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公开(公告)号：US20120223797A1
公开(公告)日：2012-09-06
申请号：US13407992
申请日：2012-02-29
Applicant: Jae Sun WON , Sang Kyoo HAN , Mi Ran BAEK , Hee Seung KIM , Jae Cheol JU , Don Sik KIM , Jong Hae KIM , Dong Jin LEE , Chung Wook RHO , Sung Soo HONG
Inventor： Jae Sun WON , Sang Kyoo HAN , Mi Ran BAEK , Hee Seung KIM , Jae Cheol JU , Don Sik KIM , Jong Hae KIM , Dong Jin LEE , Chung Wook RHO , Sung Soo HONG
IPC: H01F27/28
CPC classification number: H01F27/325 , H01F27/292 , H01F27/306
Abstract: Provided is a choke coil including: a first primary winding portion formed by winding a primary coil by n turns; a second primary winding portion formed by winding the primary coil by N turns; a first secondary winding portion formed by winding a secondary coil by N turns; and a second secondary winding portion formed by winding the secondary coil by n turns, wherein the n and N satisfy the condition: n≦N.
Abstract translation: 提供一种扼流圈，包括：通过将初级线圈卷绕n圈而形成的第一初级绕组部分; 通过将初级线圈卷绕N圈形成的第二初级绕组部分; 通过将次级线圈卷绕N圈形成的第一次级绕组部分; 以及通过将次级线圈卷绕n圈形成的第二次级绕组部分，其中n和N满足条件：n＆nlE; N。
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公开(公告)号：US07843702B2
公开(公告)日：2010-11-30
申请号：US12437042
申请日：2009-05-07
Applicant: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
Inventor： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC: H05K1/18
CPC classification number: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
Abstract translation: 这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。 具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘， 将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接 垂直于电源平面，从而减小RF模块的尺寸并提高其性能。
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公开(公告)号：US07714310B2
公开(公告)日：2010-05-11
申请号：US12127665
申请日：2008-05-27
Applicant: Young-Seok Kim , Hwan-Chul Lee , Jae-Cheol Ju
Inventor： Young-Seok Kim , Hwan-Chul Lee , Jae-Cheol Ju
CPC classification number: H01L27/14618 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/01077 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/00014
Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.
Abstract translation: 本发明涉及一种用于测试图像传感器封装的装置，单元和方法，其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括：座位单元，图像传感器封装件用于测试; 测试部分，具有在图像传感器封装之上的透镜和光源，以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元，其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤：将图像传感器封装连接到测试器模块，用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。
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公开(公告)号：US20090268419A1
公开(公告)日：2009-10-29
申请号：US12436996
申请日：2009-05-07
Applicant: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
Inventor： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC: H05K7/12
CPC classification number: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
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公开(公告)号：US20090268418A1
公开(公告)日：2009-10-29
申请号：US12437042
申请日：2009-05-07
Applicant: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
Inventor： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC: H05K1/18
CPC classification number: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
Abstract translation: 这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。 具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘， 将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接 垂直于电源平面，从而减小RF模块的尺寸并提高其性能。
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Patent Agency Ranking
公开(公告)号：US07663892B2
公开(公告)日：2010-02-16
申请号：US11449408
申请日：2006-06-07
Applicant: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
Inventor： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC: H05K1/18
CPC classification number: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
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公开(公告)号：US08068347B2
公开(公告)日：2011-11-29
申请号：US12436996
申请日：2009-05-07
Applicant: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
Inventor： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC: H05K1/16
CPC classification number: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
Abstract translation: 这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。 具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘， 将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接 垂直于电源平面，从而减小RF模块的尺寸并提高其性能。
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公开(公告)号：US07427768B2
公开(公告)日：2008-09-23
申请号：US11457771
申请日：2006-07-14
Applicant: Young-Seok Kim , Hwan-Chul Lee , Jae-Cheol Ju
Inventor： Young-Seok Kim , Hwan-Chul Lee , Jae-Cheol Ju
CPC classification number: H01L27/14618 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/01077 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/00014
Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.
