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1.发明授权公开(公告)号：US08520391B2
公开(公告)日：2013-08-27
申请号：US13112253
申请日：2011-05-20
IPC分类号： H05K7/20
CPC分类号： H01L25/0657 , B82Y30/00 , H01L21/486 , H01L23/142 , H01L23/367 , H01L23/49827 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16245 , H01L2224/73204 , H01L2224/81193 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , Y10T29/49139 , Y10T29/49165 , H01L2924/014 , H01L2224/05552
摘要： An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.
摘要翻译： 公开了一种内层散热板和具有内层散热板的多芯片堆叠封装结构。 内层散热板包括形成有多个穿透导电通孔的金属板体，每个穿透导电通孔包括多个纳米线，以及具有填充有纳米线的纳米孔的氧化块。 多芯片堆叠封装结构包括分别设置在内层散热板上的第一芯片和电子部件，从而促进多芯片堆叠结构中的散热以及增加整体封装刚性。
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公开(公告)号：US20120299177A1
公开(公告)日：2012-11-29
申请号：US13242359
申请日：2011-09-23
申请人： Chun Chieh Chao , Chun Hung Lu
发明人： Chun Chieh Chao , Chun Hung Lu
CPC分类号： H01L21/486 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L24/06 , H01L2224/02372 , H01L2224/05569 , H01L2224/0557 , H01L2224/06181 , H01L2924/00014 , H01L2224/05552
摘要： A semiconductor component structure is provided, which includes a body formed with openings, an insulating layer formed on surfaces of the body and the openings, conductive bumps formed in the openings, and a re-distributed circuit formed by conductive traces electrically connecting the conductive bumps, wherein the conductive traces are formed on a portion of the insulating layer on the body. As the conductive traces and the conductive bumps are formed on and in the body prior to the formation of the re-distributed circuit. The process for fabricating the semiconductor component structure is simplified and the reliability of the semiconductor component structure is enhanced. A method for fabricating the semiconductor component is also provided.
摘要翻译： 提供一种半导体部件结构，其包括形成有开口的主体，形成在主体和开口的表面上的绝缘层，形成在开口中的导电凸起，以及由导电迹线形成的再分布电路，该导电迹线电连接导电凸块 其中导电迹线形成在主体上的绝缘层的一部分上。 由于导电迹线和导电凸起形成在重新分布电路形成之前和之中。 简化了半导体元件结构的制造工艺，提高了半导体元件结构的可靠性。 还提供了制造半导体部件的方法。
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3.发明申请公开(公告)号：US20120224328A1
公开(公告)日：2012-09-06
申请号：US13112253
申请日：2011-05-20
CPC分类号： H01L25/0657 , B82Y30/00 , H01L21/486 , H01L23/142 , H01L23/367 , H01L23/49827 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16245 , H01L2224/73204 , H01L2224/81193 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , Y10T29/49139 , Y10T29/49165 , H01L2924/014 , H01L2224/05552
摘要： An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.
摘要翻译： 公开了一种内层散热板和具有内层散热板的多芯片堆叠封装结构。 内层散热板包括形成有多个穿透导电通孔的金属板体，每个穿透导电通孔包括多个纳米线，以及具有填充有纳米线的纳米孔的氧化块。 多芯片堆叠封装结构包括分别设置在内层散热板上的第一芯片和电子部件，从而促进多芯片堆叠结构中的散热以及增加整体封装刚性。
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公开(公告)号：US20080231379A1
公开(公告)日：2008-09-25
申请号：US11892195
申请日：2007-08-21
IPC分类号： H03K3/03
CPC分类号： H03K3/0315 , H03K3/356121 , H03L7/24
摘要： An injection locked frequency divider includes a ring oscillator, a first injection unit and a second injection unit. The ring oscillator includes a first delay cell and a second delay cell each including differential input terminals and differential output terminals. The differential input terminals and the differential output terminals of the first delay cell are respectively coupled to the differential output terminals and the differential input terminals of the second delay cell. The first injection unit connected between the differential output terminals of the first delay cell receives and injects a first injection signal to the differential output terminals of the first delay cell. The second injection unit connected between the differential output terminals of the second delay cell receives and injects a second injection signal to the differential output terminals of the second delay cell.
摘要翻译： 注入锁定分频器包括环形振荡器，第一注入单元和第二注入单元。 环形振荡器包括第一延迟单元和第二延迟单元，每个单元包括差分输入端子和差分输出端子。 第一延迟单元的差分输入端子和差分输出端子分别耦合到第二延迟单元的差分输出端子和差分输入端子。 连接在第一延迟单元的差分输出端之间的第一注入单元接收第一注入信号并将其注入到第一延迟单元的差分输出端。 连接在第二延迟单元的差动输出端子之间的第二注入单元接收并向第二延迟单元的差分输出端子注入第二注入信号。
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公开(公告)号：US20120168936A1
公开(公告)日：2012-07-05
申请号：US13243646
申请日：2011-09-23
申请人： Pin-Cheng Huang , Chun-Chieh Chao , Chi-Hsin Chiu
发明人： Pin-Cheng Huang , Chun-Chieh Chao , Chi-Hsin Chiu
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L2224/0401 , H01L2224/06181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/16245 , H01L2224/17181 , H01L2224/48227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/15311
摘要： A multi-chip stack package structure includes: an inner-layer heat sink having a first surface and a second surface opposing one another and having a plurality of conductive vias penetrating the first surface and the second surface; a first chip disposed on the first surface of the inner-layer heat sink; and a second chip disposed on the second surface of the inner-layer heat sink. Thereby, a heat-dissipating path is provided within inner-layers of the multi-chip stack package structure, and the rigidity of the overall structure is enhanced.
摘要翻译： 多芯片堆叠封装结构包括：具有第一表面和第二表面的内层散热器，所述第一表面和第二表面彼此相对并具有穿过所述第一表面和所述第二表面的多个导电通孔; 设置在所述内层散热器的第一表面上的第一芯片; 以及设置在所述内层散热器的第二表面上的第二芯片。 由此，在多芯片堆叠封装结构的内层设置有散热路径，提高了整体结构的刚性。
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公开(公告)号：US07522008B2
公开(公告)日：2009-04-21
申请号：US11892195
申请日：2007-08-21
CPC分类号： H03K3/0315 , H03K3/356121 , H03L7/24
摘要： An injection locked frequency divider includes a ring oscillator, a first injection unit and a second injection unit. The ring oscillator includes a first delay cell and a second delay cell each including differential input terminals and differential output terminals. The differential input terminals and the differential output terminals of the first delay cell are respectively coupled to the differential output terminals and the differential input terminals of the second delay cell. The first injection unit connected between the differential output terminals of the first delay cell receives and injects a first injection signal to the differential output terminals of the first delay cell. The second injection unit connected between the differential output terminals of the second delay cell receives and injects a second injection signal to the differential output terminals of the second delay cell.
摘要翻译： 注入锁定分频器包括环形振荡器，第一注入单元和第二注入单元。 环形振荡器包括第一延迟单元和第二延迟单元，每个单元包括差分输入端子和差分输出端子。 第一延迟单元的差分输入端子和差分输出端子分别耦合到第二延迟单元的差分输出端子和差分输入端子。 连接在第一延迟单元的差分输出端之间的第一注入单元接收第一注入信号并将其注入到第一延迟单元的差分输出端。 连接在第二延迟单元的差动输出端子之间的第二注入单元接收并向第二延迟单元的差分输出端子注入第二注入信号。
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