摘要:
The gate of an IGBT is connected to a gate terminal. One end of a clamping element is connected to an anode terminal. A voltage higher than a clamping voltage is applied between the gate and the emitter, to thereby test the dielectric breakdown voltage of a gate insulating film of the IGBT. The IGBT is eliminated which has a gate insulating film at a dielectric breakdown voltage failing to fall within its proper distribution range. Thereafter, a gate terminal and an anode terminal are wire bonded in the normal IGBT.
摘要:
An n.sup.- layer (2E) having a low impurity concentration is epitaxially grown on a surface (S1) of an n.sup.+ silicon substrate (1) having a high impurity concentration to a depth (D), and phosphorus ions (P) are implanted from the surface (S1) to the inside of the n.sup.- layer (2E). A SiO.sub.2 film is formed on the surface S1 by thermal oxidation, and an opening hole is formed in the SiO.sub.2 film. Using the opening hole, p-type impurities are implanted and diffused by thermal oxidation in the ion-implanted n.sup.- layer (2E), forming a p-type diffusion layer (well) from the surface (S1) to a predetermined depth. In this way, an n layer is formed in place of the n.sup.- layer (2E). The concentration distribution of impurity in the n layer monotonically decreases from the side of the surface (S1) and reaches its minimum on the side of an interface (BS). Then, a predetermined electrode is formed, completing the device. Thus, variations in both on-state resistance and breakdown voltage are reduced in a semiconductor device having a pn junction.
摘要:
A semiconductor device includes a transistor, a first diode, and a second diode. A collector of the transistor and a cathode of the first diode are electrically connected. The collector of the transistor and a cathode of the second diode are electrically connected, and an emitter of the transistor and an anode of the second diode are electrically connected. The first diode and the second diode are formed in an identical substrate. Thereby, the semiconductor device can be produced in a smaller size and in less steps.
摘要:
The gate of an IGBT is connected to a gate terminal. One end of a clamping element is connected to an anode terminal. A voltage higher than a clamping voltage is applied between the gate and the emitter, to thereby test the dielectric breakdown voltage of a gate insulating film of the IGBT. The IGBT is eliminated which has a gate insulating film at a dielectric breakdown voltage failing to fall within its proper distribution range. Thereafter, a gate terminal and an anode terminal are wire bonded in the normal IGBT.
摘要:
A semiconductor device includes a transistor, a first diode, and a second diode. A collector of the transistor and a cathode of the first diode are electrically connected. The collector of the transistor and a cathode of the second diode are electrically connected, and an emitter of the transistor and an anode of the second diode are electrically connected. The first diode and the second diode are formed in an identical substrate. Thereby, the semiconductor device can be produced in a smaller size and in less steps.
摘要:
A CSTBT includes a carrier stored layer (113) formed between a P base region (104) and a semiconductor substrate (103) and the carrier stored layer has an impurity concentration higher than that of the semiconductor substrate (103). The P base region (104) in a periphery of a gate electrode (110) functions as a channel. When it is assumed that an impurity concentration of a first carrier stored layer region (113a) just under the channel is ND1 and an impurity concentration of a second carrier stored layer region (113b) other than just under the channel is ND2 in the carrier stored layer (113), the relationship of the impurity concentrations is defined by ND1
摘要:
A CSTBT includes a carrier stored layer (113) formed between a P base region (104) and a semiconductor substrate (103) and the carrier stored layer has an impurity concentration higher than that of the semiconductor substrate (103). The P base region (104) in a periphery of a gate electrode (110) functions as a channel. When it is assumed that an impurity concentration of a first carrier stored layer region (113a) just under the channel is ND1 and an impurity concentration of a second carrier stored layer region (113b) other than just under the channel is ND2 in the carrier stored layer (113), the relationship of the impurity concentrations is defined by ND1