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公开(公告)号：US20140206525A1
公开(公告)日：2014-07-24
申请号：US14240543
申请日：2012-08-24
申请人： Jamal Chaouki , Omid Ebrahimpour , Charles Dubois
发明人： Jamal Chaouki , Omid Ebrahimpour , Charles Dubois
CPC分类号： C04B38/067 , C04B35/565 , C04B35/6265 , C04B35/62655 , C04B35/62802 , C04B35/62807 , C04B35/62813 , C04B35/62886 , C04B35/62894 , C04B35/62897 , C04B35/6303 , C04B35/63408 , C04B35/63416 , C04B35/6342 , C04B35/63424 , C04B38/0006 , C04B38/0045 , C04B38/0054 , C04B38/06 , C04B2111/00793 , C04B2111/0081 , C04B2235/3206 , C04B2235/3217 , C04B2235/3225 , C04B2235/3229 , C04B2235/3463 , C04B2235/3481 , C04B2235/383 , C04B2235/5409 , C04B2235/5436 , C04B2235/604 , C04B2235/6562 , C04B2235/6565 , C04B2235/661 , C04B2235/96 , C04B38/0074 , C04B38/0675 , C04B38/068
摘要： There is provided a method for the fabrication of porous SiC ceramic. The method comprises oxidizing particles of SiC ceramic thereby forming amorphous silica on the surface of the particles. The oxidized SiC particles are then mixed with an additive. Alternatively, layer(s) of the additive is (are) deposited on their surface by sol-gel technique. The oxidized SiC particles mixed or coated with the additive are then mixed with at least one pore-former. Alternatively, the oxidized SiC particles mixed or coated with the additive are coated with layer(s) of a polymer or pore-former by in-situ polymerization. In embodiments where the oxidized SiC particles are mixed with an additive and a pore-former or polymer, a further additive may be used. In each of these embodiments, the resulting product is then compacted into a green body which is heated and sintered to yield the porous SiC ceramic material. There is also provided a porous SiC ceramic fabricated by the method according to the invention.
摘要翻译： 提供了制造多孔SiC陶瓷的方法。 该方法包括氧化SiC陶瓷颗粒，从而在颗粒表面形成无定形二氧化硅。 然后将氧化的SiC颗粒与添加剂混合。 或者，通过溶胶 - 凝胶技术在其表面上沉积添加剂层。 然后将与添加剂混合或涂覆的氧化的SiC颗粒与至少一种成孔剂混合。 或者，混合或涂覆有添加剂的氧化的SiC颗粒通过原位聚合涂覆有聚合物层或成孔剂层。 在将氧化的SiC颗粒与添加剂和成孔剂或聚合物混合的实施方案中，可以使用另外的添加剂。 在这些实施方案的每一个中，将所得产物压实成为生坯，其被加热和烧结以产生多孔SiC陶瓷材料。 还提供了通过根据本发明的方法制造的多孔SiC陶瓷。
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2.发明授权Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module 失效多芯片模块中半导体器件芯片的老化应力和同步测试方法和设备
公开(公告)号：US5686843A
公开(公告)日：1997-11-11
申请号：US497126
申请日：1995-06-30
申请人： Kenneth Edward Beilstein, Jr. , Claude Louis Bertin , Dennis Charles Dubois , Wayne John Howell , Gordon Arthur Kelley, Jr. , Christopher Paul Miller , David Jacob Perlman , Gustav Schrottke , Edmund Juris Sprogis , Jody John VanHorn
发明人： Kenneth Edward Beilstein, Jr. , Claude Louis Bertin , Dennis Charles Dubois , Wayne John Howell , Gordon Arthur Kelley, Jr. , Christopher Paul Miller , David Jacob Perlman , Gustav Schrottke , Edmund Juris Sprogis , Jody John VanHorn
CPC分类号： G01R31/2863 , G01R1/0483 , G01R31/2851 , G01R31/2886 , G01R31/2889 , H01L2924/0002
摘要： Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring. Various alignment and test fixtures are described for facilitating this burn-in and simultaneous testing of the semiconductor chips within the multichip module.
