公开(公告)号：US08499629B2

公开(公告)日：2013-08-06

申请号：US12249681

申请日：2008-10-10

Applicant: Gary Ballas ,  Galen Magendanz

Inventor： Gary Ballas ,  Galen Magendanz

IPC: G01P1/02

CPC classification number: G01P15/0802 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/0307 ,  G01P1/006

Abstract: A mounting system for a MEMS device includes a proof mass selectively coupled to a substrate using a centrally located, single anchor mount that minimizes sensitivity to strain variations experienced by the MEMS device. The mounting system may include isolation cuts arranged in the proof mass to advantageously achieve a desired amount of strain isolation and to produce hinges that extend in opposite directions from the anchor mount. The single anchor mount is arranged to reduce a separation distance from a mid-point or centroid of the anchor mount to its perimeter as compared to conventional mounting schemes that have multiple anchor mounts positioned distally from a common mid-point.

Abstract translation: 用于MEMS器件的安装系统包括使用中心定位的单个锚固安装座选择性地耦合到衬底的校准质量，其使对MEMS器件经历的应变变化的灵敏度最小化。 安装系统可以包括布置在检验质量块中的隔离切口，以有利地实现期望量的应变隔离并且产生沿着相对方向从锚固件延伸的铰链。 相比于具有从公共中点向远侧定位的多个锚固装置的常规安装方案，单个锚固装置被布置成减小与锚固装置的中点或中心到其周边的间隔距离。

公开(公告)号：US08240203B2

公开(公告)日：2012-08-14

申请号：US12333200

申请日：2008-12-11

Applicant: Galen Magendanz ,  Mark Eskridge ,  Matt Loesch

Inventor： Galen Magendanz ,  Mark Eskridge ,  Matt Loesch

IPC: G01P15/14

CPC classification number: G01P1/023 ,  B81B7/0048 ,  G01C19/56 ,  G01C25/00

Abstract: Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.

Abstract translation: 微机电系统（MEMS）器件和具有受控芯片接合区域的方法。 示例性器件包括具有玻璃层和保护封装的MEMS管芯。 玻璃层包括面向保护封装的一侧，具有从玻璃层的凹陷部突出的至少一个台面。 至少一个台面连接到保护包装。 示例性方法包括在MEMS管芯的玻璃层上形成至少一个台面并将至少一个台面附接到保护封装。

公开(公告)号：US06177628B1

公开(公告)日：2001-01-23

申请号：US09406727

申请日：1999-09-28

Applicant: Lewis M. Fraas ,  Galen Magendanz ,  James E. Avery

Inventor： Lewis M. Fraas ,  Galen Magendanz ,  James E. Avery

IPC: H01L31058

CPC classification number: H02S10/30 ,  Y10S428/913 ,  Y10T428/31678

Abstract: Thermophotovoltaic (TPV) electric power generators have emitters with infrared (IR) outputs matched with usable wavelengths for converter cells. The emitters have durable substrates, optional refractory isolating layers, conductive refractory metal or inter-metallic emitter layers, and refractory metal oxide antireflection layers. SiC substrates have tungsten or TaSi2 emitter layers and 0.14 micron ZrO2 or Al2O3 antireflection layers used as IR emitters for GaSb converter cells in TPV generators.

Abstract translation: 热电光伏（TPV）发电机具有红外（IR）输出的发射器，与转换器电池的可用波长相匹配。 发射器具有耐用的基板，可选的难熔绝缘层，导电难熔金属或金属间发射极层以及难熔金属氧化物防反射层。 SiC衬底具有用于TPV发生器中的GaSb转换器单元的钨或TaSi 2发射极层和用作IR发射器的0.14微米ZrO 2或Al 2 O 3抗反射层。

公开(公告)号：US20100181652A1

公开(公告)日：2010-07-22

申请号：US12355506

申请日：2009-01-16

Applicant: Chris Milne ,  Jeff A. Ridley ,  Galen Magendanz ,  Marcos Daniel Ruiz

