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19 条记录 (耗时 0.015 秒)

    Fabrication of a metalized blind via
    1.
    发明授权
    Fabrication of a metalized blind via 失效
    金属化盲孔的制造

    公开(公告)号：US06576549B2

    公开(公告)日：2003-06-10

    申请号：US10282275

    申请日：2002-10-28

    申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    IPC分类号： H01L2131

    CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/1136

    摘要： A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, a rectangular channel, or a combination thereof.

    摘要翻译： 用于形成金属化盲孔的方法和结构。 在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。 如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。 电介质层包括具有碳基聚合物材料的电介质材料，例如永久性光致抗蚀剂，聚酰亚胺和高级阻焊剂（ASM）。 金属层包括金属材料，例如铜，铝和金。 碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。 激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。 凹陷可以具有任何横截面形状和深度的任何空间分布。 作为示例，凹陷可以包括盲孔，矩形通道或其组合。

    Single flute drill for drilling holes in printed circuit boards and method of drilling holes in a printed circuit board
    7.
    发明授权
    Single flute drill for drilling holes in printed circuit boards and method of drilling holes in a printed circuit board 失效
    用于在印刷电路板中钻孔的单槽钻头和在印刷电路板中钻孔的方法

    公开(公告)号：US5584617A

    公开(公告)日：1996-12-17

    申请号：US417062

    申请日：1995-04-04

    申请人： David E. Houser

    发明人： David E. Houser

    IPC分类号： B23B51/02 ,  H05K3/00 ,  B23B41/14

    CPC分类号： B23B51/02 ,  B23B2251/043 ,  B23B2251/18 ,  B23B2251/201 ,  B23B2251/241 ,  B23B2251/426 ,  H05K3/0044 ,  Y10S408/704 ,  Y10S408/705 ,  Y10T408/03 ,  Y10T408/9097

    摘要： A drill bit for forming holes in a printed circuit board. The drill bit includes a first end including a tip for contacting the material of the circuit board. A second end of the drill bit is attached to apparatus for rotating the drill bit. A cutting edge is in the vicinity of the first end. A pressure pad is opposite the cutting edge. A flute winds upwardly about the drill bit in a helix. An angle of the helix with respect to a longitudinal axis of the drill bit varies continuously, wherein the angle is about from about 15.degree. to about 35.degree. in the vicinity of the first end and increases with increasing distance from the first end to at least from about 35.degree. to about 65.degree..

    摘要翻译： 用于在印刷电路板中形成孔的钻头。 钻头包括第一端，其包括用于接触电路板的材料的尖端。 钻头的第二端连接到用于旋转钻头的装置。 切削刃在第一端附近。 压力垫与切削刃相对。 一个长笛向上绕着钻头卷绕在螺旋中。 螺旋线相对于钻头的纵向轴线的角度连续变化，其中角度在第一端附近为大约15度至大约35度，并且随着从第一端到至少的距离的增加而增加 从约35°至约65°。

    Resonant stylus support
    8.
    发明授权
    Resonant stylus support 失效
    共振手写笔支持

    公开(公告)号：US4884334A

    公开(公告)日：1989-12-05

    申请号：US826203

    申请日：1986-02-05

    申请人： David E. Houser ,  Richard J. Morenus

    发明人： David E. Houser ,  Richard J. Morenus

    IPC分类号： H01L21/607 ,  B23K20/10 ,  H01L21/60 ,  H05K7/06

    CPC分类号： H01L24/85 ,  B23K20/10 ,  H01L24/78 ,  H05K7/06 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  Y10T29/53174

    摘要： Flexure means are provided for holding a tip member of an ultrasonically reciprocating element against lateral movement while freely permitting its longitudinal movement. The reciprocating element is held fixed at a nodal point distant from the tip member. The flexure means having a natural frequency substantially the same as the reciprocating element so as to resonate in concert therewith. In one embodiment, a flexible disc fixed around its periphery is centrally pierced to receive and engage the reciprocating element. In another embodiment, a plurality of elongated resonant supports are mounted at spaced radial positions on a fixture provided with a central opening through which the reciprocating element extends so that free ends of the resonant supports are directed at and engage the reciprocating element. In this embodiment, at least two of the resonant supports are adjustable toward and away from the longitudinal axis of the reciprocating element so as to properly position it. Also, at least one other of the resonant supports is biased into engagement with the reciprocating element thereby holidng the reciprocating element against the ends of the other resonant supports.

