公开(公告)号：US20110316035A1

公开(公告)日：2011-12-29

申请号：US12897936

申请日：2010-10-05

申请人： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

发明人： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

IPC分类号： H01L33/48 ,  H01L33/64

CPC分类号： H05K3/0061 ,  H01L23/4006 ,  H01L33/641 ,  H01L33/642 ,  H01L2023/4062 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/05 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.

摘要翻译： 本发明公开了一种散热基板，其特征在于，具备包括金属层的基底基板，在所述金属层的一个面上形成的绝缘层，以及在所述绝缘层上形成的电路层，形成在所述绝缘层的另一面的散热层 所述金属层，用于将所述基底基板和所述散热层彼此连接的连接器，形成在所述基底基板的厚度方向上并且所述连接器被插入的开口的开口以及形成在所述基底基板中的任一个或两者上的阳极氧化层 金属层的另一表面和侧表面，并且其中金属层和散热层通过阳极氧化层彼此绝缘，从而防止静电或电压冲击向金属层传递。 还提供了制造散热基板的方法。

公开(公告)号：US20120085574A1

公开(公告)日：2012-04-12

申请号：US13064364

申请日：2011-03-21

申请人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

发明人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

IPC分类号： H05K1/14 ,  H05K3/42

CPC分类号： H05K3/44 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4053 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0315 ,  Y10T29/49165

摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

摘要翻译： 提供一种散热基板及其制造方法。 散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层 以及形成在通孔的下部以连接到通孔的第二电路图案。 因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

公开(公告)号：US20120043875A1

公开(公告)日：2012-02-23

申请号：US12964285

申请日：2010-12-09

申请人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

发明人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

IPC分类号： H01J7/24 ,  H01R43/00

CPC分类号： H01L33/641 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01S5/02276 ,  H01S5/02476 ,  Y10T29/49117

摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

摘要翻译： 本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

公开(公告)号：US08368291B2

公开(公告)日：2013-02-05

申请号：US12964285

申请日：2010-12-09

申请人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

发明人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

IPC分类号： H01L33/64 ,  H01L33/48

CPC分类号： H01L33/641 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01S5/02276 ,  H01S5/02476 ,  Y10T29/49117

摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

摘要翻译： 本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

公开(公告)号：US20110031608A1

公开(公告)日：2011-02-10

申请号：US12562829

申请日：2009-09-18

申请人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/13 ,  H01L23/142 ,  H01L23/36 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided.

摘要翻译： 公开了一种功率器件封装，其具有高散热性能，并且包括阳极氧化金属基板，其包括金属板，金属板的一个表面上形成有空腔，阳极氧化层形成在金属板的表面和金属板的内壁上 空腔和形成在金属板上的电路层，安装在金属板的空腔中以连接到电路层的功率器件，以及填充在金属板的空腔中的树脂密封材料。 还提供了制造功率器件封装的方法。

公开(公告)号：US08754517B2

公开(公告)日：2014-06-17

申请号：US13532362

申请日：2012-06-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4985 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

摘要翻译： 本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，其具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。

公开(公告)号：US20130270687A1

公开(公告)日：2013-10-17

申请号：US13532362

申请日：2012-06-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4985 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

摘要翻译： 本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。

公开(公告)号：US20120319259A1

公开(公告)日：2012-12-20

申请号：US13235176

申请日：2011-09-16

申请人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

发明人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US08729683B2

公开(公告)日：2014-05-20

申请号：US13235176

申请日：2011-09-16

申请人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

发明人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC分类号： H01L23/495

CPC分类号： H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US08553417B2

公开(公告)日：2013-10-08

申请号：US13007545

申请日：2011-01-14

申请人： Ji Hyun Park ,  Seog Moon Choi ,  Young Ki Lee

发明人： Ji Hyun Park ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H05K7/20

CPC分类号： H05K1/053 ,  H05K2201/09745

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：具有散热器的基底，具有凹槽; 绝缘层，其通过在其上进行阳极氧化而形成在所述基底基板上; 以及形成在绝缘层上的电路层，由此制造具有由金属材料制成的散热器的散热基板，从而可以保护弱热的器件，从而解决了降低寿命的问题 跨度和可靠性降低。