摘要:
In a semiconductor device, a first active region has a first Σ-shape, and the second active region has a second Σ-shape. When a line that is perpendicular to the substrate and passes a side surface of a first gate electrode in the first region is defined as a first vertical line, when a line that is perpendicular to the substrate and passes a side surface of a second gate electrode in the second region is defined as a second vertical line, when a shortest distance between the first vertical line and the first trench is defined as a first horizontal distance, and when a shortest distance between the second vertical line and the second trench is defined as a second horizontal distance, a difference between the first horizontal distance and the second horizontal distance is equal to or less than 1 nm.
摘要:
Semiconductor devices including a stressor in a recess and methods of forming the semiconductor devices are provided. The methods may include forming a fast etching region comprising phosphorous in an active region and forming a first trench in the active region by recessing the fast etching region. The methods may also include forming a second trench in the active region by enlarging the first trench using a directional etch process and forming a stressor in the second trench. The second trench may include a notched portion of the active region.
摘要:
A method of controlling a power control circuit includes enabling a power cutoff signal when a delay locking operation of a Delay Locked Loop (DLL) circuit is completed, disabling the power cutoff signal for a predetermined time, and detecting a phase difference between a reference clock and a feedback clock to re-determine, on the basis of the detection result, whether or not to enable the power cutoff signal.
摘要:
In a method of manufacturing a transistor, a gate structure is formed on a substrate including silicon. An upper portion of the substrate adjacent to the gate structure is etched to form a first recess in the substrate. A preliminary first epitaxial layer including silicon-germanium is formed in the first recess. An upper portion of the preliminary first epitaxial layer is etched to form a second recess on the preliminary first epitaxial layer. In addition, a portion of the preliminary first epitaxial layer adjacent to the second recess is etched to thereby transform the preliminary first epitaxial layer into a first epitaxial layer. A second epitaxial layer including silicon-germanium is formed in the second recess located on the first epitaxial layer.
摘要:
A delay value control circuit of a phase difference quantization circuit, wherein the phase difference quantization circuit has first to Nth (N is an integer equal to or greater than 2) delay units with binary weights. The delay value control circuit includes a replica delay unit replicating an Ath (2≦A≦N) delay unit; and a delay control unit configured to compare a phase of a first output signal generated from delaying an input signal with an A−1th delay unit and a phase of a second output signal generated from delaying the input signal with the Ath delay unit and the replica delay unit and configured to control a delay value of the Ath delay unit using a comparison result.
摘要翻译:一种相位差量化电路的延迟值控制电路,其中相位差量化电路具有二进制权重的第一至第N(N是等于或大于2的整数)延迟单元。 延迟值控制电路包括复制Ath(2 @ A @ N)延迟单元的复制延迟单元; 以及延迟控制单元,被配置为比较从延迟输入信号产生的第一输出信号与第一延迟单元的相位和从延迟输入信号而产生的第二输出信号的相位与Ath延迟单元和副本 延迟单元,并且被配置为使用比较结果来控制Ath延迟单元的延迟值。
摘要:
A duty cycle correction circuit includes a duty correction block configured to generate a first pre-corrected signal and a second pre-corrected signal in response to a duty code and an input signal; a duty-corrected signal generation block configured to generate a duty-corrected signal in response to a first select signal, a second select signal, the first pre-corrected signal and the second pre-corrected signal; and a control block configured to generate the duty code, the first select signal and the second select signal in response to the duty-corrected signal and the input signal.
摘要:
A delay locked loop (DLL) of a semiconductor integrated circuit includes a first delay line configured to variably delay a source clock signal and output a locked clock signal, a phase comparator configured to compare the phase of the source clock signal with the phase of a feedback clock signal, a second delay line configured to variably delay the locked clock signal, a first delay controller configured to control the first delay time of the first delay line, a second delay controller configured to control the minimum delay time of the second delay line, and an operation mode controller configured to control the first and second delay controllers in response to an output signal of the phase comparator, and switch operation modes of the first and second delay controllers depending on locking state of the delay lines.
摘要:
A synchronization circuit includes a first loop circuit configured to set an initial delay time by using first initial delay information and generate a first delay signal by changing a delay time of a first input signal, a second loop circuit configured to set the initial delay time by using second initial delay information and generate a second delay signal by changing a delay time of a second input signal, a duty cycle correction unit configured to correct a duty cycle of the first delay signal by using the second delay signal, and an initial delay monitoring circuit configured to generate the first initial delay information and the second initial delay information in response to an internal delay signal of the first loop circuit and the first input signal.
摘要:
A method of fabricating a semiconductor integrated circuit device includes forming a gate pattern on a semiconductor substrate, the gate pattern having a gate insulation film and a gate electrode. A spacer is formed on sidewalls of the gate pattern. A silicide layer is formed by a silicide process on at least one portion of the semiconductor substrate exposed by the gate pattern and the spacer, the silicide layer being formed using a silicide process. A stress buffer layer is formed on a resultant structure having the silicide layer. A stress film is formed on the stress buffer layer.
摘要:
A duty cycle correction circuit includes a duty adjustment circuit configured to generate an output clock by adjusting a duty cycle of an input clock in response to a duty adjustment code, a duty detection circuit configured to measure a difference between a width of a high pulse and a width of a low pulse of the output clock at each update period, and generate a duty detection code corresponding to the measured value, an accumulation circuit configured to generate the duty adjustment code by accumulating a value of the duty detection code outputted at each update period, and a toggling number adjustment circuit configured to adjust a toggling number of the output clock, which adjustment determines the update period, according to a frequency of the output clock.