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    Fabrication of a metalized blind via
    3.
    发明授权
    Fabrication of a metalized blind via 失效
    金属化盲孔的制造

    公开(公告)号：US06576549B2

    公开(公告)日：2003-06-10

    申请号：US10282275

    申请日：2002-10-28

    申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    IPC分类号： H01L2131

    CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/1136

    摘要： A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, a rectangular channel, or a combination thereof.

    摘要翻译： 用于形成金属化盲孔的方法和结构。 在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。 如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。 电介质层包括具有碳基聚合物材料的电介质材料，例如永久性光致抗蚀剂，聚酰亚胺和高级阻焊剂（ASM）。 金属层包括金属材料，例如铜，铝和金。 碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。 激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。 凹陷可以具有任何横截面形状和深度的任何空间分布。 作为示例，凹陷可以包括盲孔，矩形通道或其组合。

    Fabrication of a metalized blind via
    4.
    发明授权
    Fabrication of a metalized blind via 有权
    金属化盲孔的制造

    公开(公告)号：US06522014B1

    公开(公告)日：2003-02-18

    申请号：US09670968

    申请日：2000-09-27

    申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    IPC分类号： H01L2348

    CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/1136

    摘要： A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, then the blind via may have any cross-sectional shape, such as circular or non-circular, a rectangular channel, or a combination thereof.

    摘要翻译： 用于形成金属化盲孔的方法和结构。 在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。 如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。 电介质层包括具有碳基聚合物材料的介电材料，例如永久性光致抗蚀剂，聚酰亚胺和先进的焊接掩模（ASM）。 金属层包括金属材料，例如铜，铝和金。 碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。 激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。 凹陷可以具有任何横截面形状和深度的任何空间分布。 作为示例，凹陷可以包括盲孔，则盲孔可以具有任何横截面形状，例如圆形或非圆形，矩形通道或其组合。

    Method and apparatus for connecting cable to the surface of printed circuit boards or the like
    5.
    发明授权
    Method and apparatus for connecting cable to the surface of printed circuit boards or the like 失效
    将电缆连接到印刷电路板等的表面的方法和装置

    公开(公告)号：US5281150A

    公开(公告)日：1994-01-25

    申请号：US767

    申请日：1993-01-05

    申请人： Edward G. Bundga ,  Michael D. Dinardo ,  Jeffrey A. Knight ,  Louis J. Konrad, III

    发明人： Edward G. Bundga ,  Michael D. Dinardo ,  Jeffrey A. Knight ,  Louis J. Konrad, III

    IPC分类号： H01R4/48 ,  H01R9/05 ,  H01R12/50 ,  H01R12/62 ,  H01R13/58 ,  H01R24/56 ,  H01R23/68

    CPC分类号： H01R12/62 ,  H01R23/6873 ,  H01R9/0515 ,  H01R13/58 ,  H01R2103/00 ,  H01R24/562 ,  H01R9/034

    摘要： A method and device are provided for connecting a triaxial or coaxial cable to a substrate by surface mount technology wherein the substrate has a plurality of contact pads located on the surface thereof. The connector includes a signal wire connector element connected to the signal wire of the cable and a drain wire connector element connected to each of the drain wires of the cable. The connection also includes resilient connector element, including a flexible circuit having a plurality of spaced electrical conducting lines thereon. One set of lines is for connection to the signal wires of the cable and the other set for connection to the drain wire(s) of the cable. The opposite ends of the signal line and drain line of the flexible circuit element are connected to electrical connection pads on the substrate to provide signal and drain connections between the cable and the substrate. A support element is configured and positioned to mount a plurality of the connectors on the substrate with the resilient element being resiliently urged into contact with the electrical connection pads on the substrate.

    摘要翻译： 提供了一种方法和装置，用于通过表面贴装技术将三轴或同轴电缆连接到基板，其中基板具有位于其表面上的多个接触垫。 连接器包括连接到电缆的信号线的信号线连接器元件和连接到电缆的每根排线的排线连接器元件。 连接还包括弹性连接器元件，包括其上具有多个间隔开的导电线的柔性电路。 一组线路用于连接到电缆的信号线，另一组线路用于连接到电缆的漏极线。 柔性电路元件的信号线和漏极线的相对端连接到衬底上的电连接焊盘，以在电缆和衬底之间提供信号和漏极连接。 支撑元件被构造和定位成将多个连接器安装在基板上，其中弹性元件被弹性地推压与基板上的电连接焊盘接触。