公开(公告)号：US06212070B1

公开(公告)日：2001-04-03

申请号：US09071897

申请日：1998-05-05

申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

IPC分类号： H05K720

CPC分类号： H01L23/4006 ,  H01L2224/16225 ,  H01L2924/09701

摘要： A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matched the thermal expansion of the substrate. Thus, the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.

摘要翻译： 与诸如集成芯片，芯片载体或其它电子封装的衬底的热传递关系的散热器。 散热器连接到框架，该框架连接到印刷电路板或其上放置基板的其它合适的支撑件。 延伸穿过框架中的孔的散热器耦合到衬底的表面。 散热器与基板机械分离。 大型散热器可以热连接到使用诸如陶瓷球或列网格阵列，塑料球或列网格阵列或焊球或列的技术安装的表面安装基板。 散热器同轴地穿过孔径连接到基板。 组装之后，铅/锡或其他金属表面贴装互连件松弛，使得基板并被框架和散热器完全支撑，使零或接近零的向下的力。 因为散热器在组装期间在孔内自由移动，所以散热器封装对于各种不同的衬底是有用的。 优选地，框架是板和多个螺柱。 选择板材以匹配下面的支撑件的热膨胀，并且螺柱材料与基板的热膨胀相匹配。 因此，框架结构允许将组件的膨胀和收缩与下面的衬底和支撑件相匹配。

公开(公告)号：US5805430A

公开(公告)日：1998-09-08

申请号：US687103

申请日：1996-07-22

申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

IPC分类号： H01L23/40 ,  H02B1/01 ,  H02B7/20

CPC分类号： H01L23/4006 ,  H01L2224/16225 ,  H01L2924/09701

摘要： A heat sink is placed in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package, without imparting stressful forces to the substrate by connecting the heat sink to a frame which is connected to a support such as a printed circuit board or other suitable carrier on which the substrate is positioned. The heat sink extends through an aperture in the frame and is in heat transfer relationship with a surface of the substrate; however, it is mechanically decoupled from the substrate. The invention has particular application in thermally connecting large heat sinks to substrates that are surface mounted on the support using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. In order to provide intimate contact between the substrate and the heat sink, the heat sink must be depressed coaxially through the aperture of the frame against a surface of the substrate and then secured by, for example, gluing while in contact with the surface. However, this downward force imparted by the heat sink is quickly reduced via relaxation of the lead/tin or other metallic elements of the surface mount. A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matches the thermal expansion of the substrate. Thus the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.

公开(公告)号：US4604644A

公开(公告)日：1986-08-05

申请号：US695597

申请日：1985-01-28

申请人： Keith F. Beckham ,  Anne E. Kolman ,  Kathleen M. McGuire ,  Karl J. Puttlitz ,  Horatio Quinones

发明人： Keith F. Beckham ,  Anne E. Kolman ,  Kathleen M. McGuire ,  Karl J. Puttlitz ,  Horatio Quinones

IPC分类号： H01L21/60 ,  H01L21/56 ,  H05K3/28 ,  H05K3/34 ,  H01L23/50 ,  H01L21/58 ,  H05K7/06

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/29035 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/10977 ,  H05K3/284 ,  Y02P70/613 ,  Y10T29/49144

摘要： An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder wettable pads on a substrate, the improvement being a band of dielectric organic material disposed between and bonded to the device and substrate embedding at least an outer row of solder connections leaving the center inner solder connections and the adjacent top and bottom surfaces free of dielectric material.

摘要翻译： 一种用于在集成半导体器件和支撑衬底之间形成I / O连接的改进的焊料互连，其具有布置在将半导体器件的平坦表面上的一组I / O连接到一组对应的区域阵列中的多个焊接连接 焊料可湿性焊盘在衬底上，其改进在于设置在器件和衬底之间并结合到器件和衬底上的介电有机材料带，其嵌入至少外排的焊料连接，留下中心内部焊料连接，并且相邻的顶部和底部表面没有电介质 材料。

公开(公告)号：US5219520A

公开(公告)日：1993-06-15

申请号：US913567

申请日：1992-07-14

申请人： Peter J. Brofman ,  Shaji Farooq ,  Kathleen A. Lidestri ,  Gregg B. Monjeau ,  Karl J. Puttlitz

发明人： Peter J. Brofman ,  Shaji Farooq ,  Kathleen A. Lidestri ,  Gregg B. Monjeau ,  Karl J. Puttlitz

IPC分类号： B22F3/11 ,  B23K3/08

CPC分类号： B22F3/11 ,  B23K3/08 ,  B22F2998/00 ,  B22F2999/00

摘要： A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.

