公开(公告)号：US07459778B2

公开(公告)日：2008-12-02

申请号：US11389722

申请日：2006-03-27

申请人： Dalson Ye Seng Kim ,  Jeffrey Toh Tuck Fook ,  Lee Choon Kuan

发明人： Dalson Ye Seng Kim ,  Jeffrey Toh Tuck Fook ,  Lee Choon Kuan

IPC分类号： H01L23/52

CPC分类号： H01L23/495 ,  B33Y70/00 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A leadframe for semiconductor components includes leadfingers, interconnect bonding sites for wire bonding to a semiconductor die, terminal bonding sites for terminal contacts for the component in an area array, and bus bars which electrically connect selected leadfingers to one another. The interconnect bonding sites are located on the leadframe relative to the bus bars such that shorting to the bus bars by wire interconnects is eliminated.

摘要翻译： 用于半导体部件的引线框架包括引线引线，用于引线键合到半导体管芯的互连结合位置，用于区域阵列中的部件的端子触点的端子接合位置以及将所选择的引线彼此电连接的母线。 互连结合位置相对于母线位于引线框架上，从而消除了通过线互连对母线的短路。

公开(公告)号：US06740983B2

公开(公告)日：2004-05-25

申请号：US10231731

申请日：2002-08-28

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

摘要翻译： 可堆叠的球栅阵列（BGA）或细球栅阵列（FBGA）半导体封装，特别适用于需要低剖面BGA或FBGA半导体封装的板上芯片或片上电路板应用。 可堆叠球栅阵列（BGA）或细球栅阵列（FBGA）提供了一种半导体封装，能够以比现有已知的BGA或FBGA半导体封装更有效和成本有效的方式进行烧录和测试。 进一步公开了以堆叠方式结合多个公开的BGA或FBGA半导体封装的高密度，低轮廓的存储器模块。

公开(公告)号：US06674175B2

公开(公告)日：2004-01-06

申请号：US10231729

申请日：2002-08-28

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

公开(公告)号：US06847220B2

公开(公告)日：2005-01-25

申请号：US10629666

申请日：2003-07-29

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： G01R1/04 ,  H01L23/31 ,  H01L25/10 ,  H05K1/18 ,  G01R31/02

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

摘要翻译： 可堆叠的球栅阵列（BGA）或细球栅阵列（FBGA）半导体封装，特别适用于需要低剖面BGA或FBGA半导体封装的板上芯片或片上电路板应用。 可堆叠球栅阵列（BGA）或细球栅阵列（FBGA）提供了一种半导体封装，能够以比现有已知的BGA或FBGA半导体封装更有效和成本有效的方式进行烧录和测试。 进一步公开了以堆叠方式结合多个公开的BGA或FBGA半导体封装的高密度，低轮廓的存储器模块。

公开(公告)号：US06693363B2

公开(公告)日：2004-02-17

申请号：US10136123

申请日：2002-05-01

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

摘要翻译： 可堆叠的球栅阵列（BGA）或细球栅阵列（FBGA）半导体封装，特别适用于需要低剖面BGA或FBGA半导体封装的板上芯片或片上电路板应用。 可堆叠球栅阵列（BGA）或细球栅阵列（FBGA）提供了一种半导体封装，能够以比现有已知的BGA或FBGA半导体封装更有效和成本有效的方式进行烧录和测试。 进一步公开了以堆叠方式结合多个公开的BGA或FBGA半导体封装的高密度，低轮廓的存储器模块。

公开(公告)号：US06522019B2

公开(公告)日：2003-02-18

申请号：US10152246

申请日：2002-05-21

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

公开(公告)号：US06448664B1

公开(公告)日：2002-09-10

申请号：US10011196

申请日：2001-11-13

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned in and tested in a more efficient and cost effective manner than prior known BGA or FBGA semiconductor packages. A high density, low profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

