,  Deok-Young Jung

发明人： Kwang-Jin Moon ,  Pil-Kyu Kang ,  Dae-Lok Bae ,  Gil-Heyun Choi ,  Byung-Lyul Park ,  Dong-Chan Lim ,  Deok-Young Jung

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L23/528 ,  H01L2224/16146 ,  H01L2225/06541 ,  H01L2924/01327 ,  H01L2924/00

摘要： A semiconductor device includes a via structure and a conductive structure. The via structure has a surface with a planar portion and a protrusion portion. The conductive structure is formed over at least part of the planar portion and not over at least part of the protrusion portion of the via structure. For example, the conductive structure is formed only onto the planar portion and not onto any of the protrusion portion for forming high quality connection between the conductive structure and the via structure.

摘要翻译： 半导体器件包括通孔结构和导电结构。 通孔结构具有平坦部分和突出部分的表面。 导电结构形成在平面部分的至少一部分上，而不是在通孔结构的突出部分的至少一部分之上。 例如，导电结构仅形成在平面部分上，而不形成在任何突出部分上，用于在导电结构和通孔结构之间形成高质量的连接。

公开(公告)号：US20120282736A1

公开(公告)日：2012-11-08

申请号：US13459468

申请日：2012-04-30

申请人： Kwang-Jin MOON ,  Byung-Lyul PARK ,  Do-Sun LEE ,  Gil-Heyun CHOI ,  Suk-Chul BANG ,  Dong-Chan LIM ,  Deok-Young JUNG

发明人： Kwang-Jin MOON ,  Byung-Lyul PARK ,  Do-Sun LEE ,  Gil-Heyun CHOI ,  Suk-Chul BANG ,  Dong-Chan LIM ,  Deok-Young JUNG

IPC分类号： H01L21/50 ,  H01L21/768

CPC分类号： H01L21/2885 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/15311

摘要： In a method of manufacturing a semiconductor device, a front end of line (FEOL) process may be performed on a semiconductor substrate to form a semiconductor structure. A back end of line (BEOL) process may be performed on the semiconductor substrate to form a wiring structure electrically connected to the semiconductor structure, thereby formed a semiconductor chip. A hole may be formed through a part of the semiconductor chip. A preliminary plug may have a dimple in the hole. The preliminary plug may be expanded into the dimple by a thermal treatment process to form a plug. Thus, the plug may not have a protrusion protruding from the upper surface of the semiconductor chip, so that the plug may be formed by the single CMP process.

摘要翻译： 在制造半导体器件的方法中，可以在半导体衬底上执行前端（FEOL）工艺以形成半导体结构。 可以在半导体基板上进行后端（BEOL）处理，以形成与半导体结构电连接的布线结构，从而形成半导体芯片。 可以通过半导体芯片的一部分形成孔。 初步插头可能在孔中有一个凹坑。 预先塞子可以通过热处理过程扩展到凹坑中以形成塞子。 因此，插头可以不具有从半导体芯片的上表面突出的突起，从而可以通过单个CMP工艺形成插头。

公开(公告)号：US08203567B2

公开(公告)日：2012-06-19

申请号：US12497595

申请日：2009-07-03

申请人： Dong-kyun Jeong ,  Soo-chan Lim ,  Na-min Kim

发明人： Dong-kyun Jeong ,  Soo-chan Lim ,  Na-min Kim

IPC分类号： G06T1/00

CPC分类号： G06T11/203

摘要： A graphics processing method and apparatus described herein is capable of converting graphics processing of a window system into a vector-based application program interface (API) format usable in the GPU and performing the converted graphics processing in the GPU. For example, the vector-based API may be based on an OpenVG standard or an EGL standard.

摘要翻译： 本文描述的图形处理方法和装置能够将窗口系统的图形处理转换为可用于GPU中的基于向量的应用程序接口（API）格式，并且在GPU中执行转换的图形处理。 例如，基于向量的API可以基于OpenVG标准或EGL标准。

公开(公告)号：US07867841B2

公开(公告)日：2011-01-11

申请号：US11968242

申请日：2008-01-02

申请人： Dong-Chan Lim ,  Byeong-Yun Nam ,  Soo-Ik Jang ,  In-Soo Jung

发明人： Dong-Chan Lim ,  Byeong-Yun Nam ,  Soo-Ik Jang ,  In-Soo Jung

IPC分类号： H01L21/8238

CPC分类号： H01L21/76283 ,  H01L21/84 ,  H01L27/10873 ,  H01L27/1203

摘要： A method of forming a semiconductor device can include forming a trench in a semiconductor substrate to define an active region. The trench is filled with a first device isolation layer. A portion of the first device isolation layer is etched to recess a top surface of the first device isolation layer below an adjacent top surface of the active region of the semiconductor substrate and to partially expose a sidewall of the active region. The exposed sidewall of the active region is epitaxially grown to form an extension portion of the active region that extends partially across the top surface of the first device isolation layer in the trench. A second device isolation layer is formed on the recessed first device isolation layer in the trench. The second device isolation layer is etched to expose a top surface of the extension portion of the active region and leave a portion of the second device isolation layer between extension portions of active regions on opposite sides of the trench. An interlayer dielectric is formed on the semiconductor substrate and the second device isolation layer. A conductive contact is formed extending through the interlayer dielectric layer and directly contacting at least a portion of both the active region and the extension portion of the active region overlying the second device isolation layer.

