公开(公告)号：US5969417A

公开(公告)日：1999-10-19

申请号：US917365

申请日：1997-08-26

申请人： Koji Yamashita ,  Yasunori Tanaka ,  Eiji Hagimoto

发明人： Koji Yamashita ,  Yasunori Tanaka ,  Eiji Hagimoto

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L29/06 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H05K3/328 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L24/45 ,  H01L29/0657 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/181 ,  H05K2203/049 ,  H05K3/3436

摘要： A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a plurality of chip electrodes on its face surface and a contact sheet having an inside surface on the face surface and comprising on the outside surface a plurality of conductor patterns which comprises portions extending through the contact sheet to the chip electrodes, respectively, and defines the facedown and the wire bonding electrodes. Such chip package devices can be mounted on a printed circuit board in whichever of a facedown and a wire bonding manner when primary and secondary pads are formed on the board for mechanical and electrical connection to the facedown electrodes, respectively, and for electric connection by bonding wires to the wire bonding electrodes, respectively.

摘要翻译： 芯片封装器件在其外表面上包括与多个面向下的电极相邻的多个引线接合电极。 芯片封装器件包括在其表面上具有多个芯片电极的IC芯片和在其表面上具有内表面的接触片，并且在外表面上包括多个导体图案，该导体图案包括延伸穿过该接触片的部分， 分别形成芯片电极，并限定面朝下和引线接合电极。 这样的芯片封装器件可以分别安装在印刷电路板上，无论是面向下还是引线接合的方式，当主板和辅助焊盘分别形成在板上用于机械和电连接到面向下的电极时，并且通过粘合进行电连接 分别连接到引线接合电极。

公开(公告)号：US5909055A

公开(公告)日：1999-06-01

申请号：US84349

申请日：1998-05-27

申请人： Koji Yamashita ,  Yasunori Tanaka ,  Eiji Hagimoto

发明人： Koji Yamashita ,  Yasunori Tanaka ,  Eiji Hagimoto

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L29/06 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H05K3/328 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L24/45 ,  H01L29/0657 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/181 ,  H05K2203/049 ,  H05K3/3436

摘要： A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a plurality of chip electrodes on its face surface and a contact sheet having an inside surface on the face surface and comprising on the outside surface a plurality of conductor patterns which comprises portions extending through the contact sheet to the chip electrodes, respectively, and defines the facedown and the wire bonding electrodes. Such chip package devices can be mounted on a printed circuit board in whichever of a facedown and a wire bonding manner when primary and secondary pads are formed on the board for mechanical and electrical connection to the facedown electrodes, respectively, and for electric connection by bonding wires to the wire bonding electrodes, respectively.

公开(公告)号：US5905303A

公开(公告)日：1999-05-18

申请号：US873593

申请日：1997-06-12

申请人： Keiichiro Kata ,  Shuichi Matsuda ,  Eiji Hagimoto

发明人： Keiichiro Kata ,  Shuichi Matsuda ,  Eiji Hagimoto

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/3107 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/3025 ,  Y10T29/49121

摘要： An insulating film has conductive layers on a first surface and conductive protrusions on a second surface. The conductive layers are connected to the conductive protrusions via through holes provided in the insulating film. A semiconductor chip having pads is adhered by an adhesive layer to the insulating film. Then, the conductive layers are locally pressured, so that the conductive layers are electrically connected to respective ones of the pads.

摘要翻译： 绝缘膜在第一表面上具有导电层，在第二表面上具有导电突起。 导电层通过设置在绝缘膜中的通孔与导电突起连接。 具有焊盘的半导体芯片通过粘合剂层粘附到绝缘膜。 然后，导电层被局部加压，使得导电层电连接到相应的焊盘。

公开(公告)号：US5683942A

公开(公告)日：1997-11-04

申请号：US450728

申请日：1995-05-25

申请人： Keiichiro Kata ,  Shuichi Matsuda ,  Eiji Hagimoto

发明人： Keiichiro Kata ,  Shuichi Matsuda ,  Eiji Hagimoto

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/4985 ,  H01L23/3107 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/3025 ,  Y10T29/49121

摘要： An insulating film has conductive layers on a first surface and conductive protrusions on a second surface. The conductive layers are connected to the conductive protrusions via through holes provided in the insulating film. A semiconductor chip having pads is adhered by an adhesive layer to the insulating film. Then, the conductive layers are locally pressured, so that the conductive layers are electrically connected to respective ones of the pads.

摘要翻译： 绝缘膜在第一表面上具有导电层，在第二表面上具有导电突起。 导电层通过设置在绝缘膜中的通孔与导电突起连接。 具有焊盘的半导体芯片通过粘合剂层粘附到绝缘膜。 然后，导电层被局部加压，使得导电层电连接到相应的焊盘。