摘要翻译： 公开了一种用于从衬底选择性地去除焊料或钎焊的多孔金属块。 该块包括通过毛细管作用吸收焊料或钎焊的多个突起。 突起的数量和尺寸根据应用而变化。 还公开了制造这种涉及独特的两步烧结工艺的块的方法。

公开(公告)号：US06179196B2

公开(公告)日：2001-01-30

申请号：US09499863

申请日：2000-02-07

申请人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

发明人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC分类号： B23K100

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  B23K2101/40 ,  B23K2101/42 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H01L2224/16225 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265 ,  C08L2666/04 ,  C08L23/00

摘要： Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

摘要翻译： 用于使用接合材料将第一区域阵列部件连接到基板的装置。 该装置具有将第一区域阵列部件和第一区域阵列部件下方的基板部分朝着第二区域阵列部件的两个热导向的喷嘴，以熔化接合材料。 弹性密封件接触基板并防止热量影响与第一区域阵列部件相邻的其他部件。 喷嘴被压靠在基板上以抑制基板的翘曲，这可能是由第一区域阵列部件的加热引起的，并且防止损坏基板。 喷嘴可以倾斜使其符合基板的表面。 允许第一区域阵列部件在加热期间在熔融接合材料的表面张力下在基板的平面方向上自由移动以使第一区域阵列部件居中。

公开(公告)号：US5458281A

公开(公告)日：1995-10-17

申请号：US269854

申请日：1994-06-30

申请人： Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

发明人： Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

IPC分类号： B23K1/018

CPC分类号： B23K1/018 ,  B23K2201/36

摘要： The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

摘要翻译： 本发明一般涉及一种用于从固体材料中除去固体材料和液体材料的新装置和方法，所述固体材料和液体材料可以含有来自基底的固体材料。 更具体地说，本发明包括一种用于去除熔融焊料的装置和方法，该装置和方法可以使用独特的刮板从基板上包含固体颗粒和焊球或者列。 此外，公开了一种使用其上具有粘合剂的衬垫从衬底去除焊球或柱的方法。

公开(公告)号：US5251806A

公开(公告)日：1993-10-12

申请号：US870647

申请日：1992-04-16

申请人： Birendra N. Agarwala ,  Aziz M. Ahsan ,  Arthur Bross ,  Mark F. Chadurjian ,  Nicholas G. Koopman ,  Li-Chung Lee ,  Karl J. Puttlitz ,  Sudipta K. Ray ,  James G. Ryan ,  Joseph G. Schaefer ,  Kamalesh K. Srivastava ,  Paul A. Totta ,  Erick G. Walton ,  Adolf E. Wirsing

发明人： Birendra N. Agarwala ,  Aziz M. Ahsan ,  Arthur Bross ,  Mark F. Chadurjian ,  Nicholas G. Koopman ,  Li-Chung Lee ,  Karl J. Puttlitz ,  Sudipta K. Ray ,  James G. Ryan ,  Joseph G. Schaefer ,  Kamalesh K. Srivastava ,  Paul A. Totta ,  Erick G. Walton ,  Adolf E. Wirsing

IPC分类号： H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13669 ,  H01L2224/1367 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/13676 ,  H01L2224/13679 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L24/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15787 ,  H05K3/3431 ,  H05K3/3457