Inventor： Chris Milne ,  Jeff A. Ridley ,  Galen Magendanz ,  Marcos Daniel Ruiz

IPC: H01L23/44 ,  H01L21/02

CPC classification number: B81B3/001 ,  B81C2203/031

Abstract: Systems and methods for reducing stiction between elements of a microelectromechanical systems (MEMS) device during anodic bonding. The MEMS device includes a substrate cover with an optional conductor on its interior surface and the cover is anchored to a first portion of a sensing element. The MEMS device further includes a second portion of the sensing element separated from the substrate cover with a space and an antistiction element disposed between the second portion and cover. The antistiction element can be formed of a material type with high electrostatic resistance, to prevent stiction between MEMS device elements during anodic bonding.

Abstract translation: 用于在阳极接合期间减小微机电系统（MEMS）器件的元件之间的静摩擦的系统和方法。 MEMS器件包括在其内表面上具有可选导体的衬底盖，并且盖被锚定到感测元件的第一部分。 MEMS器件还包括感测元件的与衬底盖分开的第二部分，其具有设置在第二部分和盖之间的空间和抗静电元件。 抗静电元件可以由具有高静电电阻的材料类型形成，以防止阳极接合期间MEMS器件元件之间的静摩擦。

公开(公告)号：US20100105167A1

公开(公告)日：2010-04-29

申请号：US12259953

申请日：2008-10-28

Applicant: Mark Eskridge ,  Galen Magendanz

Inventor： Mark Eskridge ,  Galen Magendanz

IPC: H01L21/98

CPC classification number: B81C3/004 ,  B81C2203/051 ,  H01L24/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  Y10S438/975 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

Abstract translation: 根据本发明的实施例的微电子机械系统装置通过将MEMS晶片切割并将各个MEMS管芯附着到基板上而形成。 MEMS管芯包括附接到玻璃层的MEMS部件，其附接到图案化的金属层，该金属层又附接到多个凸块。 具体来说，使用在金属层中选择性地形成或形成的窗口，玻璃层上的MEMS部件与一个或多个凸块对准。 一个或多个参考特征位于玻璃层上或玻璃层中，并且是可光学检测的。 可以从玻璃层的前表面看到参考特征，并且用于对准MEMS部件，并且可以通过窗户看到并且用于对准凸块。 作为最终结果，MEMS部件可以通过光学检测玻璃层中的参考特征而与凸块精确对准。

公开(公告)号：US20070193380A1

公开(公告)日：2007-08-23

申请号：US11360870

申请日：2006-02-23

Applicant: Jonathan Klein ,  Galen Magendanz ,  Peter LaFond ,  Mark Williams ,  Michael Foster

Inventor： Jonathan Klein ,  Galen Magendanz ,  Peter LaFond ,  Mark Williams ,  Michael Foster

IPC: B81B3/00 ,  G01D5/12 ,  G01D5/00 ,  G01P15/13

CPC classification number: B81B7/0077 ,  B81B2201/033 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  Y10T74/22

Abstract: A microelectromechanical system (MEMS) device with a mechanism layer having a first part and a second part, and at least one cover for sealing the mechanism layer. The inner surface of at least one of the covers is structured such that a protruding structure is present on the inner surface of the cover and wherein the protruding structure mechanically causes the first part to be deflected out of a plane associated with the second part.

Abstract translation: 一种具有机械层的微机电系统（MEMS）装置，其具有第一部分和第二部分，以及至少一个用于密封机构层的盖。 至少一个盖的内表面构造成使得突出结构存在于盖的内表面上，并且其中突出结构机械地使第一部分偏离与第二部分相关联的平面。

公开(公告)号：US20060207087A1

公开(公告)日：2006-09-21

申请号：US11084978

申请日：2005-03-21

Applicant: Ijaz Jafri ,  Jonathan Klein ,  Galen Magendanz

Inventor： Ijaz Jafri ,  Jonathan Klein ,  Galen Magendanz

IPC: H05K3/20 ,  H05K3/02

CPC classification number: B81C1/00142 ,  B81B2201/0271 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/051 ,  H03H3/0072 ,  H03H9/2447 ,  H03H9/462 ,  Y10T29/49005 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49826 ,  Y10T29/49861

Abstract: A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped.

