公开(公告)号：US5872337A

公开(公告)日：1999-02-16

申请号：US711240

申请日：1996-09-09

申请人： Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Charles Robert Davis ,  David Lee Questad ,  Darbha Suryanarayana ,  Jeffrey Alan Zimmerman

发明人： Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Charles Robert Davis ,  David Lee Questad ,  Darbha Suryanarayana ,  Jeffrey Alan Zimmerman

IPC分类号： H01L23/538 ,  H05K1/00 ,  H05K3/00

CPC分类号： H05K1/0281 ,  H01L23/5387 ,  H05K3/4691 ,  H01L2924/0002 ,  H05K2201/09109 ,  H05K2201/2009

摘要： Reinforcement members are disposed along only the transverse edge regions of selected flexible cables of an integral chip carrier and cable assembly, and along only the respectively aligned end areas of the chip carrier portion of the assembly. The reinforcement members may be disposed along all of the flexible cables and end areas of the assembly, or on only selected cable and end area portions of the assembly. The reinforcement members are formed of a tough tear resistant polymer material, such as a hot melt adhesive or polymer tape or film.

摘要翻译： 加强构件仅沿着整体芯片载体和电缆组件的选定柔性电缆的横向边缘区域布置，并且仅沿着组件的芯片承载部分的相应对准的端部区域布置。 加强构件可以沿着组件的所有柔性电缆和端部区域，或仅在组件的所选择的电缆和端部区域部分设置。 加强构件由坚韧的抗撕裂聚合物材料形成，例如热熔粘合剂或聚合物带或膜。

公开(公告)号：US06503821B2

公开(公告)日：2003-01-07

申请号：US10006229

申请日：2001-12-10

申请人： Donald Seton Farquhar ,  Lisa Jeanine Jimarez ,  Michael Joseph Klodowski ,  Jeffrey Alan Zimmerman

发明人： Donald Seton Farquhar ,  Lisa Jeanine Jimarez ,  Michael Joseph Klodowski ,  Jeffrey Alan Zimmerman

IPC分类号： H01L2144

CPC分类号： H01L25/0655 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.

公开(公告)号：US06329713B1

公开(公告)日：2001-12-11

申请号：US09176654

申请日：1998-10-21

申请人： Donald Seton Farquhar ,  Lisa Jeanine Jimarez ,  Michael Joseph Klodowski ,  Jeffrey Alan Zimmerman

发明人： Donald Seton Farquhar ,  Lisa Jeanine Jimarez ,  Michael Joseph Klodowski ,  Jeffrey Alan Zimmerman

IPC分类号： H01L2308

CPC分类号： H01L25/0655 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.

摘要翻译： 通过将具有至少一个主表面上的导电区域的基板通过接合膜连接到加强件来提供集成电路芯片载体组件。 接合膜包括在其主表面上具有热固性粘合剂的电介质基底。 在粘合之前的热固性粘合剂是B阶粘合剂，在正常室温下是无粘性的并且是无溶剂的。