摘要： The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

摘要翻译： 本发明一般涉及新的互连及其制造方法，更具体地说，涉及一种细长的焊料互连及其制造方法。 在电子载体上，形成焊盘，在其上沉积焊料块并用金属层封盖，从而形成细长的焊料互连。 现在可以通过在已经被金属层覆盖的第一焊料块上形成第二焊料块来形成另外细长的焊料互连。 可以通过用金属覆盖层封盖前述焊料块和/或最后的焊料块来形成附加的细长焊料互连。 或者，封装层可以是形成在焊料块的侧壁上的侧壁间隔物的形式。

公开(公告)号：US5130779A

公开(公告)日：1992-07-14

申请号：US540256

申请日：1990-06-19

申请人： Birendra N. Agarwala ,  Aziz M. Ahsan ,  Arthur Bross ,  Mark F. Chadurjian ,  Nicholas G. Koopman ,  Li-Chung Lee ,  Karl J. Puttlitz ,  Sudipta K. Ray ,  James G. Ryan ,  Joseph G. Schaefer ,  Kamalesh K. Srivastava ,  Paul A. Totta ,  Erick G. Walton ,  Adolf E. Wirsing

发明人： Birendra N. Agarwala ,  Aziz M. Ahsan ,  Arthur Bross ,  Mark F. Chadurjian ,  Nicholas G. Koopman ,  Li-Chung Lee ,  Karl J. Puttlitz ,  Sudipta K. Ray ,  James G. Ryan ,  Joseph G. Schaefer ,  Kamalesh K. Srivastava ,  Paul A. Totta ,  Erick G. Walton ,  Adolf E. Wirsing

IPC分类号： H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13669 ,  H01L2224/1367 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/13676 ,  H01L2224/13679 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15787 ,  H05K3/3431 ,  H05K3/3457

摘要： The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

摘要翻译： 本发明一般涉及新的互连及其制造方法，更具体地说，涉及一种细长的焊料互连及其制造方法。 在电子载体上，形成焊盘，在其上沉积焊料块并用金属层封盖，从而形成细长的焊料互连。 现在可以通过在已经被金属层覆盖的第一焊料块上形成第二焊料块来形成另外细长的焊料互连。 可以通过用金属覆盖层封盖前述焊料块和/或最后的焊料块来形成附加的细长焊料互连。 或者，封装层可以是形成在焊料块的侧壁上的侧壁间隔物的形式。

公开(公告)号：US06703560B2

公开(公告)日：2004-03-09

申请号：US09838454

申请日：2001-04-19

申请人： Patrick Anthony Coico ,  James H. Covell ,  Benjamin V. Fasano ,  Lewis S. Goldman ,  Ronald L. Hering ,  Sundar M. Kamath ,  Kenneth Charles Marston ,  Frank Louis Pompeo ,  Karl J. Puttlitz ,  Jeffrey Allen Zitz

发明人： Patrick Anthony Coico ,  James H. Covell ,  Benjamin V. Fasano ,  Lewis S. Goldman ,  Ronald L. Hering ,  Sundar M. Kamath ,  Kenneth Charles Marston ,  Frank Louis Pompeo ,  Karl J. Puttlitz ,  Jeffrey Allen Zitz

IPC分类号： H01L2302

CPC分类号： H01L21/50 ,  H01L23/04 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/301 ,  H01L2224/0401

摘要： An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

摘要翻译： 集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到 用于在致动期间限制基板的弯曲量的盖。 所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

公开(公告)号：US5862588A

公开(公告)日：1999-01-26

申请号：US514703

申请日：1995-08-14

申请人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

发明人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC分类号： B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  H05K13/04

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

摘要： A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

摘要翻译： 一种制造互连结构和电路板的方法，包括将布置在背板上的基板上的相应金属触点上具有连接凸块的区域阵列部件放置在一起，提供与凸块和触点相连通的热固化连接材料，直接接触气体喷嘴 到围绕组件的基板的一部分，以将衬底压在喷嘴和背板之间，以限制衬底的包裹，加热组件，接合材料和接近金属触点的衬底，同时将喷嘴保持在衬底上以固化 接合材料，并冷却组件，接合材料和基底。 选择的部件也可以利用气体喷嘴进行更换，以限制基材的包装。