公开(公告)号：US06903449B2

公开(公告)日：2005-06-07

申请号：US10633434

申请日：2003-08-01

申请人： Dalson Ye Seng Kim ,  Jeffrey Toh Tuck Fook ,  Lee Choon Kuan

发明人： Dalson Ye Seng Kim ,  Jeffrey Toh Tuck Fook ,  Lee Choon Kuan

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L23/495 ,  B33Y70/00 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A semiconductor component includes a chip on board leadframe, a semiconductor die back bonded and wire bonded to the leadframe, an encapsulant on the die and an area array of terminal contacts on the leadframe. The leadframe includes leadfingers, interconnect bonding sites for wire bonding the die, terminal bonding sites for the terminal contacts, and bus bars which electrically connect selected leadfingers to one another. The interconnect bonding sites are located on the leadframe relative to the bus bars such that shorting to the bus bars by wire interconnects is eliminated. A method for fabricating the component includes the steps of attaching the die to the leadframe, bonding the wire interconnects to the die and to the interconnect bonding sites, forming the encapsulant, and then forming the terminal contacts on the terminal bonding sites.

摘要翻译： 半导体部件包括：芯片上的引线框架，半导体管芯接合和引线接合引线框架，芯片上的密封剂和引线框架上的端子触点的区域阵列。 引线框架包括引线端子，用于引线接合管芯的互连结合部位，用于端子触头的端子接合部位和将所选择的引线彼此电连接的母线。 互连结合位置相对于母线位于引线框架上，从而消除了通过线互连对母线的短路。 一种用于制造该部件的方法包括以下步骤：将裸片连接到引线框架，将导线互连件连接到管芯和互连接合部位，形成密封剂，然后在端子接合位置形成端子触点。

公开(公告)号：US07049173B2

公开(公告)日：2006-05-23

申请号：US10797807

申请日：2004-03-10

申请人： Dalson Ye Seng Kim ,  Jeffrey Toh Tuck Fook ,  Lee Choon Kuan

发明人： Dalson Ye Seng Kim ,  Jeffrey Toh Tuck Fook ,  Lee Choon Kuan

IPC分类号： H01L21/44

CPC分类号： H01L23/495 ,  B33Y70/00 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A semiconductor component includes a chip on board leadframe, a semiconductor die back bonded and wire bonded to the leadframe, an encapsulant on the die and an area array of terminal contacts on the leadframe. The leadframe includes leadfingers, interconnect bonding sites for wire bonding the die, terminal bonding sites for the terminal contacts, and bus bars which electrically connect selected leadfingers to one another. The interconnect bonding sites are located on the leadframe relative to the bus bars such that shorting to the bus bars by wire interconnects is eliminated. A method for fabricating the component includes the steps of attaching the die to the leadframe, bonding the wire interconnects to the die and to the interconnect bonding sites, forming the encapsulant, and then forming the terminal contacts on the terminal bonding sites.

摘要翻译： 半导体部件包括：芯片上的引线框架，半导体管芯接合和引线接合引线框架，芯片上的密封剂和引线框架上的端子触点的区域阵列。 引线框架包括引线端子，用于引线接合管芯的互连结合部位，用于端子触头的端子接合部位和将所选择的引线彼此电连接的母线。 互连结合位置相对于母线位于引线框架上，从而消除了通过线互连对母线的短路。 一种用于制造该部件的方法包括以下步骤：将裸片连接到引线框架，将导线互连件连接到管芯和互连接合部位，形成密封剂，然后在端子接合位置形成端子触点。

公开(公告)号：US06600335B2

公开(公告)日：2003-07-29

申请号：US10008843

申请日：2001-11-13

申请人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

发明人： Wuu Yean Tay ,  Jeffrey Toh Tuck Fook

IPC分类号： G01R3126

CPC分类号： H01L23/3114 ,  G01R1/0408 ,  G01R1/0483 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned in and tested in a more efficient and cost effective manner than prior known BGA or FBGA semiconductor packages. A high density, low profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

摘要翻译： 可堆叠球栅阵列（BGA）或细球栅阵列（FBGA）半导体封装，特别适用于需要低剖面BGA或FBGA半导体封装的板上芯片或片上电路板应用。 可堆叠球栅阵列（BGA）或细球栅阵列（FBGA）提供了能够以比现有已知的BGA或FBGA半导体封装更有效和成本有效的方式燃烧和测试的半导体封装。 进一步公开了以堆叠方式并入多个所公开的BGA或FBGA半导体封装的高密度，低轮廓的存储器模块。