公开(公告)号：US07833829B2

公开(公告)日：2010-11-16

申请号：US12259953

申请日：2008-10-28

Applicant: Mark Eskridge ,  Galen Magendanz

Inventor： Mark Eskridge ,  Galen Magendanz

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/78 ,  H01L21/46 ,  H01L23/02 ,  H01L23/06 ,  H01L23/544

CPC classification number: B81C3/004 ,  B81C2203/051 ,  H01L24/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  Y10S438/975 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

Abstract translation: 根据本发明的实施例的微电子机械系统装置通过将MEMS晶片切割并将各个MEMS管芯附着到基板上而形成。 MEMS管芯包括附接到玻璃层的MEMS部件，其附接到图案化的金属层，该金属层又附接到多个凸块。 具体来说，使用在金属层中选择性地形成或形成的窗口，玻璃层上的MEMS部件与一个或多个凸块对准。 一个或多个参考特征位于玻璃层上或玻璃层中，并且是可光学检测的。 可以从玻璃层的前表面看到参考特征，并且用于对准MEMS部件，并且可以通过窗户看到并且用于对准凸块。 作为最终结果，MEMS部件可以通过光学检测玻璃层中的参考特征而与凸块精确对准。

公开(公告)号：US20100089154A1

公开(公告)日：2010-04-15

申请号：US12249681

申请日：2008-10-10

Applicant: Gary Ballas ,  Galen Magendanz

Inventor： Gary Ballas ,  Galen Magendanz

IPC: G01P1/02 ,  G01P15/10

CPC classification number: G01P15/0802 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/0307 ,  G01P1/006

Abstract: A mounting system for a MEMS device includes a proof mass selectively coupled to a substrate using a centrally located, single anchor mount that minimizes sensitivity to strain variations experienced by the MEMS device. The mounting system may include isolation cuts arranged in the proof mass to advantageously achieve a desired amount of strain isolation and to produce hinges that extend in opposite directions from the anchor mount. The single anchor mount is arranged to reduce a separation distance from a mid-point or centroid of the anchor mount to its perimeter as compared to conventional mounting schemes that have multiple anchor mounts positioned distally from a common mid-point.

Abstract translation: 用于MEMS器件的安装系统包括使用中心定位的单个锚固安装座选择性地耦合到衬底的校准质量，其使对MEMS器件经历的应变变化的灵敏度最小化。 安装系统可以包括布置在检验质量块中的隔离切口，以有利地实现期望量的应变隔离并且产生沿着相对方向从锚固件延伸的铰链。 相比于具有从公共中点向远侧定位的多个锚固装置的常规安装方案，单个锚固装置被布置成减小与锚固装置的中点或中心到其周边的间隔距离。

公开(公告)号：US20100147075A1

公开(公告)日：2010-06-17

申请号：US12333200

申请日：2008-12-11

Applicant: Galen Magendanz ,  Mark Eskridge ,  Matt Loesch

Inventor： Galen Magendanz ,  Mark Eskridge ,  Matt Loesch

IPC: G01P15/14 ,  G01P15/00 ,  B32B37/12

CPC classification number: G01P1/023 ,  B81B7/0048 ,  G01C19/56 ,  G01C25/00

Abstract: Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.

Abstract translation: 微机电系统（MEMS）器件和具有受控芯片接合区域的方法。 示例性器件包括具有玻璃层和保护封装的MEMS管芯。 玻璃层包括面向保护封装的一侧，具有从玻璃层的凹陷部突出的至少一个台面。 至少一个台面连接到保护包装。 示例性方法包括在MEMS管芯的玻璃层上形成至少一个台面并将至少一个台面附接到保护封装。