公开(公告)号：US20060105122A1

公开(公告)日：2006-05-18

申请号：US10986712

申请日：2004-11-12

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene Chow ,  Gordon Jagerson

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene Chow ,  Gordon Jagerson

IPC分类号： B31B45/00

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

公开(公告)号：US20060076693A1

公开(公告)日：2006-04-13

申请号：US10959180

申请日：2004-10-07

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

IPC分类号： H01L23/52

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

公开(公告)号：US20060087335A1

公开(公告)日：2006-04-27

申请号：US10971467

申请日：2004-10-21

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： G01R31/02

CPC分类号： H01G5/18 ,  G01R1/06738

摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.

摘要翻译： 弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

公开(公告)号：US20060057031A1

公开(公告)日：2006-03-16

申请号：US11267762

申请日：2005-11-03

申请人： Thomas Hantschel ,  David Fork ,  Eugene Chow ,  Dirk De Bruyker ,  Michel Rosa

发明人： Thomas Hantschel ,  David Fork ,  Eugene Chow ,  Dirk De Bruyker ,  Michel Rosa

IPC分类号： B01L3/00 ,  G01N33/00

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

公开(公告)号：US20070125486A1

公开(公告)日：2007-06-07

申请号：US11292474

申请日：2005-12-02

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： B32B37/00

CPC分类号： B81B3/001 ,  B81B2207/07 ,  B81C1/00666 ,  B81C1/00952 ,  G01R1/06722 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H05K3/4092

摘要： A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.

摘要翻译： 提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。 微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。 可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。 可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。 微弹簧也可以在其远端物理连接以增加接触力。 微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。

公开(公告)号：US20070069751A1

公开(公告)日：2007-03-29

申请号：US11549066

申请日：2006-10-12

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： G01R31/02

CPC分类号： H01G5/18 ,  G01R1/06738

摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.

摘要翻译： 弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

公开(公告)号：US20050006829A1

公开(公告)日：2005-01-13

申请号：US10615653

申请日：2003-07-08

申请人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

发明人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

IPC分类号： F16F1/02 ,  H01L27/148 ,  F16F1/00 ,  F16F9/00 ,  H01L29/768

CPC分类号： F16F1/027

摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

公开(公告)号：US20110167526A1

公开(公告)日：2011-07-07

申请号：US13045042

申请日：2011-03-10

申请人： Eugene Chow ,  Pengfei Qi

发明人： Eugene Chow ,  Pengfei Qi

IPC分类号： G01Q70/08 ,  B82Y30/00

CPC分类号： B81C1/0015 ,  B81B2203/019 ,  B81B2207/07 ,  B82Y10/00

摘要： A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolithographically. A sacrificial layer underlying the microspring may then be removed, allowing the engineered stresses in the microspring to cause the structure to bend out of plane, elevating the nanowire off the substrate and out of plane. Use of the nanowire as a contact is thereby provided. The nanowire may be clamped at the tip of the microspring for added robustness. The nanowire may be coated during the formation process to provide additional functionality of the final device.

摘要翻译： 应力工程微球通常在基底的平面上形成。 纳米线（或等效地，纳米管）也在其顶端形成在基板的平面中。 一旦形成，可以例如光刻地限定纳米线的长度。 然后可以去除位于微弹簧下面的牺牲层，允许微弹簧中的工程应力使结构弯曲出平面，从而使纳米线离开基底并离开平面。 由此提供了使用纳米线作为接触。 可以将纳米线夹在微弹簧的末端以增加坚固性。 在形成过程中可以涂覆纳米线以提供最终装置的附加功能。

公开(公告)号：US20090322845A1

公开(公告)日：2009-12-31

申请号：US12145677

申请日：2008-06-25

申请人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

发明人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

IPC分类号： B41J2/41

CPC分类号： B41J2/41 ,  G03G15/32

摘要： An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.

摘要翻译： 一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点 。 导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影 该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

公开(公告)号：US20070148895A1

公开(公告)日：2007-06-28

申请号：US11319075

申请日：2005-12-28

申请人： Koenraad Van Schuylenbergh ,  Eugene Chow ,  JengPing Lu

发明人： Koenraad Van Schuylenbergh ,  Eugene Chow ,  JengPing Lu

IPC分类号： H01L21/00

CPC分类号： H01G5/18 ,  H01F17/0006 ,  H01F17/02 ,  H01F21/04 ,  H01F27/40 ,  H01F41/041 ,  H01L28/10 ,  H01L28/40

摘要： Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.

摘要翻译： 描述了在衬底上整体形成高Q可调谐电容器和高Q电感器的方法。 用于在基板上一体地形成电容器和微线圈的方法可以包括在基板上沉积和图案化电介质层，在衬底上沉积和图案化牺牲层，在半导体衬底上沉积和图案化导电材料，沉积和图案化聚合物 去除由所述图案化聚合物层暴露的所述导电材料的暴露部分，以从所述半导体衬底释放所述导电图案的一部分，以形成所述微线圈的面外绕组，将第二导电材料沉积在暴露的 部分导电材料，并去除牺牲层。 图案化导电材料可以包括微线圈的绕组部分，电容器的重叠电极部分和用于电容器电极的支撑部分。