    摘要翻译： 弯曲装置被设置用于保持超声波往复运动元件的尖端部件抵抗侧向运动，同时自由地允许其纵向移动。 往复运动元件固定在远离尖端部件的节点处。 弯曲装置具有与往复运动元件基本相同的固有频率，以便与其一致地共鸣。 在一个实施例中，围绕其周边固定的柔性圆盘被中心刺穿以接收和接合往复运动元件。 在另一个实施例中，多个细长谐振支架安装在设置有中心开口的固定件上的间隔开的径向位置处，往复运动元件通过该中心开口延伸，使得谐振支架的自由端被引导并接合往复元件。 在该实施例中，至少两个谐振支架可朝向和远离往复元件的纵向轴线调节，以便适当地定位它。 此外，谐振支架中的至少另一个被偏置成与往复运动元件接合，从而将往复运动元件抵住另一谐振支架的端部。

    Impact pinner apparatus
    9.
    发明授权
    Impact pinner apparatus 失效
    冲击钳器

    公开(公告)号：US4415113A

    公开(公告)日：1983-11-15

    申请号：US223191

    申请日：1981-01-07

    申请人： David E. Houser ,  Harold Kohn ,  Gordon L. Williams

    发明人： David E. Houser ,  Harold Kohn ,  Gordon L. Williams

    IPC分类号： B23P21/00 ,  B23P19/02 ,  H01L23/50 ,  H05K13/04 ,  B27F7/00

    CPC分类号： H05K13/0478 ,  Y10S91/04

    摘要： Multiple pins are affixed in the holes of a ceramic substrate by simultaneously impacting the pins with a piston assembly which temporarily places the pins in a viscoelastic fluid state. Upon return of the pins and the resultant fluid flow to its undisturbed solid state, each pin is left with an extension that is in interlocking engaged relationship with the ceramic particles of the substrate in the region surrounding the particular holes in which the pins have been located.The piston assembly is driven by a pneumatic high pressure system which is adjustable to the number of pins being simultaneously impacted. Release of the piston assembly is delayed until the air pressure becomes stabilized prior to impact. A vacuum pressure system returns the piston to its originating position after impact whereupon the piston assembly is ready for the next impact cycle.

    摘要翻译： 通过同时用活塞组件冲击销来将多个销固定在陶瓷基板的孔中，该活塞组件暂时将销钉置于粘弹性流体状态。 在销的返回和所得到的流体流动到其未受干扰的固体状态时，每个销留下一个延伸部分，该延伸部分在包围销已经位于的特定孔的区域中与衬底的陶瓷颗粒成啮合关系 。 活塞组件由气动高压系统驱动，气动高压系统可以调节以同时受到冲击的销数量。 活塞组件的释放被延迟直到气压在冲击之前变得稳定。 真空压力系统在冲击后将活塞返回到其起始位置，随后活塞组件准备好进行下一个冲击循环。

    Fabrication of a metalized blind via
    10.
    发明授权
    Fabrication of a metalized blind via 有权
    金属化盲孔的制造

    公开(公告)号：US06522014B1

    公开(公告)日：2003-02-18

    申请号：US09670968

    申请日：2000-09-27

    申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    IPC分类号： H01L2348

    CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/1136

    摘要： A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, then the blind via may have any cross-sectional shape, such as circular or non-circular, a rectangular channel, or a combination thereof.

    摘要翻译： 用于形成金属化盲孔的方法和结构。 在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。 如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。 电介质层包括具有碳基聚合物材料的介电材料，例如永久性光致抗蚀剂，聚酰亚胺和先进的焊接掩模（ASM）。 金属层包括金属材料，例如铜，铝和金。 碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。 激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。 凹陷可以具有任何横截面形状和深度的任何空间分布。 作为示例，凹陷可以包括盲孔，则盲孔可以具有任何横截面形状，例如圆形或非圆形，矩形通道或其组合。