Abstract translation: 本发明涉及一种用于测试图像传感器封装的装置，单元和方法，其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括：座位单元，图像传感器封装件用于测试; 测试部分，具有在图像传感器封装之上的透镜和光源，以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元，其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤：将图像传感器封装连接到测试器模块，用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。
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公开(公告)号：US08508144B2
公开(公告)日：2013-08-13
申请号：US13094335
申请日：2011-04-26
Applicant: Sang Kyoo Han , Sung Soo Hong , Mi Ran Baek , Chung Wook Roh , Hee Seung Kim , Jae Sun Won , Ku Yong Kim , Jae Cheol Ju , Don Sik Kim , Dong Jin Lee
Inventor： Sang Kyoo Han , Sung Soo Hong , Mi Ran Baek , Chung Wook Roh , Hee Seung Kim , Jae Sun Won , Ku Yong Kim , Jae Cheol Ju , Don Sik Kim , Dong Jin Lee
CPC classification number: H02M1/44 , H02M1/126 , H05B41/292
Abstract: The power supply includes: an electromagnetic interference filter including a first filter which has a pair of electromagnetically coupled cores having at least two leg parts, first and second bobbins each having a tube-shaped body part having a penetration hole into which each of the leg parts is inserted and having a winding region defined as the circumference of the outer peripheral surface of the body part, and first and second coils respectively wound around the first and second bobbins to remove common mode electromagnetic interference included in power transmitted from a power line, the electromagnetic interference filter removing differential mode electromagnetic interference due to leakage inductance formed due to the leakage of magnetic flux flowing through the cores; a power factor corrector correcting a power factor of the power where the electromagnetic interference is removed; and a power converter switching the power-factor-corrected power into a driving power having a predetermined voltage level.
Abstract translation: 电源包括：电磁干扰滤波器，包括具有至少两个腿部部分的一对电磁耦合芯的第一滤波器，第一和第二线轴各自具有管状主体部分，该管状主体部分具有贯穿孔，每个腿部 部件被插入并且具有被定义为主体部分的外周表面的圆周的绕组区域，以及分别缠绕在第一和第二线轴上的第一和第二线圈，以去除包括在从电力线传输的电力中的共模电磁干扰， 电磁干扰滤波器消除由于流过芯的磁通量的泄漏而形成的漏电感的差模电磁干扰; 功率因数校正器，校正去除电磁干扰的功率的功率因数; 并且功率转换器将功率因数校正功率切换到具有预定电压电平的驱动功率。
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公开(公告)号：US20120153857A1
公开(公告)日：2012-06-21
申请号：US13094335
申请日：2011-04-26
Applicant: Sang Kyoo HAN , Sung Soo HONG , Mi Ran BAEK , Chung Wook ROH , Hee Seung KIM , Jae Sun WON , Ku Yong KIM , Jae Cheol JU , Don Sik KIM , Dong Jin LEE
Inventor： Sang Kyoo HAN , Sung Soo HONG , Mi Ran BAEK , Chung Wook ROH , Hee Seung KIM , Jae Sun WON , Ku Yong KIM , Jae Cheol JU , Don Sik KIM , Dong Jin LEE
CPC classification number: H02M1/44 , H02M1/126 , H05B41/292
Abstract: The power supply includes: an electromagnetic interference filter including a first filter which has a pair of electromagnetically coupled cores having at least two leg parts, first and second bobbins each having a tube-shaped body part having a penetration hole into which each of the leg parts is inserted and having a winding region defined as the circumference of the outer peripheral surface of the body part, and first and second coils respectively wound around the first and second bobbins to remove common mode electromagnetic interference included in power transmitted from a power line, the electromagnetic interference filter removing differential mode electromagnetic interference due to leakage inductance formed due to the leakage of magnetic flux flowing through the cores; a power factor corrector correcting a power factor of the power where the electromagnetic interference is removed; and a power converter switching the power-factor-corrected power into a driving power having a predetermined voltage level.
Abstract translation: 电源包括：电磁干扰滤波器，包括具有至少两个腿部部分的一对电磁耦合芯的第一滤波器，第一和第二线轴各自具有管状主体部分，该管状主体部分具有贯穿孔，每个腿部 部件被插入并且具有被定义为主体部分的外周表面的圆周的绕组区域，以及分别缠绕在第一和第二线轴上的第一和第二线圈，以去除包括在从电力线传输的电力中的共模电磁干扰， 电磁干扰滤波器消除由于流过芯的磁通量的泄漏而形成的漏电感的差模电磁干扰; 功率因数校正器，校正去除电磁干扰的功率的功率因数; 并且功率转换器将功率因数校正功率切换到具有预定电压电平的驱动功率。
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