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    CONTROL DEVICE ASSEMBLY
    2.
    发明申请
    CONTROL DEVICE ASSEMBLY 审中-公开
    控制装置总成

    公开(公告)号：US20130215582A1

    公开(公告)日：2013-08-22

    申请号：US13806620

    申请日：2011-06-01

    Applicant: Jörg Dittrich ,  Herbert Wallner ,  Hermann Josef Robin ,  Josef Loibl

    Inventor： Jörg Dittrich ,  Herbert Wallner ,  Hermann Josef Robin ,  Josef Loibl

    IPC: H05K5/06

    CPC classification number: H05K5/061 ,  H05K5/0026 ,  H05K5/0082

    Abstract: The invention relates to a control device assembly, in particular for a motor vehicle, comprising a printed circuit board that receives the control device electronics. At least one discretely formed frame element is supported on a populated face of the printed circuit board, enclosing at least one electronic component. A seal sits against an outer circumferential surface of the frame element, said seal surrounding the circumferential surface, and the seal is pressed against the printed circuit board by a housing element in order to form an electronic chamber that is sealed in a media-tight manner.

    Abstract translation: 本发明涉及一种特别是用于机动车辆的控制装置组件，包括接收控制装置电子装置的印刷电路板。 至少一个离散地形成的框架元件被支撑在印刷电路板的填充面上，包围至少一个电子部件。 密封件抵靠框架元件的外周表面，所述密封件围绕周向表面，并且密封件通过壳体元件压靠印刷电路板，以形成以介质密封的方式密封的电子室 。

    Module for Integrated Control Electronics Having Simplified Design
    4.
    发明申请
    Module for Integrated Control Electronics Having Simplified Design 有权
    集成控制电子元件简化设计模块

    公开(公告)号：US20100271791A1

    公开(公告)日：2010-10-28

    申请号：US12676935

    申请日：2008-08-04

    Applicant: Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

    Inventor： Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

    IPC: H05K7/00 ,  H05K13/00

    CPC classification number: H05K5/069 ,  B60R16/0239 ,  F16H61/0006 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/365 ,  H05K3/4691 ,  H05K5/0082 ,  H05K2201/0999 ,  H05K2201/10598 ,  H05K2203/1147 ,  Y10T29/49002

    Abstract: A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

    Abstract translation: 用于集成控制电子器件的壳体概念，包括壳体底部，安装有中央控制电子器件的电子部件的电路载体，以及作为中央控制电子设备和外围部件之间的电连接的信号和电流分配部件。 壳体底部构造为盆形，用于中央控制电子器件的电子部件的电路载体设置在其中，使得其可以在至少一个向上弯曲的边缘区域上电连接到信号和电流分布部件 设置在同一经过接触点上方，并且其中壳体底部也可以与信号和电流分布部件周向连接。

    Method for contacting a rigid printed circuit board to a contact partner and arrangement of a rigid printed circuit board and contact partner
    7.
    发明授权
    Method for contacting a rigid printed circuit board to a contact partner and arrangement of a rigid printed circuit board and contact partner 失效
    用于将刚性印刷电路板与接触对象接触的方法以及刚性印刷电路板和接触对象的布置

    公开(公告)号：US08502089B2

    公开(公告)日：2013-08-06

    申请号：US12809841

    申请日：2008-12-11

    Applicant: Josef Loibl ,  Hermann-Josef Robin ,  Karl Smirra

    Inventor： Josef Loibl ,  Hermann-Josef Robin ,  Karl Smirra

    IPC: H01L23/48 ,  B23K31/02 ,  B23K26/20 ,  H05K1/09

    CPC classification number: H01R43/0221 ,  H01L2924/0002 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/10416 ,  H05K2203/107 ,  H01L2924/00

    Abstract: A method for producing an electrical connection between a rigid printed circuit board and a metallic contact partner, includes preparing the rigid printed circuit board having at least one copper layer and at least one prepreg layer, bringing the metallic contact partner and the printed circuit board together in such a way that the metallic contact partner is brought into contact with a contact pad on the copper layer of the printed circuit board, forming a cutout in the printed circuit board by removing the prepreg layer in at least one partial region of the contact pad, and irradiating with laser light to form a weld connection between the contact partner and the contact pad. A configuration of a rigid printed circuit board, a metallic contact partner and an electrical connection point, as well as a module having such a configuration, are also provided.

    Abstract translation: 一种用于在刚性印刷电路板和金属接触配合体之间制造电连接的方法，包括制备具有至少一个铜层和至少一个预浸料层的刚性印刷电路板，使金属接触对象和印刷电路板在一起 使得金属接触对象与印刷电路板的铜层上的接触焊盘接触，通过在接触垫的至少一个部分区域中去除预浸料层，在印刷电路板中形成切口 并且用激光照射以在接触对象和接触垫之间形成焊接连接​​。 还提供了刚性印刷电路板，金属接触对象和电连接点的配置，以及具有这种结构的模块。

    Circuit Board Having a Plurality of Circuit Board Layers Arranged One Over the Other Having Bare Die Mounting for Use as a Gearbox Controller
    8.
    发明申请
    Circuit Board Having a Plurality of Circuit Board Layers Arranged One Over the Other Having Bare Die Mounting for Use as a Gearbox Controller 有权
    具有多个电路板层的电路板将裸机安装用作齿轮箱控制器

    公开(公告)号：US20120287581A1

    公开(公告)日：2012-11-15

    申请号：US13515907

    申请日：2010-10-15

    Applicant: Juergen Sauerbier ,  Wolfgang Gruebl ,  Berhard Schuch ,  Hubert Trageser ,  Hermann-Josef Robin

    Inventor： Juergen Sauerbier ,  Wolfgang Gruebl ,  Berhard Schuch ,  Hubert Trageser ,  Hermann-Josef Robin

    IPC: H05K7/20 ,  H05K1/00

    CPC classification number: H05K1/0206 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0373 ,  H05K2201/0209 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The invention relates to a circuit board (4) having a plurality of circuit board layers arranged one over the other. According to the invention, the circuit board layers are each made of a base material, the glass transition temperature of which is greater than or equal to 170° C., and the circuit board layers each have at least one thermally conductive layer (19 to 24) applied to the electrically insulating base material, wherein several vias (16, 17, 18) extending in a z-direction (z) perpendicularly to the circuit board layers are provided, which vias connect thermally conductive layers (19 to 24) of different circuit board layers in such a way that the vias (16, 17, 18) and the thermally conductive layers (19 to 24) of the circuit board layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.Furthermore, the invention relates to a control unit (1) for vehicle applications and to a use of the control unit (1).

    Abstract translation: 本发明涉及一种具有彼此排列的多个电路板层的电路板（4）。 根据本发明，电路板层各自由玻璃化转变温度大于或等于170℃的基材制成，并且电路板层各自具有至少一个导热层（19至 24）施加到电绝缘基材上，其中提供了在垂直于电路板层的z方向（z）上延伸的若干通孔（16,17,18），该通孔将导热层（19至24） 电路板层的通孔（16,17,18）和导热层（19至24）形成从顶部电路板层到最底层电路板层的导热桥的不同电路板层 。 此外，本发明涉及用于车辆应用的控制单元（1）以及控制单元（1）的使用。

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