公开(公告)号：US08191243B2

公开(公告)日：2012-06-05

申请号：US12224094

申请日：2006-12-20

申请人： Ladislaus Bittmann ,  Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

发明人： Ladislaus Bittmann ,  Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

IPC分类号： H05K3/36

CPC分类号： H01L23/3164 ,  H01L21/481 ,  H01L21/486 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/82 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/2402 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/281 ,  H05K2201/09918 ,  H05K2203/063 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1062

摘要： In one embodiment of the present invention, a method is disclosed for contacting at least one electric contact surface on a surface of a substrate and/or a surface of a semiconductor chip arranged on a substrate. According to one embodiment of the invention, a film of electrically insulating plastic material is laminated onto the surfaces. A large-area contacting of the contact surfaces, which are freely accessible via the openings in the film, with a layer of electrically conductive material is then carried out. It is the aim of a planar electric contacting method to produce openings in an insulation during a short period of processing time. In particular, openings are to be positioned at a precise position to the contact surfaces. To achieve this, openings are produced in the film of electrically insulating plastic material in the region of the contact surface to be contacted by means of laser cutting and prior to laminating. This method is suitable for all planar contacting processes. Substrates or semiconductor chips which are contacted accordingly may be produced. The semiconductor chips used can be, in particular, power semiconductor chips.

摘要翻译： 在本发明的一个实施例中，公开了一种用于接触衬底的表面上和/或布置在衬底上的半导体芯片的表面上的至少一个电接触表面的方法。 根据本发明的一个实施例，将电绝缘塑料材料的膜层压在表面上。 然后，通过一层导电材料，可以通过薄膜中的开口自由接触的接触表面的大面积接触。 平面电接触方法的目的是在短时间内在绝缘体中产生开口。 特别地，开口应位于接触表面的精确位置。 为了实现这一点，在电绝缘塑料材料的膜中，在接触表面的区域中产生开口，以通过激光切割和层压之前接触。 该方法适用于所有平面接触过程。 可以制造相应接触的基板或半导体芯片。 所使用的半导体芯片尤其可以是功率半导体芯片。

公开(公告)号：US08227297B2

公开(公告)日：2012-07-24

申请号：US12736669

申请日：2009-04-28

申请人： Jörg Naundorf ,  Hans Wulkesch

发明人： Jörg Naundorf ,  Hans Wulkesch

IPC分类号： H01L21/44

CPC分类号： H01L23/055 ,  B23K1/0006 ,  B23K35/0233 ,  B23K35/3006 ,  B23K35/34 ,  B23K2101/40 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/83232 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01028

摘要： A method generates at least one electrical connection from at least one electronic component, which is positioned on a substrate inside an encapsulation, to outside the encapsulation. The functional capability of the electrical connection is to be provided at ambient temperatures greater than 140° C. and in the event of large power losses and extreme environmental influences. A reactive nanofilm, having targeted reaction, which can be triggered exothermically by laser, is used to produce hermetically sealed electrical connections. Using the nanofilm, an output of an electrical connection and a contact of the electrical connection to at least one further electrical contact can be provided.

摘要翻译： 一种方法从至少一个位于封装内的衬底上的电子部件产生至少一个电连接到封装外部。 在大于140°C的环境温度和大功率损耗和极端环境影响的情况下提供电气连接的功能性能。 使用可以通过激光放热触发的具有靶向反应的反应性纳米薄膜来产生气密密封的电连接。 使用纳米薄膜，可以提供电连接的输出和电连接与至少一个另外的电接触的接触。

公开(公告)号：US08591689B2

公开(公告)日：2013-11-26

申请号：US12224175

申请日：2006-12-20

申请人： Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

发明人： Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B38/04

CPC分类号： H01L23/3164 ,  B29C63/02 ,  B29C2793/00 ,  B29L2031/3061 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T156/1054 ,  Y10T156/1092 ,  Y10T156/1093 ,  H01L2924/00

摘要： A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices.

摘要翻译： 一种用于选择性地生产用于包装和用于绝缘未封装的电子部件和功能图案以及相应的装置的薄膜层压板的方法。 布置在衬底和/或布置在衬底上的半导体芯片的表面区域上的功能图案的方法涂层表面区域。 绝缘材料的特性要适应功能图案和/或电子部件的不同要求。 膜区域以这样的方式层压在表面区域上，使得膜区域的塑料材料的性质适合于膜的功能。 这种适应是个人和选择性的。 使用各种胶片。 该方法特别适用于涂覆或包装电子部件或主动和被动装置。

公开(公告)号：US20110049729A1

公开(公告)日：2011-03-03

申请号：US12736669

申请日：2009-04-28

申请人： Jörg Naundorf ,  Hans Wulkesch

发明人： Jörg Naundorf ,  Hans Wulkesch

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L23/055 ,  B23K1/0006 ,  B23K35/0233 ,  B23K35/3006 ,  B23K35/34 ,  B23K2101/40 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/83232 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01028

摘要： A method generates at least one electrical connection from at least one electronic component, which is positioned on a substrate inside an encapsulation, to outside the encapsulation. The functional capability of the electrical connection is to be provided at ambient temperatures greater than 140° C. and in the event of large power losses and extreme environmental influences. A reactive nanofilm, having targeted reaction, which can be triggered exothermically by laser, is used to produce hermetically sealed electrical connections. Using the nanofilm, an output of an electrical connection and a contact of the electrical connection to at least one further electrical contact can be provided.

摘要翻译： 一种方法从至少一个位于封装内的衬底上的电子部件产生至少一个电连接到封装外部。 在大于140°C的环境温度和大功率损耗和极端环境影响的情况下提供电气连接的功能性能。 使用可以通过激光放热触发的具有靶向反应的反应性纳米薄膜来产生气密密封的电连接。 使用纳米薄膜，可以提供电连接的输出和电连接与至少一个另外的电接触的接触。