公开(公告)号：US12149024B2

公开(公告)日：2024-11-19

申请号：US17853861

申请日：2022-06-29

Applicant: Chun-Cheng Lin ,  Shy-Luen Chern ,  Chih-Hsiang Tang ,  Hong-Wen Lee

Inventor： Chun-Cheng Lin ,  Shy-Luen Chern ,  Chih-Hsiang Tang ,  Hong-Wen Lee

IPC: H01R13/62 ,  H01R13/17 ,  H01R13/24 ,  H01R13/502 ,  H01R13/629

Abstract: An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.

公开(公告)号：US20210083394A1

公开(公告)日：2021-03-18

申请号：US16739114

申请日：2020-01-10

Applicant: Chun-Cheng Chan ,  Shih-Chia Liu ,  Li-Chun Lee ,  Chao-Lin Wu ,  Jui-Hung Lai ,  Yen-Hao Yu

Inventor： Chun-Cheng Chan ,  Shih-Chia Liu ,  Li-Chun Lee ,  Chao-Lin Wu ,  Jui-Hung Lai ,  Yen-Hao Yu

IPC: H01Q13/16 ,  H01Q5/10

Abstract: An antenna device is provided in the disclosure. The antenna device includes a metal component, a signal cable, and a grounding component. The metal component includes a slot. The slot includes an open end and a closed end, and the open end forms an opening at a side of the metal component. The signal cable includes a signal portion and a grounding portion. The signal cable is disposed such that a projection of the signal portion is partially overlapped with the opening. The grounding portion is electrically connected to the metal component through the grounding component.

公开(公告)号：US10568788B2

公开(公告)日：2020-02-25

申请号：US15820705

申请日：2017-11-22

Applicant: Cheng-Chun Cheng

Inventor： Cheng-Chun Cheng

IPC: A61G5/04

Abstract: A seat unit includes a first seat frame and a second seat frame. The first seat frame is connected with a drive carrier and includes at least one first mounting portion. The second seat frame includes wheel frames and a mounting frame fixedly connected with the wheel frames. Each wheel frame is mounted with an auxiliary wheel. A space is defined between the mounting frame and the wheel frames. The drive carrier is located in the space. The mounting frame includes at least one second mounting portion. One of the first mounting portion and the second mounting portion is a rod, and the other is a receiving portion. The rod is movably inserted through the receiving portion. When the second seat frame is displaced relative to the first seat frame, the auxiliary wheels of the wheel frames can move together relative to the drive wheels of the drive carrier.

公开(公告)号：US10522452B2

公开(公告)日：2019-12-31

申请号：US13276143

申请日：2011-10-18

Applicant: Kuei-Wei Huang ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng ,  Ching-Shi Liu

Inventor： Kuei-Wei Huang ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng ,  Ching-Shi Liu

IPC: H01L21/00 ,  H01L23/498

Abstract: Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.

公开(公告)号：US10385378B2

公开(公告)日：2019-08-20

申请号：US15655209

申请日：2017-07-20

Applicant: Chun-Cheng Kuo

Inventor： Chun-Cheng Kuo

IPC: C12Q1/02 ,  C12R1/89

Abstract: The present invention relates to a method for rapid detection of toxicity comprising the steps of: preparing a plant gel agar and a sample under study, mixing the agar gel with the sample under study to form a mixture, and measuring a coagulation time of the mixture to determine cytotoxicity of the sample under study.

公开(公告)号：US20180161221A1

公开(公告)日：2018-06-14

申请号：US15820705

申请日：2017-11-22

Applicant: CHENG-CHUN CHENG

Inventor： CHENG-CHUN CHENG

IPC: A61G5/04

Abstract: A seat unit includes a first seat frame and a second seat frame. The first seat frame is connected with a drive carrier and includes at least one first mounting portion. The second seat frame includes wheel frames and a mounting frame fixedly connected with the wheel frames. Each wheel frame is mounted with an auxiliary wheel. A space is defined between the mounting frame and the wheel frames. The drive carrier is located in the space. The mounting frame includes at least one second mounting portion. One of the first mounting portion and the second mounting portion is a rod, and the other is a receiving portion. The rod is movably inserted through the receiving portion. When the second seat frame is displaced relative to the first seat frame, the auxiliary wheels of the wheel frames can move together relative to the drive wheels of the drive carrier.

公开(公告)号：US09303848B2

公开(公告)日：2016-04-05

申请号：US14468799

申请日：2014-08-26

Applicant: GRT Tech Co., Ltd. ,  Hsuan-Chih Lin ,  Chun-Cheng Lee

Inventor： Hsuan-Chih Lin ,  Chun-Cheng Lee

IPC: F21S4/00 ,  F21V21/00 ,  F21V19/00 ,  F21K99/00 ,  F21V23/02 ,  F21V23/00 ,  F21W111/02

CPC classification number: F21V23/008 ,  F21K9/20 ,  F21V17/14 ,  F21V23/023 ,  F21W2111/02 ,  F21W2131/103

Abstract: A light emitting diode (LED) lamp structure (100) of the present invention includes a housing body (102), a LED lamp module (500), and an electronic module (700, 700′). The housing body (102) includes a lamp base (200), a module base (400), a connecting ring (300) connecting the lamp base (200), and at least one clasping member (104) connecting the module base (400). The LED lamp module (500) connects the connecting ring (300) and is disposed on the lamp base (200). The electronic module (700, 700′) connects the clasping member (104) and is disposed on the module base (400). Thereby, assembling, disassembling and replacing can be achieved without any tools. Meanwhile, the entrance of moisture is also prevented, so that a life span of an electronic device is prolonged.