摘要翻译： 阐述了以堆叠配置层叠在一起的多个半导体器件芯片的老化应力和同时测试方法和装置，以限定多芯片模块。 通过将临时互连线连接到多芯片模块的访问表面来实现测试。 该临时互连布线使模块内的至少一些半导体器件芯片电互连。 在老化应力和测试之前，会发生单独的电气筛选步骤，以识别临时互连线路和多芯片模块之间的连接中的任何电气缺陷。 如果识别出电气缺陷，则提出了用于去除或隔离缺陷的各种技术。 此后，使用临时互连布线发生多芯片模块内的半导体芯片的老化强度和同时测试。 描述了各种对准和测试夹具，以便于该多芯片模块内的半导体芯片的老化和同时测试。
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公开(公告)号：US09919975B2
公开(公告)日：2018-03-20
申请号：US14240543
申请日：2012-08-24
申请人： Jamal Chaouki , Omid Ebrahimpour , Charles Dubois
发明人： Jamal Chaouki , Omid Ebrahimpour , Charles Dubois
IPC分类号： C04B35/565 , C04B38/06 , C04B35/626 , C04B35/628 , C04B35/63 , C04B35/634 , C04B38/00 , C04B111/00
CPC分类号： C04B38/067 , C04B35/565 , C04B35/6265 , C04B35/62655 , C04B35/62802 , C04B35/62807 , C04B35/62813 , C04B35/62886 , C04B35/62894 , C04B35/62897 , C04B35/6303 , C04B35/63408 , C04B35/63416 , C04B35/6342 , C04B35/63424 , C04B38/0006 , C04B38/0045 , C04B38/0054 , C04B38/06 , C04B2111/00793 , C04B2111/0081 , C04B2235/3206 , C04B2235/3217 , C04B2235/3225 , C04B2235/3229 , C04B2235/3463 , C04B2235/3481 , C04B2235/383 , C04B2235/5409 , C04B2235/5436 , C04B2235/604 , C04B2235/6562 , C04B2235/6565 , C04B2235/661 , C04B2235/96 , C04B38/0074 , C04B38/0675 , C04B38/068
摘要： There is provided a method for the fabrication of porous SiC ceramic. The method comprises oxidizing particles of SiC ceramic thereby forming amorphous silica on the surface of the particles. The oxidized SiC particles are then mixed with an additive. Alternatively, layer(s) of the additive is (are) deposited on their surface by sol-gel technique. The oxidized SiC particles mixed or coated with the additive are then mixed with at least one pore-former. Alternatively, the oxidized SiC particles mixed or coated with the additive are coated with layer(s) of a polymer or pore-former by in-situ polymerization. In embodiments where the oxidized SiC particles are mixed with an additive and a pore-former or polymer, a further additive may be used. In each of these embodiments, the resulting product is then compacted into a green body which is heated and sintered to yield the porous SiC ceramic material. There is also provided a porous SiC ceramic fabricated by the method according to the invention.
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公开(公告)号：US20070066755A1
公开(公告)日：2007-03-22
申请号：US11475702
申请日：2006-06-27
申请人： Che-Hsiung Hsu , Sunghan Kim , Charles Dubois , Christopher Junk , Andrew Feiring , Zhen-Yu Yang , Amy Han , Mark Teasley , Viacheslav Petrov
发明人： Che-Hsiung Hsu , Sunghan Kim , Charles Dubois , Christopher Junk , Andrew Feiring , Zhen-Yu Yang , Amy Han , Mark Teasley , Viacheslav Petrov
IPC分类号： C08G59/32
CPC分类号： C08L25/18 , C08L23/26 , C08L27/18 , C08L41/00 , C08L65/00 , C08L73/02 , C08L101/12 , C08L2205/02 , C09D165/00 , C09D179/02 , H01B1/127 , H01L51/0037 , H01L51/5088 , C08L2666/22 , C08L2666/04 , C08L27/00
摘要： The present disclosure relates to electrically conductive polymer compositions, comprising at least one electrically conductive copolymer; and at least one fluorinated acid polymer, their use in organic electronic devices, and methods for preparation.
摘要翻译： 本发明涉及导电聚合物组合物，其包含至少一种导电共聚物; 和至少一种氟化酸聚合物，它们在有机电子器件中的用途和制备方法。
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5.发明授权Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module 失效多芯片模块中半导体器件芯片的老化应力和同步测试方法和设备
公开(公告)号：US5923181A
公开(公告)日：1999-07-13
申请号：US840041
申请日：1997-04-24
申请人： Kenneth Edward Beilstein, Jr. , Claude Louis Bertin , Dennis Charles Dubois , Wayne John Howell , Gordon Arthur Kelley, Jr. , Christopher Paul Miller , David Jacob Perlman , Gustav Schrottke , Edmund Juris Sprogis , Jody John VanHorn
发明人： Kenneth Edward Beilstein, Jr. , Claude Louis Bertin , Dennis Charles Dubois , Wayne John Howell , Gordon Arthur Kelley, Jr. , Christopher Paul Miller , David Jacob Perlman , Gustav Schrottke , Edmund Juris Sprogis , Jody John VanHorn
CPC分类号： G01R31/2863 , G01R1/0483 , G01R31/2851 , G01R31/2886 , G01R31/2889 , H01L2924/0002
摘要： Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring. Various alignment and test fixtures are described for facilitating this burn-in and simultaneous testing of the semiconductor chips within the multichip module.