摘要翻译： 形成半导体器件的方法可以包括在半导体衬底中形成沟槽以限定有源区。 沟槽填充有第一器件隔离层。 第一器件隔离层的一部分被蚀刻以将第一器件隔离层的顶表面凹陷在半导体衬底的有源区的相邻顶表面下方并且部分地暴露有源区的侧壁。 有源区的暴露的侧壁被外延生长以形成有源区的延伸部分，部分地延伸穿过沟槽中的第一器件隔离层的顶表面。 第二器件隔离层形成在沟槽中凹陷的第一器件隔离层上。 蚀刻第二器件隔离层以暴露有源区的延伸部分的顶表面，并且将第二器件隔离层的一部分留在沟槽的相对侧上的有源区的延伸部分之间。 在半导体衬底和第二器件隔离层上形成层间电介质。 形成延伸穿过层间介电层并且直接接触覆盖在第二器件隔离层上的有源区域和有源区域的延伸部分的至少一部分的导电接触。

公开(公告)号：US07813521B2

公开(公告)日：2010-10-12

申请号：US11254699

申请日：2005-10-21

申请人： Soo-chan Lim

发明人： Soo-chan Lim

IPC分类号： H04R1/00

CPC分类号： H04R9/063

摘要： A speaker apparatus includes a speaker frame, an acoustic vibrating plate movably supported on the speaker frame, and a magnetic driver formed in the speaker frame for vibrating the acoustic vibrating plate. The magnetic driver is connected such that it may vibrate different portions of the acoustic vibrating plate independently. The acoustic vibrating plate of the speaker apparatus may vibrate with the same phase, thereby increasing sound pressure and improving acoustic efficiency.

摘要翻译： 扬声器装置包括扬声器框架，可移动地支撑在扬声器框架上的声学振动板和形成在扬声器框架中的用于振动声学振动板的磁性驱动器。 磁驱动器被连接使得它可以独立地振动声振动板的不同部分。 扬声器装置的声振动板可以以相同的相位振动，从而增加声压并提高声效。

公开(公告)号：US20100250675A1

公开(公告)日：2010-09-30

申请号：US12676620

申请日：2008-10-17

申请人： Chang-Su Lee ,  Dong-Chan Lim ,  Su-Kyung Kim ,  Sung Kim ,  Sil-Keun Hwang

发明人： Chang-Su Lee ,  Dong-Chan Lim ,  Su-Kyung Kim ,  Sung Kim ,  Sil-Keun Hwang

IPC分类号： G06F15/16

CPC分类号： G06Q30/02 ,  G06Q10/10 ,  H04L51/32

摘要： Disclosed are a system and method for distributing a blog post based on personal networking, and a server to be applied thereto. The system includes a writer terminal unit, which makes a series of settings for forming a blog post containing contents posted by a writer through the writer's blog registered with an online community service, and then distributes the blog post to at least one or more acquaintances blogs registered to personal networking with the writer, sharer/distributor terminal units, which make setting for posting the blog post on the acquaintances blogs, or distributing the blog post to at least one or more other acquaintances blogs registered to personal networking with sharers/distributors, and a service management server, which differentially provides management authority for the blog post to each of the writer and the sharers/distributors, and integrally manages the blog post distributed to a plurality of blogs, based on a path along which the blog post is distributed. The system and method distributes a blog post containing a writer's specific purpose of posting, such as a help-wanted notice, step by step through blogs registered with an online community service, based on trust relationships, thereby providing a notice platform, which is so efficient that an advertiser who writes a blog post, such as a help-wanted notice, can quickly find a qualified person, based on his/her trust relationships.

摘要翻译： 公开了一种用于基于个人网络分发博客文章的系统和方法以及要应用于其的服务器。 该系统包括作者终端单元，其用于形成博客文章的一系列设置，其中包含由作者通过在线社区服务注册的作者的博客发布的内容，然后将博客文章分发到至少一个或多个熟人博客 注册到与作者，分销商/分销商终端单元的个人网络，这些终端单元在熟人博客上发布博客文章的设置，或者将博客文章分发到至少一个或多个其他熟人登记到与共享者/分发者的个人网络的博客， 以及服务管理服务器，其基于分发给博客文章的路径，分散到多个博客的博客文章，分别向每个作者和共享者/分发者提供博客文章的管理权限，并且整合管理博客帖子 。 系统和方法基于信任关系分发包含作者特定发布目的的博客文章，如帮助通知，逐步通过在线社区服务注册的博客，从而提供通知平台 撰写博客文章的广告客户（例如帮助通知）可以根据他/她的信任关系快速找到合格的人员。