摘要:
A method includes performing a first programming operation on a plurality of memory cells in a same programming cycle; and performing a verification operation on the plurality of memory cells to find failed memory cells in the plurality of memory cells, wherein the failed memory cells are not successfully programmed in the first programming operation; and performing a second programming operation on the failed memory cells. Passed memory cells successfully programmed in the first programming operation are not programmed in the second programming operation.
摘要:
A LED lamp comprises: a lamp base; an illuminating component, mounted on the lamp base, wherein the illuminating component comprises a circuit board and a plurality of LEDs arranged on the circuit board; a lamp shade, mounted on the lamp shade for enclosing the illuminating element, wherein the lamp shade has at least one open area; and at least one waterproof and ventilative element, disposed on the open area for covering the open area; thereby, vapors inside the lamp shade can vacate out of the LED lamp through the waterproof and ventilative element, while external vapors cannot infiltrate into the lamp shade through the waterproof and ventilative element.
摘要:
A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.
摘要:
A method for forming a tip is disclosed. A layer is formed overlying a substrate. A mask layer is formed overlying the layer. The mask is patterned to form a mask pattern comprising an inner portion and an outer portion, wherein the inner portion is surrounded by the outer portion. The layer uncovered by the mask pattern is treated to form a reaction mask, wherein at least one portion of the reaction mask connect to form a tip of the layer under the inner portion of the mask pattern.
摘要:
An improved memory device and the method for programming the same are disclosed. The memory device includes at least one memory block requiring a word line pre-charge time to be long enough to program one or more selected memory cells. A monitoring circuit is added for detecting one or more word lines to reach a predetermined threshold voltage to enable a predetermined high voltage to be supplied to one or more latches of the memory cells.
摘要:
A source line driver is provided. The source line driver for a flash memory includes a plurality of source driving units and a control circuit to drive a plurality of source lines. Each source line is coupled to memory cells in a row. Each source driving unit drives the corresponding source line and is coupled to the control circuit at a common node. The control circuit is coupled between the common node and a ground line. When any memory cell is assigned to execute a program operation, the control circuit isolates the common node and the ground. When the memory cells are not assigned to execute the program operation, the control circuit couples the common node to the ground line.
摘要:
A reference voltage generator circuit for nonvolatile memory devices is disclosed. The circuit has at least one sense amplifier bias reference voltage generator (SABRVG) for generating a reference voltage at a predetermined reference point that is coupled to a start-up bias reference voltage generator (SBRVG). It also includes a monitor reference voltage generator (MRVG) for generating a monitor reference voltage, and a comparison module for comparing the monitor reference voltage with the reference voltage to produce a start-up control signal, wherein the SBRVG enhances a changing speed of the reference voltage during a reading cycle of the nonvolatile memory and when the monitor reference and the reference voltages are matched, the start-up control signal stops the SBRVG from operating, thereby having the SABRVG maintain the reference voltage.
摘要:
A wordline decoder for a memory device drives a word line of a memory array and comprises a first circuit, a second circuit, and a buffer circuit. The first circuit receives voltage from a first voltage source. The second circuit receives voltage from a second voltage source. During an erase cycle, the buffer circuit receives a third voltage higher than the second voltage and lower than the first voltage. During read and program cycles, the buffer circuit receives a fourth voltage substantially equal to the first and second voltage.
摘要:
Within both a method for revising a patterned conductor layer and a system for revising the patterned conductor layer there is provided within each wiring layout record within a series of wiring layout records within a wiring layout database directed towards a series of microelectronic fabrications an unoccupied equivalent wiring location within which may be formed at least one optional wiring pattern. When there is designed within an unoccupied equivalent wiring location for a single wiring layout record within the series of wiring layout records at least one optional wiring pattern and an interconnect option to the at least one optional wiring pattern.
摘要:
Voltage-dropping components are bypassed during testing of the erasing of a flash memory device thereby effectively lowering the applied erase voltage to the marginal level desired (VME). These voltage-dropping components may be a plurality of diode-connected NMOS transistors. If a plurality of diode-connected NMOS transistors are used, the voltage applied to the flash macro is reduced by m*Vt, where m is the number of bypassed diode connected NMOS transistors and Vt is the threshold voltage of the NMOS transistors. In normal operation, the voltage dropping components are placed in series with the charge pump, thereby returning the voltage applied to the flash macro to the normal level (VNE).