摘要翻译： 阐述了以堆叠配置层叠在一起的多个半导体器件芯片的老化应力和同时测试方法和装置，以限定多芯片模块。 通过将临时互连线连接到多芯片模块的访问表面来实现测试。 该临时互连布线使模块内的至少一些半导体器件芯片电互连。 在老化应力和测试之前，会发生单独的电气筛选步骤，以识别临时互连线路和多芯片模块之间的连接中的任何电气缺陷。 如果识别出电气缺陷，则提出了用于去除或隔离缺陷的各种技术。 此后，使用临时互连线路进行多芯片模块内的半导体芯片的老化强度和同时测试。 描述了各种对准和测试夹具，以便于该多芯片模块内的半导体芯片的老化和同时测试。
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公开(公告)号：US20070069185A1
公开(公告)日：2007-03-29
申请号：US11475715
申请日：2006-06-27
申请人： Che-Hsiung Hsu , Christopher Junk , Frank Uckert , Mark Teasley , Andrew Feiring , Charles Dubois , Zhen-Yu Yang , Viacheslav Petrov , Natalie Daoud , Amy Han
发明人： Che-Hsiung Hsu , Christopher Junk , Frank Uckert , Mark Teasley , Andrew Feiring , Charles Dubois , Zhen-Yu Yang , Viacheslav Petrov , Natalie Daoud , Amy Han
IPC分类号： H01B1/12
CPC分类号： H01B1/127 , C08L23/26 , C08L65/00 , C08L73/02 , C09D165/00 , C09D179/02 , H01B1/128 , C08L2666/04 , C08L27/00
摘要： There are provided electrically conducting polymer compositions comprising an electrically conductive polymer or copolymer and an organic solvent wettable fluorinated acid polymer. Electrically conductive polymer materials are derived from thiophene, pyrrole, aniline and polycyclic heteroaromatic precursor monomers. Non-conductive polymers derived from alkenyl, alkynyl, arylene, and heteroarylene precursor monomers. The organic-solvent wettable fluorinated acid polymer is fluorinated or highly fluorinated and may be colloid-forming. Acidic groups include carboxylic acid groups, sulfonic acid groups, sulfonimide groups, phosphoric acid groups, phosphonic acid groups, and combinations thereof. The compositions can be used in organic electronic devices.
摘要翻译： 提供了包含导电聚合物或共聚物和有机溶剂可湿性氟化酸聚合物的导电聚合物组合物。 导电聚合物材料衍生自噻吩，吡咯，苯胺和多环杂芳族前体单体。 衍生自烯基，炔基，亚芳基和亚杂芳基前体单体的非导电聚合物。 有机溶剂可湿性氟化酸聚合物是氟化的或高度氟化的，可以是胶体形成。 酸性基团包括羧酸基团，磺酸基团，磺酰亚胺基团，磷酸基团，膦酸基团及其组合。 组合物可用于有机电子器件。
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7.发明申请HIGH PEEL STRENGTH ARTICLE COMPRISING A THERMOPLASTIC-METAL INTERPENETRATED VOLUME 审中-公开包含热塑性金属间插体积的高剥离强度文章公开(公告)号：US20110318596A1
公开(公告)日：2011-12-29
申请号：US12824129
申请日：2010-06-25
IPC分类号： B32B7/04 , B05D3/10 , B32B15/088
CPC分类号： C23C18/22 , B05D3/107 , B05D5/067 , C23C18/1641 , C23C18/208 , C23C18/30 , Y10T428/12007 , Y10T428/249958
摘要： The present invention provides articles that exhibit exceptional peel strength and have a thermoplastic volume, a metal volume, and an interpenetrated volume that includes both thermoplastic and metal portions. The present invention also provides for methods of producing the articles of the invention.
摘要翻译： 本发明提供了表现出优异的剥离强度并具有热塑性体积，金属体积和包含热塑性和金属部分的互穿体积的制品。 本发明还提供了制备本发明制品的方法。
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8.发明授权公开(公告)号：US06562159B2
公开(公告)日：2003-05-13
申请号：US09888536
申请日：2001-06-26
IPC分类号： C06B4510
CPC分类号： C06B21/005 , C06B45/105
摘要： An insensitive melt cast explosive composition obtained by dissolving an energetic copolyurethane thermoplastic elastomer (“ETPE”) in melted trinitrotoluene (“TNT”) is disclosed. The resulting ETPE-TNT solution is easy to mix with other ingredients such as nitramines, plasticizers, aluminum and can be processed with the existing melt cast facilities. The energetic solution can be poured into shells and upon cooling to produce a recyclable plastic bonded explosive. Instead of melted TNT, the same process works equally well with melted Octol or melted Composition B to dissolve the ETPE.
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