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    Wearable Electronic, Multi-Sensory, Human/Machine, Human/Human Interfaces
    1.
    发明申请
    Wearable Electronic, Multi-Sensory, Human/Machine, Human/Human Interfaces 审中-公开

    公开(公告)号：US20180081439A1

    公开(公告)日：2018-03-22

    申请号：US15562752

    申请日：2016-04-11

    申请人： John James Daniels

    发明人： John James Daniels

    IPC分类号： G06F3/01

    CPC分类号： G06F3/016 ,  G06F1/163 ,  G06F3/011 ,  G06F3/014 ,  G06F3/015

    摘要： A wearable Haptic Humaxi/Machine Interface (HHMI) receives electrical activity from muscles and nerves of a user. An electrical signal is determined having characteristics based on the received electrical activity. The electrical signal is generated and applied to an object to cause an action dependent on the received electrical activity. The object can be a biological component of the user, such as a muscle, another user, or a remotely located machine such as a drone. Exemplary uses include mitigating tremor, accelerated learning, cognitive therapy, remote robotic, drone and probe control and sensing, virtual and augmented reality, stroke, brain and spinal cord rehabilitation, gaming, education, pain relief, entertainment, remote surgery, remote participation in and/or observation of an event such as a sporting event, biofeedback and remotality. Remotality is the perception of a reality occurring remote from the user. The reality may be remote in time, location and/or physical form. The reality may be consistent with the natural world, comprised of an alternative, fictional world or a mixture of natural and fictional constituents.

    Multi-Configurable Outdoor Cooking Grill
    2.
    发明申请
    Multi-Configurable Outdoor Cooking Grill 审中-公开
    多配置户外烹饪烤架

    公开(公告)号：US20140311356A1

    公开(公告)日：2014-10-23

    申请号：US14130907

    申请日：2012-07-07

    申请人： John James Daniels

    发明人： John James Daniels

    IPC分类号： A47J37/07

    CPC分类号： A47J37/0786 ,  A47J37/0713

    摘要： A multi-configurable cooking grill is provided comprising a burner assembly, an interchangeable cooking surface, a top, an accessory engagement structure associated with the top, and an accessory for engaging with the accessory engagement surface to configure the grill to change the cooking functionality of the interchangeable cooking surface. The accessory engagement structure may comprise a first accessory engaging structure for engaging with a first accessory and a second accessory engaging structure for engaging with a second accessory. As examples of the multi-configurations available from the inventive outdoor cooking grill, the first accessory may be the cooking surface configured as one of a grill, a griddle and a baking stone, and the second accessory may be a heat spreader/sear plate having vents configured and dimensioned to assist in spreading and evening out the heat from the burner unit reaching the interchangeable cooking surface. The first accessory may include an accessory retention structure, and the heat spreader/sear plate includes an accessory retention mating structure. The accessory may be a heat spreader/sear plate having a searing surface and configured and dimensioned to act as a sear plate for receiving food directly on the searing surface, with the searing surface having heat concentrating elements for creating a predefined sear pattern on the food. The predefined sear pattern can be at least one of an image and a letter, and can be customizable by digitally cutting the heat spreader/sear plate using one of a plasma, torch, water-jet, laser, or other computer-numeric-controlled cutting tool.

    摘要翻译： 提供了一种多配置的烹饪格栅，其包括燃烧器组件，可互换烹饪表面，顶部，与顶部相关联的附件接合结构，以及用于与附件接合表面接合的附件，以配置烤架以改变烹饪功能 可互换的烹饪表面。 附件接合结构可以包括用于与第一附件接合的第一附件接合结构和用于与第二附件接合的第二附件接合结构。 作为可从本发明的室外烹饪格栅获得的多种配置的实例，第一附件可以是被配置为格栅，平板炉和烘焙石之一的烹饪表面，并且第二附件可以是散热器/ 通风口配置和尺寸设计，以帮助扩散和傍晚从燃烧器单元到达可互换烹饪表面的热量。 第一附件可以包括附件保持结构，并且散热器/焊接板包括附件保持配合结构。 附件可以是具有灼热表面的散热器/ sear板，并且其构造和尺寸被设计成用作直接在灼热表面上接收食物的sear板，其中灼热表面具有用于在食物上产生预定sear形图案的集热元件 。 预定义的触摸图案可以是图像和字母中的至少一个，并且可以通过使用等离子体，割炬，喷水，激光或其他计算机数字控制的其中一个数字切割散热器/冲击板来定制 切割用具。

    Hanger assembly
    3.
    发明授权
    Hanger assembly 有权
    衣架组合

    公开(公告)号：US08308116B2

    公开(公告)日：2012-11-13

    申请号：US12838043

    申请日：2010-07-16

    申请人： James Daniels

    发明人： James Daniels

    IPC分类号： A47F5/08

    CPC分类号： A47G25/0678 ,  Y10T29/49826

    摘要： A hanger assembly has a rail having a front portion, a back portion, and a rail opening therethrough. The rail opening has a shape having a larger diameter at the back portion and a smaller diameter at the front portion. A plug conforms to the shape of the opening, has a plug opening therein and a lip disposed upon an internal surface thereof. The lip engages a hook having an extension for insertion into the plug opening and engaging the lip within the plug.