Abstract translation: 本发明的发光二极管（LED）灯结构（100）包括壳体（102），LED灯模块（500）和电子模块（700,700'）。 壳体（102）包括灯座（200），模块基座（400），连接灯座（200）的连接环（300）和连接模块基座（400）的至少一个夹紧构件（104） ）。 LED灯模块（500）连接连接环（300）并设置在灯座（200）上。 电子模块（700,700'）连接夹紧构件（104）并且设置在模块基座（400）上。 因此，可以在没有任何工具的情况下实现组装，拆卸和更换。 同时，还防止了水分的入口，从而延长了电子设备的使用寿命。

公开(公告)号：US09246745B2

公开(公告)日：2016-01-26

申请号：US11610830

申请日：2006-12-14

Applicant: Wei-Pin Chen ,  Hung-Chi Huang ,  Ming-Chao Chung ,  Chun-Cheng Wang

Inventor： Wei-Pin Chen ,  Hung-Chi Huang ,  Ming-Chao Chung ,  Chun-Cheng Wang

IPC: G06F17/30 ,  H04L29/12

CPC classification number: H04L29/12839 ,  H04L29/12009 ,  H04L61/2084 ,  H04L61/6022

Abstract: A method for MAC address management is provided. A MAC address is provided, and capacities of a first column and a second column corresponding to a first index in a MAC table are checked. If the first column and the second column are filled, capacities of a third column and a fourth column corresponding to a second index in the MAC table are checked. If one of the third and fourth columns is empty, the MAC address is written thereto. The second index is successive to the first index. The MAC table further comprises a plurality of time stamp columns, recording idle time of each MAC address.

Abstract translation: 提供了MAC地址管理的方法。 提供MAC地址，并且检查与MAC表中的第一索引对应的第一列和第二列的容量。 如果第一列和第二列被填充，则检查与MAC表中的第二索引对应的第三列和第四列的容量。 如果第三列和第四列之一为空，则向其写入MAC地址。 第二个索引是连续的第一个索引。 MAC表还包括多个时间戳列，记录每个MAC地址的空闲时间。

公开(公告)号：US09044232B2

公开(公告)日：2015-06-02

申请号：US12652262

申请日：2010-01-05

Applicant: Tai Chun Cheng ,  Elbert T. Cheng ,  Jacqueline T. Cheng ,  Ivy Y. Cheng

Inventor： Tai Chun Cheng ,  Elbert T. Cheng ,  Jacqueline T. Cheng ,  Ivy Y. Cheng

IPC: A61B18/08 ,  A61B17/32 ,  A61B18/14 ,  A61B18/00 ,  A61B18/18

CPC classification number: A61B18/082 ,  A61B17/320068 ,  A61B18/1402 ,  A61B18/1477 ,  A61B2018/00083 ,  A61B2018/00101 ,  A61B2018/00136 ,  A61B2018/00595 ,  A61B2018/00601 ,  A61B2018/00702 ,  A61B2018/00791 ,  A61B2018/00821 ,  A61B2018/00875 ,  A61B2018/1425 ,  A61B2018/1869

Abstract: A medical heating device is based on an electrical heater formed out of a self-limiting conductive material, such as a conductive polymer or ceramic. An electrical resistance that gradually changes with temperature characterizes the material such that heat production from electrical current through the material varies with temperature. A thermally insulating jacket contains the self-limiting heater element, which can be coupled to an electrical power supply. A probe thermally coupled to the heater extends outward from the jacket. The self-limiting medical heating device can be used by touching the end of the probe to target tissue, such as skin, adipose tissue, nerves, glands, vascular tissue, or abnormal growths or tumors to effect the desired treatment, typically by thermally ablating, cutting, or shrinking the target tissue where touched by the probe or in the vicinity therein.

Abstract translation: 医疗加热装置基于由诸如导电聚合物或陶瓷的自限制导电材料形成的电加热器。 随着温度逐渐变化的电阻表征材料，使得通过材料的电流产生的热量随温度变化。 绝热套管包含可以耦合到电源的自限制加热器元件。 热耦合到加热器的探头从夹套向外延伸。 可以通过将探针末端接触目标组织（例如皮肤，脂肪组织，神经，腺体，血管组织或异常生长或肿瘤）来使用自限制性医疗加热装置来实现所需的治疗，通常通过热消融 ，切割或收缩由探针或其附近触摸的目标组织。

公开(公告)号：US09030022B2

公开(公告)日：2015-05-12

申请号：US13280157

申请日：2011-10-24

Applicant: Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L25/50 ,  H01L21/31105 ,  H01L21/565 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

Abstract translation: 一种器件包括在顶表面上具有导电特征的封装元件和模塑在第一封装元件的顶表面上的聚合物区域。 多个开口从聚合物区域的顶表面延伸到聚合物区域中，其中每个导电特征通过多个开口中的一个露出。 多个开口包括具有第一水平尺寸的第一开口和具有不同于第一水平尺寸的第二水平尺寸的第二开口。