    摘要翻译： 衣架组件具有导轨，该导轨具有前部，后部和穿过其中的轨道开口。 轨道开口具有在后部具有较大直径且在前部具有较小直径的形状。 插头符合开口的形状，其中具有插头开口，并且唇部设置在其内表面上。 唇缘接合具有用于插入插头开口中的延伸部并且与塞子内的唇缘接合的钩。

    PULL ASSEMBLY
    5.
    发明申请
    PULL ASSEMBLY 审中-公开
    牵引装配

    公开(公告)号：US20100139046A1

    公开(公告)日：2010-06-10

    申请号：US12329622

    申请日：2008-12-07

    申请人： James Daniels ,  Victor Hoemig ,  Geraint Krumpe

    发明人： James Daniels ,  Victor Hoemig ,  Geraint Krumpe

    IPC分类号： A47B95/02 ,  E05B1/00

    CPC分类号： E05B1/0015 ,  A47B95/02 ,  Y10T16/46 ,  Y10T16/4636

    摘要： An example pull assembly includes an insert having a first surface and an oppositely facing second surface. A base has a bore axially extending from a first end that is adapted to receive the insert member. A fastening structure extends from the second surface of the insert. The fastening structure is configured to be secure relative to a mounting surface to hold the base relative to the mounting surface.

    摘要翻译： 示例性拉动组件包括具有第一表面和相对面对的第二表面的插入件。 基座具有从适于接收插入构件的第一端部轴向延伸的孔。 紧固结构从插入件的第二表面延伸。 紧固结构构造成相对于安装表面是固定的，以相对于安装表面保持基座。

    MODULAR ELECTRICAL WALL COVER SYSTEM
    6.
    发明申请
    MODULAR ELECTRICAL WALL COVER SYSTEM 有权
    模块式电墙系统

    公开(公告)号：US20100051312A1

    公开(公告)日：2010-03-04

    申请号：US12204117

    申请日：2008-09-04

    申请人： James Daniels ,  William Spencer

    发明人： James Daniels ,  William Spencer

    IPC分类号： H02G3/14

    CPC分类号： H02G3/14

    摘要： A modular electrical cover plate assembly has an outer frame having two side walls, a top wall and a bottom wall. At least one cover plate is mounted within the frame. Locking structure is provided for locking the frame to the cover plate.

    摘要翻译： 模块化电气盖板组件具有外框架，其具有两个侧壁，顶壁和底壁。 至少一个盖板安装在框架内。 提供锁定结构用于将框架锁定到盖板。

    Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
    7.
    发明授权
    Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices 有权
    卷对卷制造的光片和封装的半导体电路器件

    公开(公告)号：US07476557B2

    公开(公告)日：2009-01-13

    申请号：US11335228

    申请日：2006-01-18

    申请人： John James Daniels ,  Gregory Victor Nelson

    发明人： John James Daniels ,  Gregory Victor Nelson

    IPC分类号： H01L21/00 ,  H01L21/30 ,  H01L21/46

    CPC分类号： H01L25/50 ,  F21K9/90 ,  H01L24/86 ,  H01L24/95 ,  H01L33/52 ,  H01L2224/95145 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

    摘要： A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top substrate is provided having a conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.

    摘要翻译： 制备轻活性片材的方法。 提供具有导电表面的底部基板。 提供热熔粘合片。 诸如LED模具的光活性半导体元件被嵌入热熔粘合片中。 LED芯片各自具有顶部电极和底部电极。 提供具有导电层的顶部衬底。 将具有嵌入式LED管芯的热熔粘合片插入在导电表面和导电层之间以形成层压。 层压通过加热的压力辊系统来熔化热熔粘合片并将顶部基底电绝缘并结合到底部基底。 当热熔片被软化时，LED管芯突破，使得顶部电极与顶部基板的导电层电接触，并且底部电极与底部基板的导电表面电接触。 因此，每个LED管芯的p侧和n侧自动连接到顶部导电层和底部导电表面。 每个LED芯片被封装并固定在柔性热熔粘合片层中的基板之间。 底部基材，热熔粘合剂（具有嵌入式LED模具）和顶部基材可以以卷材料形式提供。 辊以连续的辊制造工艺聚集在一起，产生柔性的照明材料片。

    Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
    8.
    发明授权
    Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices 有权
    卷对卷制造的光片和封装的半导体电路器件

    公开(公告)号：US07427782B2

    公开(公告)日：2008-09-23

    申请号：US11029137

    申请日：2005-01-04

    申请人： John James Daniels ,  Gregory Victor Nelson

    发明人： John James Daniels ,  Gregory Victor Nelson

    IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00 ,  H01L31/00

    CPC分类号： B32B17/10036 ,  B32B17/10174 ,  B32B17/10321 ,  F21K9/00 ,  F21V5/04 ,  H01L21/67132 ,  H01L25/0753 ,  H01L27/14625 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

    摘要： A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the transparent conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.

    摘要翻译： 制备轻活性片材的方法。 提供具有导电表面的底部基板。 提供热熔粘合片。 诸如LED模具的光活性半导体元件被嵌入热熔粘合片中。 LED芯片各自具有顶部电极和底部电极。 提供具有透明导电层的顶部透明基板。 将具有嵌入式LED管芯的热熔粘合片插入在导电表面和透明导电层之间以形成层压。 层压通过加热的压力辊系统来熔化热熔粘合片并将顶部基底电绝缘并结合到底部基底。 当热熔片被软化时，LED管芯突破，使得顶部电极与顶部基板的透明导电层电接触，并且底部电极与底部基板的导电表面电接触。 因此，每个LED管芯的p侧和n侧自动连接到顶部导电层和底部导电表面。 每个LED芯片被封装并固定在柔性热熔粘合片层中的基板之间。 底部基材，热熔粘合剂（具有嵌入式LED模具）和顶部基材可以以卷材料形式提供。 辊以连续的辊制造工艺聚集在一起，产生柔性的照明材料片。

    Organic light active devices with particulated light active material in a carrier matrix
    10.
    发明授权
    Organic light active devices with particulated light active material in a carrier matrix 失效
    带有微粒活性材料的载体矩阵的有机光有源器件

    公开(公告)号：US07256427B2

    公开(公告)日：2007-08-14

    申请号：US10375728

    申请日：2003-02-26

    申请人： John James Daniels

    发明人： John James Daniels

    IPC分类号： H01L33/00

    CPC分类号： H01L27/14627 ,  H01L27/148 ,  H01L27/3209 ,  H01L27/3269 ,  H01L51/0003 ,  H01L51/0004 ,  H01L51/5012 ,  H01L51/52

    摘要： A light active device includes a semiconductor particulate dispersed within a carrier material. A first contact layer is provided so that on application of an electric field charge carriers having a polarity are injected into the semiconductor particulate through the conductive carrier material. A second contact layer is provided so that on application of the electric field to the second contact layer charge carriers having an opposite polarity are injected into the semiconductor particulate through the conductive carrier material. The semiconductor particulate comprises at least one of an organic and an inorganic semiconductor. The semiconductor particulate may comprise an organic light active particulate that includes at least one conjugated polymer. When an electric field is applied between the first and second contact layers to the semiconductor particulate through the conductive carrier material, the second contact layer becomes positive relative to the first contact layer and charge carriers of opposite polarity are injected into the semiconductor particulate. The opposite polarity charge carriers combine to form in the conjugated polymer charge carrier pairs which decay radiatively so that radiation is emitted from the conjugated polymer. In this case, the inventive light active device acts as a light emitting diode.

    摘要翻译： 光活性器件包括分散在载体材料内的半导体颗粒。 提供第一接触层，使得在施加电场时，具有极性的电荷载流子通过导电载体材料注入到半导体颗粒中。 提供第二接触层，使得在向第二接触层施加电场时，具有相反极性的电荷载体通过导电载体材料注入到半导体颗粒中。 半导体颗粒包括有机和无机半导体中的至少一种。 半导体颗粒可以包括包含至少一种共轭聚合物的有机轻活性颗粒。 当在第一和第二接触层之间通过导电载体材料将电场施加到半导体颗粒时，第二接触层相对于第一接触层变为正，并且将相反极性的电荷载流子注入到半导体颗粒中。 相反极性的电荷载体结合形成共轭聚合物电荷载体对，其辐射衰减，使得辐射从共轭聚合物发射。 在这种情况下，本发明的有源器件用作发光二极管。